Fault modelling and accelerated simulation of integrated circuits manufacturing defects under process variation

As silicon manufacturing process scales to and beyond the 65-nm node, process variation can no longer be ignored. The impact of process variation on integrated circuit performance and power has received significant research input. Variation-aware test, on the other hand, is a relatively new research area that is currently receiving attention worldwide.Research has shown that test without considering process variation may lead to loss of test quality. Fault modelling and simulation serve as a backbone of manufacturing test. This thesis is concerned with developing efficient fault modelling techniques and simulation methodologies that take into account the effect of process variation on manufacturing defects with particular emphasis on resistive bridges and resistive opens.The first contribution of this thesis addresses the problem of long computation time required to generate logic fault of resistive bridges under process variation by developing a fast and accurate modelling technique to model logic fault behaviour of resistive bridges.The new technique is implemented by employing two efficient voltage calculation algorithms to calculate the logic threshold voltage of driven gates and critical resistance of a fault-site to enable the computation of bridge logic faults without using SPICE. Simulation results show that the technique is fast (on average 53 times faster) and accurate (worst case is 2.64% error) when compared with HSPICE. The second contribution analyses the complexity of delay fault simulation of resistive bridges to reduce the computation time of delay fault when considering process variation. An accelerated delay fault simulation methodology of resistive bridges is developed by employing a three-step strategy to speed up the calculation of transient gate output voltage which is needed to accurately compute delay faults. Simulation results show that the methodology is on average 17.4 times faster, with 5.2% error in accuracy, when compared with HSPICE. The final contribution presents an accelerated simulation methodology of resistive opens to address the problem of long simulation time of delay fault when considering process variation. The methodology is implemented by using two efficient algorithms to accelerate the computation of transient gate output voltage and timing critical resistance of an open fault-site. Simulation results show that the methodology is on average up to 52 times faster than HSPICE, with 4.2% error in accuracy

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects

Simulation of ultrasonic lamb wave generation, propagation and detection for an air coupled robotic scanner

A computer simulator, to facilitate the design and assessment of a reconfigurable, air-coupled ultrasonic scanner is described and evaluated. The specific scanning system comprises a team of remote sensing agents, in the form of miniature robotic platforms that can reposition non-contact Lamb wave transducers over a plate type of structure, for the purpose of non-destructive evaluation (NDE). The overall objective is to implement reconfigurable array scanning, where transmission and reception are facilitated by different sensing agents which can be organised in a variety of pulse-echo and pitch-catch configurations, with guided waves used to generate data in the form of 2-D and 3-D images. The ability to reconfigure the scanner adaptively requires an understanding of the ultrasonic wave generation, its propagation and interaction with potential defects and boundaries. Transducer behaviour has been simulated using a linear systems approximation, with wave propagation in the structure modelled using the local interaction simulation approach (LISA). Integration of the linear systems and LISA approaches are validated for use in Lamb wave scanning by comparison with both analytic techniques and more computationally intensive commercial finite element/difference codes. Starting with fundamental dispersion data, the paper goes on to describe the simulation of wave propagation and the subsequent interaction with artificial defects and plate boundaries, before presenting a theoretical image obtained from a team of sensing agents based on the current generation of sensors and instrumentation

In-Situ Defect Detection in Laser Powder Bed Fusion by Using Thermography and Optical Tomography—Comparison to Computed Tomography

Among additive manufacturing (AM) technologies, the laser powder bed fusion (L-PBF) is one of the most important technologies to produce metallic components. The layer-wise build-up of components and the complex process conditions increase the probability of the occurrence of defects. However, due to the iterative nature of its manufacturing process and in contrast to conventional manufacturing technologies such as casting, L-PBF offers unique opportunities for in-situ monitoring. In this study, two cameras were successfully tested simultaneously as a machine manufacturer independent process monitoring setup: a high-frequency infrared camera and a camera for long time exposure, working in the visible and infrared spectrum and equipped with a near infrared filter. An AISI 316L stainless steel specimen with integrated artificial defects has been monitored during the build. The acquired camera data was compared to data obtained by computed tomography. A promising and easy to use examination method for data analysis was developed and correlations between measured signals and defects were identified. Moreover, sources of possible data misinterpretation were specified. Lastly, attempts for automatic data analysis by data integration are presented

Emerging technologies for the non-invasive characterization of physical-mechanical properties of tablets

The density, porosity, breaking force, viscoelastic properties, and the presence or absence of any structural defects or irregularities are important physical-mechanical quality attributes of popular solid dosage forms like tablets. The irregularities associated with these attributes may influence the drug product functionality. Thus, an accurate and efficient characterization of these properties is critical for successful development and manufacturing of a robust tablets. These properties are mainly analyzed and monitored with traditional pharmacopeial and non-pharmacopeial methods. Such methods are associated with several challenges such as lack of spatial resolution, efficiency, or sample-sparing attributes. Recent advances in technology, design, instrumentation, and software have led to the emergence of newer techniques for non-invasive characterization of physical-mechanical properties of tablets. These techniques include near infrared spectroscopy, Raman spectroscopy, X-ray microtomography, nuclear magnetic resonance (NMR) imaging, terahertz pulsed imaging, laser-induced breakdown spectroscopy, and various acoustic- and thermal-based techniques. Such state-of-the-art techniques are currently applied at various stages of development and manufacturing of tablets at industrial scale. Each technique has specific advantages or challenges with respect to operational efficiency and cost, compared to traditional analytical methods. Currently, most of these techniques are used as secondary analytical tools to support the traditional methods in characterizing or monitoring tablet quality attributes. Therefore, further development in the instrumentation and software, and studies on the applications are necessary for their adoption in routine analysis and monitoring of tablet physical-mechanical properties

Self-coherent camera as a focal plane wavefront sensor: simulations

Direct detection of exoplanets requires high dynamic range imaging. Coronagraphs could be the solution, but their performance in space is limited by wavefront errors (manufacturing errors on optics, temperature variations, etc.), which create quasi-static stellar speckles in the final image. Several solutions have been suggested for tackling this speckle noise. Differential imaging techniques substract a reference image to the coronagraphic residue in a post-processing imaging. Other techniques attempt to actively correct wavefront errors using a deformable mirror. In that case, wavefront aberrations have to be measured in the science image to extremely high accuracy. We propose the self-coherent camera sequentially used as a focal-plane wavefront sensor for active correction and differential imaging. For both uses, stellar speckles are spatially encoded in the science image so that differential aberrations are strongly minimized. The encoding is based on the principle of light incoherence between the hosting star and its environment. In this paper, we first discuss one intrinsic limitation of deformable mirrors. Then, several parameters of the self-coherent camera are studied in detail. We also propose an easy and robust design to associate the self-coherent camera with a coronagraph that uses a Lyot stop. Finally, we discuss the case of the association with a four-quadrant phase mask and numerically demonstrate that such a device enables the detection of Earth-like planets under realistic conditions. The parametric study of the technique lets us believe it can be implemented quite easily in future instruments dedicated to direct imaging of exoplanets.Comment: 15 pages, 14 figures, accepted in A&A (here is the final version