Modeling and Optimization of the Microwave PCB Interconnects Using Macromodel Techniques

L'abstract è presente nell'allegato / the abstract is in the attachmen

Workshop on Fuzzy Control Systems and Space Station Applications

The Workshop on Fuzzy Control Systems and Space Station Applications was held on 14-15 Nov. 1990. The workshop was co-sponsored by McDonnell Douglas Space Systems Company and NASA Ames Research Center. Proceedings of the workshop are presented

Advances and Applications of Dezert-Smarandache Theory (DSmT) for Information Fusion (Collected Works), Vol. 4

The fourth volume on Advances and Applications of Dezert-Smarandache Theory (DSmT) for information fusion collects theoretical and applied contributions of researchers working in different fields of applications and in mathematics. The contributions (see List of Articles published in this book, at the end of the volume) have been published or presented after disseminating the third volume (2009, http://fs.unm.edu/DSmT-book3.pdf) in international conferences, seminars, workshops and journals. First Part of this book presents the theoretical advancement of DSmT, dealing with Belief functions, conditioning and deconditioning, Analytic Hierarchy Process, Decision Making, Multi-Criteria, evidence theory, combination rule, evidence distance, conflicting belief, sources of evidences with different importance and reliabilities, importance of sources, pignistic probability transformation, Qualitative reasoning under uncertainty, Imprecise belief structures, 2-Tuple linguistic label, Electre Tri Method, hierarchical proportional redistribution, basic belief assignment, subjective probability measure, Smarandache codification, neutrosophic logic, Evidence theory, outranking methods, Dempster-Shafer Theory, Bayes fusion rule, frequentist probability, mean square error, controlling factor, optimal assignment solution, data association, Transferable Belief Model, and others. More applications of DSmT have emerged in the past years since the apparition of the third book of DSmT 2009. Subsequently, the second part of this volume is about applications of DSmT in correlation with Electronic Support Measures, belief function, sensor networks, Ground Moving Target and Multiple target tracking, Vehicle-Born Improvised Explosive Device, Belief Interacting Multiple Model filter, seismic and acoustic sensor, Support Vector Machines, Alarm classification, ability of human visual system, Uncertainty Representation and Reasoning Evaluation Framework, Threat Assessment, Handwritten Signature Verification, Automatic Aircraft Recognition, Dynamic Data-Driven Application System, adjustment of secure communication trust analysis, and so on. Finally, the third part presents a List of References related with DSmT published or presented along the years since its inception in 2004, chronologically ordered

NASA Tech Briefs, Winter 1983

Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences

Interconnect Aging—Physics to Software

Device reliability or lifetime is often non-negotiable and crucial for sensitive applications such as medical devices, autonomous vehicles and space crafts. Inevitable technology advancement (e.g. miniaturization) has added unwelcome complications and unpredictability to the aging problem. Reliability of VLSI chips is jeopardized by mass transport in metallic interconnects. Material migration is caused by electrical, mechanical and thermal phenomena, and, therefore, is a complicated process. While all aspects of material migration have been studied, a comprehensive investigation that can explain and include all those phenomena simultaneously remains unsolved. Inaccuracies in modeling and predicting aging processes in wires cause that chipmakers often overdesign interconnects. This is an undesirable and expensive approach in terms of time and cost. In modern technologies, the predicted lifetime, aging, and failure mechanisms in interconnect very often do not match the observed behaviors. Unrealistic models used in CAD tools are the main culprit of such incompatibilities. In general, two situations may occur: (1) in some cases, the models may wrongly scrutinize reliability in unfailing parts and consequently impose unnecessary design tightening and (2) in some other cases, the models may underestimate serious reliability problems causing unpredicted behaviors or catastrophic failures to occur. The existing models for reliability evaluation are usually pessimistic in case of interconnect voiding and optimistic when extrusions occur. Time-consuming and not converging reliability assessments, as well as undesired chip behaviors, are the common expensive outcome of such models.We revisit the underlying physics of aging processes in dual-damascene copper lines. We demonstrate, that the simplistic modeling is the cause of the incompatibility of the existing models. We study all three main aging processes: electromigration, thermo-migration, and stress migration and offer several comprehensive yet compact models for realistic assessment of interconnect aging. These models explain many observations that have been inexplicable for decades. Ultimately, a computer-aided design tool, RAIN, is developed based on the proposed models and is capable of assessing the reliability of industry standard complex multi-layer, multi-segment interconnect networks. This tool can be readily integrated into other verification signoffs phases such as performance, timing, and power analyses. RAIN takes as inputs: (1) interconnect design, (2) technology specifications, (3) initial stress and temperature, (4) IR drop and lifetime requirements. It analyzes and assesses reliability and delivery requirements of all nets, and provides a report on voltage limitations, thermal violations and expected lifetime. It is validated on a wide spectrum of experimental results performed on various industry benchmarks

The Fifth NASA Symposium on VLSI Design

The fifth annual NASA Symposium on VLSI Design had 13 sessions including Radiation Effects, Architectures, Mixed Signal, Design Techniques, Fault Testing, Synthesis, Signal Processing, and other Featured Presentations. The symposium provides insights into developments in VLSI and digital systems which can be used to increase data systems performance. The presentations share insights into next generation advances that will serve as a basis for future VLSI design

Fuzzy Logic

The capability of Fuzzy Logic in the development of emerging technologies is introduced in this book. The book consists of sixteen chapters showing various applications in the field of Bioinformatics, Health, Security, Communications, Transportations, Financial Management, Energy and Environment Systems. This book is a major reference source for all those concerned with applied intelligent systems. The intended readers are researchers, engineers, medical practitioners, and graduate students interested in fuzzy logic systems