Buried graphene heterostructures for electrostatic doping of low-dimensional materials

The fabrication and characterization of steep slope transistor devices based on low-dimensional materials requires precise electrostatic doping profiles with steep spatial gradients in order to maintain maximum control over the channel. In this proof-of-concept study we present a versatile graphene heterostructure platform with three buried individually addressable gate electrodes. The platform is based on a vertical stack of embedded titanium and graphene separated by an intermediate oxide to provide an almost planar surface. We demonstrate the functionality and advantages of the platform by exploring transfer and output characteristics at different temperatures of carbon nanotube field-effect transistors with different electrostatic doping configurations. Furthermore, we back up the concept with finite element simulations to investigate the surface potential. The presented heterostructure is an ideal platform for analysis of electrostatic doping of low-dimensional materials for novel low-power transistor devices

Vertical III-V Nanowire Transistors for Low-Power Logic and Reconfigurable Applications

With rapid increase in energy consumption of electronics used in our daily life, the building blocks — transistors — need to work in a way that has high energy efficiency and functional density to meet the demand of further scaling. III-V channel combined with vertical nanowire gate-all-around (GAA) device architecture is a promising alternative to conventional Si transistors due to its excellent electrical properties in the channel and electrostatic control across the gate oxide in addition to reduced footprint. Based on this platform, two major objectives of this thesis are included: 1) to improve the performance of III-V p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) and tunnel FETs (TFETs) for low-power digital applications; 2) to integrate HfO2-based ferroelectric gate onto III-V FETs (FeFETs) and TFETs (ferro-TFETs) to enable reconfigurable operation for high functional density.The key bottleneck for all-III-V CMOS is its p-type MOSFETs (p-FETs) which are mainly made of GaSb or InGaSb. Rich surface states of III-Sb materials not only lead to decreased effective channel mobility due to more scattering, but also deteriorate the electrostatics. In this thesis, several approaches to improve p-FET performance have been explored. One strategy is to enhance the hole mobility by introducing compressive strain into III-Sb channel. For the first time, a high and uniform compressive strain near 1% along the transport direction has been achieved in downscaled GaSb nanowires by growing and engineering GaSb-GaAsSb core-shell structure, aiming for potential hole mobility enhancement. In addition, surface passivation using digital etch has been developed to improve the electrostatics with subthreshold swing (SS) down to 107 mV/dec. Moreover, the on-state performance including on-current (Ion) and transconductance (gm) have been enhanced by ∼50% using annealing with H2-based forming gas. Lastly, a novel p-FET structure with (In)GaAsSb channel has been developed and further improved off-state performance with SS = 71 mV/dec, which is the lowest value among all reported III-V p-FETs.Despite subthermionic operation, TFETs usually suffer from low drive current as well as the current operating below 60 mV/dec (I60). The second focus of this thesis is to fine-tune the InAs/(In)GaAsSb heterostructure tunnel junction and the doping in the source segment during epitaxy. As a result, a substantially increased I60 (>1 µA/µm) and Ion up to 40 µA/µm at source-drain bias of 0.5 V have been achieved, reaching a record compared to other reported TFETs.Finally, emerging ferroelectric oxide based on Zr-doped HfO2 (HZO) has been successfully integrated onto III-V vertical nanowire transistors to form FeFETs and ferro-TFETs with GAA architecture. The corresponding electrical performance and reliability have been carefully characterized with both DC and pulsed I-V measurements. The unique band-to-band tunneling in InAs/(In)GaAsSb/GaSb heterostructure TFET creates an ultrashort effective channel, leading to detection of localized potential variation induced by single domains and defects in nanoscale ferroelectric HZO without physical gate-length scaling. By introducing gate/source overlap structure in the ferro-TFET, non-volatile reconfigurable signal modulation with multiple modes including signal transmission, phase shift, frequency doubling, and mixing has been achieved in a single device with low drive voltage and only ∼0.01 µm2 footprint, thus increasing both functional density andenergy efficiency

3次元型トランジスタを用いたLSIの設計法

Design technology of LSI such as system LSI ana memory using 3 dimensional transistors has been described. By using 3 dimensional transistors, FinFET, double gate transistor and stacked double gate transistor, pattern area of logic gate and full adder circuit can be reduced drastically compared with that with conventional planar transistor. By using double gate transistor and Carbon Nano Tube transistor the reconfigurable circuit with many logic functions can be realized with small pattern area. Furthermore, staked NAND MRAM with 3 dimensional spin transistor has been newly proposed. This stacked NAND MRAM is a promising candidate which replaces currently available DRAM and NAND flash memory.Design technology of LSI such as system LSI ana memory using 3 dimensional transistors has been described. By using 3 dimensional transistors, FinFET, double gate transistor and stacked double gate transistor, pattern area of logic gate and full adder circuit can be reduced drastically compared with that with conventional planar transistor. By using double gate transistor and Carbon Nano Tube transistor the reconfigurable circuit with many logic functions can be realized with small pattern area. Furthermore, staked NAND MRAM with 3 dimensional spin transistor has been newly proposed. This stacked NAND MRAM is a promising candidate which replaces currently available DRAM and NAND flash memory

Challenges and Opportunities in Implementing Negative Differential Resistance Mode Reconfigurable Field Effect Transistors

Desirably, the world relies on the devices being compact, as they could drive to the increased functionality of integrated circuits at the provided footstep, that is becoming more reliable. To reduce the scalability over the devices, approach has been outlined utilizing the NDR mode reconfigurable functionality over the transistors. Being an individual device efficient in exhibiting different task with the different configurations in the same physical circuitry. On the view of reconfigurable transistors, possibly authorize the reconfiguration from a p-type to n-type channel transistor has been expelled as an emerging application such as static memory cells, fast switching logic circuits as well as energy efficient computational multi valued logic. This article emphasizes NDR mode RFET along with its classification, followed by enhancing the RFET technology concepts and RFETs future potential has been discussed briefing with the growing applications like hardware security as well as neuro-inspired computing.Comment: 28 pages, 9 figure

Integration of Ferroelectric HfxZr1-xO2 on Vertical III-V Nanowire Gate-All-Around FETs on Silicon

We demonstrate a successful process scheme for the integration of a CMOS-compatible ferroelectric gate stack on a scaled vertical InAs nanowire gate-all-around MOSFET on silicon. The devices show promising device characteristics with nanosecond write time and large memory window of >1.5 V. In the current implementation, the device performance is mainly limited by access resistance, which is attributed to the thermal sensitivity of InAs. The findings indicate that the ferroelectricity is not intrinsically preventing future improvements of scaled III-V FeFETs