Correlative Framework of Techniques for the Inspection, Evaluation, and Design of Micro-electronic Devices

Trillions of micro- and nano-electronic devices are manufactured every year. They service countless electronic systems across a diverse range of applications ranging from civilian, military, and medical sectors. Examples of these devices include: packaged and board-mounted semiconductor devices such as ceramic capacitors, CPUs, GPUs, DSPs, etc., biomedical implantable electrochemical devices such as pacemakers, defibrillators, and neural stimulators, electromechanical sensors such as MEMS/NEMS accelerometers and positioning systems and many others. Though a diverse collection of devices, they are unified by their length scale. Particularly, with respect to the ever-present objectives of device miniaturization and performance improvement. Pressures to meet these objectives have left significant room for the development of widely applicable inspection and evaluation techniques to accurately and reliably probe new and failed devices on an ever-shrinking length scale. Presented in this study is a framework of correlative, cross-modality microscopy workflows coupled with novel in-situ experimentation and testing, and computational reverse engineering and modeling methods, aimed at addressing the current and future challenges of evaluating micro- and nano-electronic devices. The current challenges are presented through a unique series of micro- and nano-electronic devices from a wide range of applications with ties to industrial relevance. Solutions were reached for the challenges and through the development of these workflows, they were successfully expanded to areas outside the immediate area of the original project. Limitations on techniques and capabilities were noted to contextualize the applicability of these workflows to other current and future challenges

The Public Service Media and Public Service Internet Manifesto

This book presents the collectively authored Public Service Media and Public Service Internet Manifesto and accompanying materials.The Internet and the media landscape are broken. The dominant commercial Internet platforms endanger democracy. They have created a communications landscape overwhelmed by surveillance, advertising, fake news, hate speech, conspiracy theories, and algorithmic politics. Commercial Internet platforms have harmed citizens, users, everyday life, and society. Democracy and digital democracy require Public Service Media. A democracy-enhancing Internet requires Public Service Media becoming Public Service Internet platforms – an Internet of the public, by the public, and for the public; an Internet that advances instead of threatens democracy and the public sphere. The Public Service Internet is based on Internet platforms operated by a variety of Public Service Media, taking the public service remit into the digital age. The Public Service Internet provides opportunities for public debate, participation, and the advancement of social cohesion. Accompanying the Manifesto are materials that informed its creation: Christian Fuchs’ report of the results of the Public Service Media/Internet Survey, the written version of Graham Murdock’s online talk on public service media today, and a summary of an ecomitee.com discussion of the Manifesto’s foundations

Advances in structural analysis and process monitoring of thermoplastic composite pipes.

Thermoplastic composite pipes (TCP) in comparison to other pipes have proven beneficial features due to its flexibility which includes being fit for purpose, lightweight and no corrosion. However, during the manufacturing of TCP which involves the consolidation process, certain defects may be induced in it because of certain parameters, and this can affect the performance of the pipe in the long run as the induced defects might lead to in-service defects. Current techniques used in the industry are facing challenges with on-the-spot detection in a continuous manufacturing system. In TCP manufacturing process, the pipe is regularly monitored. When a defect is noticed, the whole process stops, and the appropriate action is taken. However, shutting down the process is costly; hence it is vital to decrease the downtime during manufacturing to the barest minimum. The solutions include optimizing the process for reduction in the manufacturing defects amount and thoroughly understanding the effect of parameters which causes certain defect types in the pipe. This review covers the current state-of-the-art and challenges associated with characterizing the identified manufacturing induced defects in TCP. It discusses and describes all effective consolidation monitoring strategy for early detection of these defects during manufacturing through the application of suitable sensing technology that is compatible with the TCP. It can be deduced that there is a correlation between manufacturing process to the performance of the final part and selection of characterization technique as well as optimizing process parameters