Electronic packaging - A bibliography

Annotated bibliography of literature on electronic packaging for use in designing electronic equipmen

NASA Tech Briefs Index, 1977, volume 2, numbers 1-4

Announcements of new technology derived from the research and development activities of NASA are presented. Abstracts, and indexes for subject, personal author, originating center, and Tech Brief number are presented for 1977

Nonterrestrial utilization of materials: Automated space manufacturing facility

Four areas related to the nonterrestrial use of materials are included: (1) material resources needed for feedstock in an orbital manufacturing facility, (2) required initial components of a nonterrestrial manufacturing facility, (3) growth and productive capability of such a facility, and (4) automation and robotics requirements of the facility

Design and construction of a distributed sensor NET for biotelemetric monitoring of brain energetic metabolism using microsensors and biosensors

Neurochemical pathways involved in brain physiology or disease pathogenesis are mostly unknown either in physiological conditions or in neurodegenerative diseases. Nowadays the most frequent usage for biotelemetry is in medicine, in cardiac care units or step-down units in hospitals, even if virtually any physiological signal could be transmitted (FCC, 2000; Leuher, 1983; Zhou et al., 2002). In this chapter we present a wireless device connected with microsensors and biosensors capable to detect real-time variations in concentrations of important compounds present in central nervous system (CNS) and implicated in brain energetic metabolism (Bazzu et al., 2009; Calia et al., 2009)

Advancement in Soldering Technology Main Issues and Its Perspectives - Part 1

The advancement of electronics and related instrumentation would be possible in mass production of electrical and electronics components/equipments with accomplishment and advances in soldering technology. With the advent of different components like resistors, capacitors, diodes, transistors and especially integrated circuits have changed the electronics world completely. As there is an intensive demand for package miniaturization and the density of surface mount components and other interconnects continues to advance, the technology for solder attachment methods must also improve and continue to evolve. This paper discusses the evolvement of soldering techniques, its applications and the criteria to select proper soldering techniques for specific applications

Beam lead technology

Beam lead technology for microcircuit interconnections with applications to metallization, passivation, and bondin

Phase 1 of the automated array assembly task of the low cost silicon solar array project

The state of technology readiness for the automated production of solar cells and modules is reviewed. Individual process steps and process sequences for making solar cells and modules were evaluated both technically and economically. High efficiency with a suggested cell goal of 15% was stressed. It is concluded that the technology exists to manufacture solar cells which will meet program goals