3,531 research outputs found

    Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

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    In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

    Phased Array Systems in Silicon

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    Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz

    PhyNetLab: An IoT-Based Warehouse Testbed

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    Future warehouses will be made of modular embedded entities with communication ability and energy aware operation attached to the traditional materials handling and warehousing objects. This advancement is mainly to fulfill the flexibility and scalability needs of the emerging warehouses. However, it leads to a new layer of complexity during development and evaluation of such systems due to the multidisciplinarity in logistics, embedded systems, and wireless communications. Although each discipline provides theoretical approaches and simulations for these tasks, many issues are often discovered in a real deployment of the full system. In this paper we introduce PhyNetLab as a real scale warehouse testbed made of cyber physical objects (PhyNodes) developed for this type of application. The presented platform provides a possibility to check the industrial requirement of an IoT-based warehouse in addition to the typical wireless sensor networks tests. We describe the hardware and software components of the nodes in addition to the overall structure of the testbed. Finally, we will demonstrate the advantages of the testbed by evaluating the performance of the ETSI compliant radio channel access procedure for an IoT warehouse
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