3 research outputs found
Understanding of On-Chip Power Supply Noise: Suppression Methodologies and Challenges
The on-chip activities of any modern IC are always inhibited due to the occurrence of power supply noise (PSN) in the chip power line. From many decades, researchers are pondering on what are the major issue of this PSN occurrence and how it can be suppressed without interfering the actual chip functioning. In the course of time, it is found that the uncontrolled triggering of the on-chip system clock and the unguarded on-chip power line is instigating the two major factors for the occurrence of PSN i.e., i(t) → instantaneous current and di/dt → current ramp or the rate of change of current over time. Both i(t) and di/dt are also the sub-factors to rise the PSN components like resistive noise and inductive noise respectively. In this chapter, we light upon the occurrence of resistive and inductive noise as well as depict their individual impact on the PSN occurrences. There is also discussion on how PSN is suppressed over the years in spite of facing challenges in the execution of suppression techniques. This chapter even concludes on the suitable ways for mitigating PSN in the contemporary era of delivering complex on-chip features
Physical parameter-aware Networks-on-Chip design
PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable
and power-efficient communication fabric for chip multiprocessors
(CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine
both the performance and the reliability of such systems, with a
significant power demand that is expected to increase due to developments
in both technology and architecture. In terms of architecture, an
important trend in many-core systems architecture is to increase the
number of cores on a chip while reducing their individual complexity.
This trend increases communication power relative to computation
power. Moreover, technology-wise, power-hungry wires are dominating
logic as power consumers as technology scales down. For these
reasons, the design of future very large scale integration (VLSI) systems
is moving from being computation-centric to communication-centric.
On the other hand, chip’s physical parameters integrity, especially
power and thermal integrity, is crucial for reliable VLSI systems. However,
guaranteeing this integrity is becoming increasingly difficult with
the higher scale of integration due to increased power density and operating
frequencies that result in continuously increasing temperature
and voltage drops in the chip. This is a challenge that may prevent
further shrinking of devices. Thus, tackling the challenge of power
and thermal integrity of future many-core systems at only one level
of abstraction, the chip and package design for example, is no longer
sufficient to ensure the integrity of physical parameters. New designtime
and run-time strategies may need to work together at different
levels of abstraction, such as package, application, network, to provide
the required physical parameter integrity for these large systems. This
necessitates strategies that work at the level of the on-chip network
with its rising power budget.
This thesis proposes models, techniques and architectures to improve
power and thermal integrity of Network-on-Chip (NoC)-based
many-core systems. The thesis is composed of two major parts: i)
minimization and modelling of power supply variations to improve
power integrity; and ii) dynamic thermal adaptation to improve thermal
integrity. This thesis makes four major contributions. The first is
a computational model of on-chip power supply variations in NoCs.
The proposed model embeds a power delivery model, an NoC activity
simulator and a power model. The model is verified with SPICE simulation
and employed to analyse power supply variations in synthetic
and real NoC workloads. Novel observations regarding power supply
noise correlation with different traffic patterns and routing algorithms
are found. The second is a new application mapping strategy aiming
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to minimize power supply noise in NoCs. This is achieved by defining
a new metric, switching activity density, and employing a force-based
objective function that results in minimizing switching density. Significant
reductions in power supply noise (PSN) are achieved with a low
energy penalty. This reduction in PSN also results in a better link timing
accuracy. The third contribution is a new dynamic thermal-adaptive
routing strategy to effectively diffuse heat from the NoC-based threedimensional
(3D) CMPs, using a dynamic programming (DP)-based distributed
control architecture. Moreover, a new approach for efficient extension
of two-dimensional (2D) partially-adaptive routing algorithms
to 3D is presented. This approach improves three-dimensional networkon-
chip (3D NoC) routing adaptivity while ensuring deadlock-freeness.
Finally, the proposed thermal-adaptive routing is implemented in
field-programmable gate array (FPGA), and implementation challenges,
for both thermal sensing and the dynamic control architecture are addressed.
The proposed routing implementation is evaluated in terms
of both functionality and performance.
The methodologies and architectures proposed in this thesis open a
new direction for improving the power and thermal integrity of future
NoC-based 2D and 3D many-core architectures
Recent Trends in Communication Networks
In recent years there has been many developments in communication technology. This has greatly enhanced the computing power of small handheld resource-constrained mobile devices. Different generations of communication technology have evolved. This had led to new research for communication of large volumes of data in different transmission media and the design of different communication protocols. Another direction of research concerns the secure and error-free communication between the sender and receiver despite the risk of the presence of an eavesdropper. For the communication requirement of a huge amount of multimedia streaming data, a lot of research has been carried out in the design of proper overlay networks. The book addresses new research techniques that have evolved to handle these challenges