Evaluation of temperature-performance trade-offs in wireless network-on-chip architectures

Continued scaling of device geometries according to Moore\u27s Law is enabling complete end-user systems on a single chip. Massive multicore processors are enablers for many information and communication technology (ICT) innovations spanning various domains, including healthcare, defense, and entertainment. In the design of high-performance massive multicore chips, power and heat are dominant constraints. Temperature hotspots witnessed in multicore systems exacerbate the problem of reliability in deep submicron technologies. Hence, there is a great need to explore holistic power and thermal optimization and management strategies for the massive multicore chips. High power consumption not only raises chip temperature and cooling cost, but also decreases chip reliability and performance. Thus, addressing thermal concerns at different stages of the design and operation is critical to the success of future generation systems. The performance of a multicore chip is also influenced by its overall communication infrastructure, which is predominantly a Network-on-Chip (NoC). The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency, significant power consumption, and temperature hotspots arising out of long, multi-hop wireline links used in data exchange. On-chip wireless networks are envisioned as an enabling technology to design low power and high bandwidth massive multicore architectures. However, optimizing wireless NoCs for best performance does not necessarily guarantee a thermally optimal interconnection architecture. The wireless links being highly efficient attract very high traffic densities which in turn results in temperature hotspots. Therefore, while the wireless links result in better performance and energy-efficiency, they can also cause temperature hotspots and undermine the reliability of the system. Consequently, the location and utilization of the wireless links is an important factor in thermal optimization of high performance wireless Networks-on-Chip. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high performance yet energy-efficient massive multicore chips. This work contributes to exploration of various the design methodologies for establishing wireless NoC architectures that achieve the best trade-offs between temperature, performance and energy-efficiency. It further demonstrates that incorporating Dynamic Thermal Management (DTM) on a multicore chip designed with such temperature and performance optimized Wireless Network-on-Chip architectures improves thermal profile while simultaneously providing lower latency and reduced network energy dissipation compared to its conventional counterparts

Dynamic thermal management in chip multiprocessor systems

Recently, processor power density has been increasing at an alarming rate result- ing in high on-chip temperature. Higher temperature increases current leakage and causes poor reliability. In our research, we ¯rst propose a Predictive Dynamic Ther- mal Management (PDTM) based on Application-based Thermal Model (ABTM) and Core-based Thermal Model (CBTM) in the multicore systems. Based on predicted temperature from ABTM and CBTM, the proposed PDTM can maintain the system temperature below a desired level by moving the running application from the possi- ble overheated core to the future coolest core (migration) and reducing the processor resources (priority scheduling) within multicore systems. Furthermore, we present the Thermal Correlative Thermal Management (TCDTM), which incorporates three main components: Statistical Workload Estimation (SWE), Future Temperature Estima- tion Model (FTEM) and Temperature-Aware Thread Controller (TATC), to model the thermal correlation e®ect and distinguish the thermal contributions from appli- cations with di®erent workload behaviors at run time in the CMP systems. The pro- posed PDTM and TCDTM enable the exploration of the tradeo® between throughput and fairness in temperature-constrained multicore systems

Understanding the thermal implications of multicore architectures

Multicore architectures are becoming the main design paradigm for current and future processors. The main reason is that multicore designs provide an effective way of overcoming instruction-level parallelism (ILP) limitations by exploiting thread-level parallelism (TLP). In addition, it is a power and complexity-effective way of taking advantage of the huge number of transistors that can be integrated on a chip. On the other hand, today's higher than ever power densities have made temperature one of the main limitations of microprocessor evolution. Thermal management in multicore architectures is a fairly new area. Some works have addressed dynamic thermal management in bi/quad-core architectures. This work provides insight and explores different alternatives for thermal management in multicore architectures with 16 cores. Schemes employing both energy reduction and activity migration are explored and improvements for thread migration schemes are proposed.Peer ReviewedPostprint (published version

A Survey of Prediction and Classification Techniques in Multicore Processor Systems

In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems

Dynamic Energy Management for Chip Multi-processors under Performance Constraints

We introduce a novel algorithm for dynamic energy management (DEM) under performance constraints in chip multi-processors (CMPs). Using the novel concept of delayed instructions count, performance loss estimations are calculated at the end of each control period for each core. In addition, a Kalman filtering based approach is employed to predict workload in the next control period for which voltage-frequency pairs must be selected. This selection is done with a novel dynamic voltage and frequency scaling (DVFS) algorithm whose objective is to reduce energy consumption but without degrading performance beyond the user set threshold. Using our customized Sniper based CMP system simulation framework, we demonstrate the effectiveness of the proposed algorithm for a variety of benchmarks for 16 core and 64 core network-on-chip based CMP architectures. Simulation results show consistent energy savings across the board. We present our work as an investigation of the tradeoff between the achievable energy reduction via DVFS when predictions are done using the effective Kalman filter for different performance penalty thresholds

Temperature Regulation in Multicore Processors Using Adjustable-Gain Integral Controllers

This paper considers the problem of temperature regulation in multicore processors by dynamic voltage-frequency scaling. We propose a feedback law that is based on an integral controller with adjustable gain, designed for fast tracking convergence in the face of model uncertainties, time-varying plants, and tight computing-timing constraints. Moreover, unlike prior works we consider a nonlinear, time-varying plant model that trades off precision for simple and efficient on-line computations. Cycle-level, full system simulator implementation and evaluation illustrates fast and accurate tracking of given temperature reference values, and compares favorably with fixed-gain controllers.Comment: 8 pages, 6 figures, IEEE Conference on Control Applications 2015, Accepted Versio

The "MIND" Scalable PIM Architecture

MIND (Memory, Intelligence, and Network Device) is an advanced parallel computer architecture for high performance computing and scalable embedded processing. It is a Processor-in-Memory (PIM) architecture integrating both DRAM bit cells and CMOS logic devices on the same silicon die. MIND is multicore with multiple memory/processor nodes on each chip and supports global shared memory across systems of MIND components. MIND is distinguished from other PIM architectures in that it incorporates mechanisms for efficient support of a global parallel execution model based on the semantics of message-driven multithreaded split-transaction processing. MIND is designed to operate either in conjunction with other conventional microprocessors or in standalone arrays of like devices. It also incorporates mechanisms for fault tolerance, real time execution, and active power management. This paper describes the major elements and operational methods of the MIND architecture