5 research outputs found

    Market analysis for optoelectronic transceiver in short range data transmission

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    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.Includes bibliographical references (leaves 56-58).With the increasing demanding of bandwidth in information technology, electronic connections meet the limitation in high speed processing in shorter and shorter reach. In the work, three markets for optical connection with different reach, which range from 10km down to 1 meter, have been discussed. The 10km market denotes for the LAN standard and would mature soon. For the 100m range, active cable has emerged to meet the requirement and would penetrate the market soon. The detail analysis would be addressed on 1-10 meet market, where electronic cables have just met the limitation. Cost modeling and business plan has been conducted. After that, the conclusion and suggestions would be made on that reach.by Jia Luo.M.Eng

    High Performance Computing using Infiniband-based clusters

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    L'abstract è presente nell'allegato / the abstract is in the attachmen

    Analysis of terabit/second-class inter-chip parallel optoelectronic transceiver

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    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010.Cataloged from student submitted PDF version of thesis.Includes bibliographical references (p. 89-92).Electrical copper-based interconnect has been suffering from fundamental physical loss mechanism and its current infrastructure will not be able to meet the increasing demand for data rates due to reaching the limit of the transmission bandwidth-distance product. Optical interconnect has been known as the candidate for taking over the obsolete electrical counterpart owing to the capability of transmitting data at high rates with low loss and the feasibility for parallel integration. Optoelectronic transceiver is one of the essential elements in optical interconnect system. This thesis scrutinizes a complete set of constituent technologies developed for a novel inter-chip parallel optoelectronic (OE) transceiver (known as Terabus transceiver) which is able to communicate data at the speed in the range of Terabit/second. A novel packaging hierarchy and a creative design for an optical coupling mechanism devised to bring high-level integration and high-speed performance to a final package have been analyzed: Two 4x12 arrays (each < 9 mm2) of CMOS transmitter and receiver ICs have been flip-chip bonded to a silicon carrier interposer of 1.2-cm2 size. Other two 4x12 arrays of OE devices (VCSELs and photodiodes) with comparable size are then flip-chip bonded to the corresponding CMOS arrays attached to the silicon carrier, forming the Optochip assembly. The Optochip is in interface with an Optocard by the flip-chip bonding process between the silicon carrier and an organic card patterned with 48 integrated waveguides at density of 16-channel/mm and total length of 30 cm. The 985-nm operating wavelength of the lasers allows a simple optical design with emission and illumination through arrays of relay lenses directly etched into the backside of the OE Ill-V substrate. A novel design of 45*-tilted and Au-coated mirrors fabricated in 125-ptmpitch acrylate waveguides is to perpendicularly couple the light in and out of the core of these Optocard waveguides. Per-channel performance of up to 20 Gb/s for transmitter and of up to 14 Gb/s for receiver have been realized. Lastly, the thesis has analyzed the market opportunity of the transceiver by reviewing the market situation, identifying contemporary competing technologies, assessing the market prospect and predicting the cost.by Nguyen Hoang Nguyen.M.Eng

    Performance Evaluation of InfiniBand with PCI Express

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    In this paper, we present an initial performance evaluation of InfiniBand HCAs from Mellanox with PCI Express interfaces. We compare their performance with HCAs using PCI-X interfaces. Our results show that InfiniBand HCAs with PCI Express interfaces deliver excellent performance. Compared with HCAs using 64 bit/133 MHz PCI-X interfaces, they can achieve 20%–30 % lower latency for small messages. The small message latency achieved with PCI Express is around 3.8 £ s. For large messages, HCAs with PCI Express can deliver bandwidth up to 2657 MB/s, which is 2.8 time better than the peak bandwidth of HCAs with PCI-X. At the MPI level, a latency of 4.6 £ s with PCI Express is achieved for small messages. For large messages, uni-directional bandwidth of 1475 MB/s and bi-directional bandwidth of 2576 MB/s are observed. Please note that the performance results presented here are preliminary and based on early versions of InfiniBand PCI Express products. As the InfiniBand and PCI Express products are rapidly maturing, we expect to see upcoming releases to continue reducing latency and increasing bandwidth. As new releases become available, we will generate the new performance results and make them available. The camera-ready version will have the latest performance results.
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