Performance comparison of selected wired and wireless networks on chip architectures

In this paper we compare performance intra-core communications in network on chips.We consider two alternative architectures, wired and wireless. The wired on is based on a common bus (ring) with all the cores attached to it. We compare it to the mesh (point-to-point) architecture based on THz wireless links operating in 0.1-0.54 frequency band. Using reference latencies of inter-core communications in modern CPUs we perform an applicability assessment of considered schemes. As performance metrics of interest we consider both delay and capacity. Our results indicate that the latter architecture outperforms the former by a singificant margin. The proposed system can be realized implementing directional antennas at all cores and ensuring that cores are placed on a chip such that there is no interference between them

Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework

OrthoNoC: a broadcast-oriented dual-plane wireless network-on-chip architecture

© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksOn-chip communication remains as a key research issue at the gates of the manycore era. In response to this, novel interconnect technologies have opened the door to new Network-on-Chip (NoC) solutions towards greater scalability and architectural flexibility. Particularly, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. This work presents ORTHONOC, a wired-wireless architecture that differs from existing proposals in that both network planes are decoupled and driven by traffic steering policies enforced at the network interfaces. With these and other design decisions, ORTHONOC seeks to emphasize the ordered broadcast advantage offered by the wireless technology. The performance and cost of ORTHONOC are first explored using synthetic traffic, showing substantial improvements with respect to other wired-wireless designs with a similar number of antennas. Then, the applicability of ORTHONOC in the multiprocessor scenario is demonstrated through the evaluation of a simple architecture that implements fast synchronization via ordered broadcast transmissions. Simulations reveal significant execution time speedups and communication energy savings for 64-threaded benchmarks, proving that the value of ORTHONOC goes beyond simply improving the performance of the on-chip interconnect.Peer ReviewedPostprint (author's final draft

An Interconnection Architecture for Seamless Inter and Intra-Chip Communication Using Wireless Links

As semiconductor technologies continues to scale, more and more cores are being integrated on the same multicore chip. This increase in complexity poses the challenge of efficient data transfer between these cores. Several on-chip network architectures are proposed to improve the design flexibility and communication efficiency of such multicore chips. However, in a larger system consisting of several multicore chips across a board or in a System-in-Package (SiP), the performance is limited by the communication among and within these chips. Such systems, most commonly found within computing modules in typical data center nodes or server racks, are in dire need of an efficient interconnection architecture. Conventional interchip communication using wireline links involve routing the data from the internal cores to the peripheral I/O ports, travelling over the interchip channels to the destination chip, and finally getting routed from the I/O to the internal cores there. This multihop communication increases latency and energy consumption while decreasing data bandwidth in a multichip system. Furthermore, the intrachip and interchip communication architectures are separately designed to maximize design flexibility. Jointly designing them could, however, improve the communication efficiency significantly and yield better solutions. Previous attempts at this include an all-photonic approach that provides a unified inter/intra-chip optical network, based on recent progress in nano-photonic technologies. Works on wireless inter-chip interconnects successfully yielded better results than their wired counterparts, but their scopes were limited to establishing a single wireless connection between two chips rather than a communication architecture for a system as a whole. In this thesis, the design of a seamless hybrid wired and wireless interconnection network for multichip systems in a package is proposed. The design utilizes on-chip wireless transceivers with dimensions spanning up to tens of centimeters. It manages to seamlessly bind both intrachip and interchip communication architectures and enables direct chip-to-chip communication between the internal cores. It is shown through cycle accurate simulations that the proposed design increases the bandwidth and reduces the energy consumption when compared to the state-of-the-art wireline I/O based multichip communications

WHYPE: A Scale-Out Architecture with Wireless Over-the-Air Majority for Scalable In-memory Hyperdimensional Computing

Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using long random vectors known as hypervectors. Among different hardware platforms capable of executing HDC algorithms, in-memory computing (IMC) has shown promise as it is very efficient in performing matrix-vector multiplications, which are common in the HDC algebra. Although HDC architectures based on IMC already exist, how to scale them remains a key challenge due to collective communication patterns that these architectures required and that traditional chip-scale networks were not designed for. To cope with this difficulty, we propose a scale-out HDC architecture called WHYPE, which uses wireless in-package communication technology to interconnect a large number of physically distributed IMC cores that either encode hypervectors or perform multiple similarity searches in parallel. In this context, the key enabler of WHYPE is the opportunistic use of the wireless network as a medium for over-the-air computation. WHYPE implements an optimized source coding that allows receivers to calculate the bit-wise majority of multiple hypervectors (a useful operation in HDC) being transmitted concurrently over the wireless channel. By doing so, we achieve a joint broadcast distribution and computation with a performance and efficiency unattainable with wired interconnects, which in turn enables massive parallelization of the architecture. Through evaluations at the on-chip network and complete architecture levels, we demonstrate that WHYPE can bundle and distribute hypervectors faster and more efficiently than a hypothetical wired implementation, and that it scales well to tens of receivers. We show that the average error rate of the majority computation is low, such that it has negligible impact on the accuracy of HDC classification tasks.Comment: Accepted at IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS). arXiv admin note: text overlap with arXiv:2205.1088

The Design of a System Architecture for Mobile Multimedia Computers

This chapter discusses the system architecture of a portable computer, called Mobile Digital Companion, which provides support for handling multimedia applications energy efficiently. Because battery life is limited and battery weight is an important factor for the size and the weight of the Mobile Digital Companion, energy management plays a crucial role in the architecture. As the Companion must remain usable in a variety of environments, it has to be flexible and adaptable to various operating conditions. The Mobile Digital Companion has an unconventional architecture that saves energy by using system decomposition at different levels of the architecture and exploits locality of reference with dedicated, optimised modules. The approach is based on dedicated functionality and the extensive use of energy reduction techniques at all levels of system design. The system has an architecture with a general-purpose processor accompanied by a set of heterogeneous autonomous programmable modules, each providing an energy efficient implementation of dedicated tasks. A reconfigurable internal communication network switch exploits locality of reference and eliminates wasteful data copies

Performance and Energy Trade-offs for 3D IC NoC Interconnects and Architectures

With the increased complexity and continual scaling of integrated circuit performance, multi-core chips with dozens, hundreds, even thousands of parallel computing units require high performance interconnects to maximize data throughput and minimize latency and energy consumption. High core counts render bus based interconnects inefficient and lackluster in performance. Networks-on-Chip were introduced to simplify the interconnect design process and maintain a more scalable interconnection architecture. With the continual scaling of feature sizes for smaller and smaller transistors, the global interconnections of planar integrated circuits are consuming higher energy proportional to the rest of the chip power dissipation as well as increasing communication delays. Three-dimensional integrated circuits were introduced to shorten global wire lengths and increase chip connectivity. These 3D ICs bring heat dissipation challenges as the power density increases drastically for each additional chip layer. One of the most popularly researched vertical interconnection technologies is through-silicon vias (TSVs). TSVs require additional manufacturing steps to build but generally have low energy dissipation and good performance. Alternative wireless technologies such as capacitive or inductive coupling do not require additional manufacturing steps and also provide the option of having a liquid cooling layer between planar chips. They are typically much slower and consume more energy than their wired counterparts, however. This work compares the interconnection technologies across several different NoC architectures including a proposed sparse 3D mesh for inductive coupling that increases vertical throughput per link and reduces chip area compared to the other wireless architectures and technologies

Wireless network on-chips history-based traffic prediction for token flow control and allocation

Wireless network-on-chip (WiNoC) uses a wireless backbone on top of the traditional wired-based NoC which demonstrated high scalability. WiNoC introduces long-range single-hop link connecting distanced core and high bandwidth radio frequency interconnects that reduces multi-hop communication in conventional wired-based NoC. However, to ensure full benefits of WiNoC technology, there is a need for fair and efficient Medium Access Control (MAC) mechanism to enhance communication in the wireless Network-on-Chip. To adapt to the varying traffic demands from the applications running on a multicore environment, MAC mechanisms should dynamically adjust the transmission slots of the wireless interfaces (WIs), to ensure efficient utilization of the wireless medium in a WiNoC. This work presents a prediction model that improves MAC mechanism to predict the traffic demand of the WIs and respond accordingly by adjusting transmission slots of the WIs. This research aims to reduce token waiting time and inefficient decision making for radio hub-to-hub communication and congestion-aware routing in WiNoC to enhance end to end latency. Through system level simulation, we will show that the dynamic MAC using an History-based prediction mechanism can significantly improve the performance of a WiNoC in terms of latency and network throughput compared to the state-of-the-art dynamic MAC mechanisms