Performance & reliability of 3D architectures (πfet, Finfet, Ωfet)

session 6F: Process IntegrationInternational audienceThe impact of 3D architectures and boosters on the trade-off performance/reliability is deeply investigated in this paper. “Finfet” transistor presents a slight superior trade-off than square shaped “πfet” device because of little improved performance and similar BTI&HC reliability. “Ωfet” also offers a better compromise than πfet due to improved BTI reliability. Finally strained SOI & SiGeOI devices are highly suitable since they allow boosting the transistor performance without any reliability penalty