Tunable Balun Low-Noise Amplifier in 65nm CMOS Technology

The presented paper includes the design and implementation of a 65 nm CMOS low-noise amplifier (LNA) based on inductive source degeneration. The amplifier is realized with an active balun enabling a single-ended input which is an important requirement for low-cost system on chip implementations. The LNA has a tunable bandpass characteristics from 4.7 GHz up to 5.6 GHz and a continuously tunable gain from 22 dB down to 0 dB, which enables the required flexibility for multi-standard, multi-band receiver architectures. The gain and band tuning is realized with an optimized tunable active resistor in parallel to a tunable L-C tank amplifier load. The amplifier achieves an IIP3 linearity of -8dBm and a noise figure of 2.7 dB at the highest gain and frequency setting with a low power consumption of 10 mW. The high flexibility of the proposed LNA structure together with the overall good performance makes it well suited for future multi-standard low-cost receiver front-ends

Integrated high-voltage switched-capacitor DC-DC converters

The focus of this work is on the integrated circuit (IC) level integration of high-voltage switched-capacitor (SC) converters with the goal of fully integrated power management solutions for system-on-chip (SoC) and system-in-pagage (SiP) applications. The full integration of SC converters provides a low cost and compact power supply solution for modern electronics. Currently, there are almost no fully integrated SC converters with input voltages above 5 V. The purpose of this work is to provide solutions for higher input voltages. The increasing challenges of a compact and efficient power supply on the chip are addressed. High-voltage rated components and the increased losses caused by parasitics not only reduce power density but also efficiency. Loss mechanisms in high-voltage SC converters are investigated resulting in an optimized model for high-voltage SC converters. The model developed allows an appropriate comparison of different semiconductor technologies and converter topologies. Methods and design proposals for loss reduction are presented. Control of power switches with their supporting circuits is a further challenge for high-voltage SC converters. The aim of this work is to develop fully integrated SC converters with a wide input voltage range. Different topologies and concepts are investigated. The implemented fully integrated SC converter has an input voltage range of 2 V to 13 V. This is twice the range of existing converters. This is achieved by an implemented buck and boost mode as well as 17 conversion ratios. Experimental results show a peak efficiency of 81.5%. This is the highest published peak efficiency for fully integrated SC converters with an input voltage > 5V. With the help of the model developed in this work, a three-phase SC converter topology for input voltages up to 60 V is derived and then investigated and discussed. Another focus of this work is on the power supply of sensor nodes and smart home applications with low-power consumption. Highly integrated micro power supplies that operate directly from mains voltage are particularly suitable for these applications. The micro power supply proposed in this work utilizes the high-voltage SC converter developed. The output power is 14 times higher and the power density eleven times higher than prior work. Since plenty of power switches are built into modern multi-ratio SC converters, the switch control circuits must be optimized with regard to low-power consumption and area requirements. In this work, different level shifter concepts are investigated and a low-power high-voltage level shifter for 50 V applications based on a capacitive level shifter is introduced. The level shifter developed exceeds the state of the art by a factor of more than eleven with a power consumption of 2.1pJ per transition. A propagation delay of 1.45 ns is achieved. The presented high-voltage level shifter is the first level shifter for 50 V applications with a propagation delay below 2 ns and power consumption below 20pJ per transition. Compared to the state of the art, the figure of merit is significantly improved by a factor of two. Furthermore, various charge pump concepts are investigated and evaluated within the context of this work. The charge pump, optimized in this work, improves the state of the art by a factor of 1.6 in terms of efficiency. Bidirectional switches must be implemented at certain locations within the power stage to prevent reverse conduction. The topology of a bidirectional switch developed in this work reduces the dynamic switching losses by 70% and the area consumption including the required charge pumps by up to 65% compared to the state of the art. These improvements make it possible to control the power switches in a fast and efficient way. Index terms — integrated power management, high input voltage, multi-ratio SC converter, level shifter, bidirectional switch, micro power supplyDer Schwerpunkt dieser Arbeit liegt auf der Erforschung von Switched-Capacitor (SC) Spannungswandler für höhere Eingangsspannungen. Ziel der Arbeit ist es Lösungen für ein voll auf dem Halbleiterchip integriertes Power Management anzubieten um System on Chip (SoC) und System in Package (SiP) zu ermöglichen. Die vollständige Integration von SC Spannungswandlern bietet eine kostengünstige und kompakte Spannungsversorgungslösung für moderne Elektronik. Der kontinuierliche Trend hin zu immer kompakterer Elektronik und hin zu höheren Versorgungsspannungen wird in dieser Arbeit adressiert. Aktuell gibt es sehr wenige voll integrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Die mit steigender Spannung zunehmenden Herausforderungen an eine kompakte und effiziente Spannungsversorgung auf dem Chip werden in dieser Arbeit untersucht. Die höhere Spannungsfestigkeit der verwendeten Komponenten korreliert mit erhöhten Verlusten und erhöhtem Flächenverbrauch, welche sich negativ auf den Wirkungsgrad und die Leistungsdichte von SC Spannungswandlern auswirkt. Bestandteil dieser Arbeit ist die Untersuchung dieser Verlustmechanismen und die Entwicklung eines Modells, welches speziell für höhere Spannungen optimiert wurde. Das vorgestellte Modell ermöglicht zum einen die optimale Dimensionierung der Spannungswandler und zum anderen faire Vergleichsmöglichkeiten zwischen verschiedenen SC Spannungswandler Architekturen und Halbleitertechnologien. Demnach haben sowohl die gewählte Architektur und Halbleitertechnologie als auch die Kombination aus gewählter Architektur und Technologie erheblichen Einfluss auf die Leistungsfähigkeit der Spannungswandler. Ziel dieser Arbeit ist die Vollintegration eines SC Spannungswandlers mit einem weiten und hohen Eingangsspannungsbereich zu entwickeln. Dazu wurden verschiedene Schaltungsarchitekturen und Konzepte untersucht. Der vorgestellte vollintegrierte SC Spannungswandler weist einen Eingangsspannungsbereich von 2 V bis 13 V auf. Dies ist eine Verdopplung im Vergleich zum Stand der Technik. Dies wird durch einen implementierten Auf- und Abwärtswandler-Betriebsmodus sowie 17 Übersetzungsverhältnisse erreicht. Experimentelle Ergebnisse zeigen einen Spitzenwirkungsgrad von 81.5%. Dies ist der höchste veröffentlichte Spitzenwirkungsgrad für vollintegrierte SC Spannungswandler mit einer Eingangsspannung größer 5 V. Mit Hilfe des in dieser Arbeit entwickelten Modells wird eine dreiphasige SC Spannungswandler Architektur für Eingangsspannungen bis zu 60 V entwickelt und anschließend analysiert und diskutiert. Ein weiterer Schwerpunkt dieser Arbeit adressiert die kompakte Spannungsversorgung von Sensorknoten mit geringem Stromverbrauch, für Anwendungen wie Smart Home und Internet der Dinge (IoT). Für diese Anwendungen eignen sich besonders gut hochintegrierte Mikro-Netzteile, welche direkt mit dem 230VRMS-Hausnetz (bzw. 110VRMS) betrieben werden können. Das in dieser Arbeit vorgestellte Mikro-Netzteil nutzt einen in dieser Arbeit entwickelten SC Spannungswandler für hohe Eingangsspannungen. Die damit erzielte Ausgangsleistung ist 14-mal größer im Vergleich zum Stand der Technik. In SC Spannungswandlern für hohe Spannungen werden viele Leistungsschalter benötigt, deshalb muss bei der Schalteransteuerung besonders auf einen geringen Leistungsverbrauch und Flächenbedarf der benötigten Schaltungsblöcke geachtet werden. Gegenstand dieser Arbeit ist sowohl die Analyse verschiedener Konzepte für Pegelumsetzer, als auch die Entwicklung eines stromsparenden Pegelumsetzers für 50 V-Anwendungen. Mit einer Leistungsaufnahme von 2.1pJ pro Signalübergang reduziert der entwickelte Pegelumsetzer mit kapazitiver Kopplung um mehr als elfmal die Leistungsaufnahme im Vergleich zum Stand der Technik. Die erreichte Laufzeitverzögerung beträgt 1.45 ns. Damit erzielt der vorgestellte Hochspannungs-Pegelumsetzer als erster Pegelumsetzer für 50 V-Anwendungen eine Laufzeitverzögerung unter 2 ns und eine Leistungsaufnahme unter 20pJ pro Signalwechsel. Im Vergleich zum Stand der Technik wird die Leistungskennzahl um den Faktor zwei deutlich verbessert. Darüber hinaus werden im Rahmen dieser Arbeiten verschiedene Ladungspumpenkonzepte untersucht und bewertet. Die in dieser Arbeit optimierte Ladungspumpe verbessert den Stand der Technik um den Faktor 1.6 in Bezug auf den Wirkungsgrad. Die in dieser Arbeit entwickelte Schaltungsarchitektur eines bidirektionalen Schalters reduziert die dynamischen Schaltverluste um 70% und den benötigten Flächenbedarf inklusive der benötigten Ladungspumpe um bis zu 65% gegenüber dem Stand der Technik. Diese Verbesserungen ermöglichen es, die Leistungsschalter schnell und effizient anzusteuern. Schlagworte — Integriertes Powermanagement, hohe Eingangsspannung, Multi-Ratio SC Spannungswan- dler, Pegelumsetzer, bidirektionaler Schalter, Mikro-Netztei

An RF LC Q-enhanced CMOS iter using integrated inductors with layout optimization

Dissertação apresentada para obtenção do Grau de Mestre em Engenharia Electrotécnica e de Computadores, pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaThe advancement of CMOS technology led to the integration of more complex functions in a single chip. In the particular of wireless transceivers, integrated LC tanks are becoming popular both for VCOs and integrated lters. The design of a 2nd order CMOS 0.13 m Q-enhanced integrated LC lter for a frequency of 2.44 GHz is presented. The intent of this lter is to create a circuit for integrated wireless receiver and minimize the requirement for o -chip passive lter components, reducing the overall component count and size of wireless devices and systems. For RF applications the main challenge is still the design of integrated inductors with the maximum quality factor. For that purpose, tapered, i.e, variable width inductors have been introduced in the literature. In this work, a characterization of variable width integrated inductors is proposed. This inductor model is then integrated into an optimization procedure where inductors with a quality factor improvement are obtained

Novel techniques for the design and practical realization of switched-capacitor circuits in deep-submicron CMOS technologies

Dissertação apresentada para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores pela Universidade Nova de Lisboa, Faculdade de Ciências e TecnologiaSwitches presenting high linearity are more and more required in switched-capacitor circuits,namely in 12 to 16 bits resolution analog-to-digital converters. The CMOS technology evolves continuously towards lower supply voltages and, simultaneously, new design techniques are necessary to fulfill the realization of switches exhibiting a high dynamic range and a distortion compatible with referred resolutions. Moreover, with the continuously downing of the sizes, the physic constraints of the technology must be considered to avoid the excessive stress of the devices when relatively high voltages are applied to the gates. New switch-linearization techniques, with high reliability, must be necessarily developed and demonstrated in CMOS integrated circuits. Also, the research of new structures of circuits with switched-capacitor is permanent. Simplified and efficient structures are mandatory, adequate to the new demands emerging from the proliferation of portable equipments, necessarily with low energy consumption while assuring high performance and multiple functions. The work reported in this Thesis comprises these two areas. The behavior of the switches under these new constraints is analyzed, being a new and original solution proposed, in order to maintain the performance. Also, proposals for the application of simpler clock and control schemes are presented, and for the use of open-loop structures and amplifiers with localfeedback. The results, obtained in laboratory or by simulation, assess the feasibility of the presented proposals

Silicon Germanium BiCMOS Integrated Circuits for Scalable Cryogenic Sensing Applications

This dissertation is focused on an investigation of BiCMOS cryogenic low noise amplifiers (LNAs) based on Silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) for simultaneous low noise and low power design and also taking advantage of CMOS circuitry for adding flexibility to the LNA design. Cryogenic LNAs\u27 scalability challenges are discussed and addressed in the dissertation. To achieve that, first, HBTs of three state-of-the-art technologies are characterized and modeled at cryogenic temperature. It is shown that SiGe HBT provides a promising compromise of noise temperature, power consumption, and bandwidth. Moreover, a scalable on-chip approach is proposed and verified for biasing of SiGe HBTs based LNAs. Finally, the first cryogenic re-configurable LNA is designed, implemented, and measured

Parametric analog signal amplification applied to nanoscale cmos wireless digital transceivers

Thesis presented in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the subject of Electrical and Computer Engineering by the Universidade Nova de Lisboa,Faculdade de Ciências e TecnologiaSignal amplification is required in almost every analog electronic system. However noise is also present, thus imposing limits to the overall circuit performance, e.g., on the sensitivity of the radio transceiver. This drawback has triggered a major research on the field, which has been producing several solutions to achieve amplification with minimum added noise. During the Fifties, an interesting out of mainstream path was followed which was based on variable reactance instead of resistance based amplifiers. The principle of these parametric circuits permits to achieve low noise amplifiers since the controlled variations of pure reactance elements is intrinsically noiseless. The amplification is based on a mixing effect which enables energy transfer from an AC pump source to other related signal frequencies. While the first implementations of these type of amplifiers were already available at that time, the discrete-time version only became visible more recently. This discrete-time version is a promising technique since it is well adapted to the mainstream nanoscale CMOS technology. The technique itself is based on the principle of changing the surface potential of the MOS device while maintaining the transistor gate in a floating state. In order words, the voltage amplification is achieved by changing the capacitance value while maintaining the total charge unchanged during an amplification phase. Since a parametric amplifier is not intrinsically dependent on the transconductance of the MOS transistor, it does not directly suffer from the intrinsic transconductance MOS gain issues verified in nanoscale MOS technologies. As a consequence, open-loop and opamp free structures can further emerge with this additional contribution. This thesis is dedicated to the analysis of parametric amplification with special emphasis on the MOS discrete-time implementation. The use of the latter is supported on the presentation of several circuits where the MOS Parametric Amplifier cell is well suited: small gain amplifier, comparator, discrete-time mixer and filter, and ADC. Relatively to the latter, a high speed time-interleaved pipeline ADC prototype is implemented in a,standard 130 nm CMOS digital technology from United Microelectronics Corporation (UMC). The ADC is fully based on parametric MOS amplification which means that one could achieve a compact and MOS-only implementation. Furthermore, any high speed opamp has not been used in the signal path, being all the amplification steps implemented with open-loop parametric MOS amplifiers. To the author’s knowledge, this is first reported pipeline ADC that extensively used the parametric amplification concept.Fundação para a Ciência e Tecnologia through the projects SPEED, LEADER and IMPAC

Time-domain optimization of amplifiers based on distributed genetic algorithms

Thesis presented in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the subject of Electrical and Computer EngineeringThe work presented in this thesis addresses the task of circuit optimization, helping the designer facing the high performance and high efficiency circuits demands of the market and technology evolution. A novel framework is introduced, based on time-domain analysis, genetic algorithm optimization, and distributed processing. The time-domain optimization methodology is based on the step response of the amplifier. The main advantage of this new time-domain methodology is that, when a given settling-error is reached within the desired settling-time, it is automatically guaranteed that the amplifier has enough open-loop gain, AOL, output-swing (OS), slew-rate (SR), closed loop bandwidth and closed loop stability. Thus, this simplification of the circuit‟s evaluation helps the optimization process to converge faster. The method used to calculate the step response expression of the circuit is based on the inverse Laplace transform applied to the transfer function, symbolically, multiplied by 1/s (which represents the unity input step). Furthermore, may be applied to transfer functions of circuits with unlimited number of zeros/poles, without approximation in order to keep accuracy. Thus, complex circuit, with several design/optimization degrees of freedom can also be considered. The expression of the step response, from the proposed methodology, is based on the DC bias operating point of the devices of the circuit. For this, complex and accurate device models (e.g. BSIM3v3) are integrated. During the optimization process, the time-domain evaluation of the amplifier is used by the genetic algorithm, in the classification of the genetic individuals. The time-domain evaluator is integrated into the developed optimization platform, as independent library, coded using C programming language. The genetic algorithms have demonstrated to be a good approach for optimization since they are flexible and independent from the optimization-objective. Different levels of abstraction can be optimized either system level or circuit level. Optimization of any new block is basically carried-out by simply providing additional configuration files, e.g. chromosome format, in text format; and the circuit library where the fitness value of each individual of the genetic algorithm is computed. Distributed processing is also employed to address the increasing processing time demanded by the complex circuit analysis, and the accurate models of the circuit devices. The communication by remote processing nodes is based on Message Passing interface (MPI). It is demonstrated that the distributed processing reduced the optimization run-time by more than one order of magnitude. Platform assessment is carried by several examples of two-stage amplifiers, which have been optimized and successfully used, embedded, in larger systems, such as data converters. A dedicated example of an inverter-based self-biased two-stage amplifier has been designed, laid-out and fabricated as a stand-alone circuit and experimentally evaluated. The measured results are a direct demonstration of the effectiveness of the proposed time-domain optimization methodology.Portuguese Foundation for the Science and Technology (FCT

CMOS indoor light energy harvesting system for wireless sensing applications

Dissertação para obtenção do Grau de Doutor em Engenharia Electrotécnica e de ComputadoresThis research thesis presents a micro-power light energy harvesting system for indoor environments. Light energy is collected by amorphous silicon photovoltaic (a-Si:H PV) cells, processed by a switched-capacitor (SC) voltage doubler circuit with maximum power point tracking (MPPT), and finally stored in a large capacitor. The MPPT Fractional Open Circuit Voltage (VOC) technique is implemented by an asynchronous state machine (ASM) that creates and, dynamically, adjusts the clock frequency of the step-up SC circuit, matching the input impedance of the SC circuit to the maximum power point (MPP) condition of the PV cells. The ASM has a separate local power supply to make it robust against load variations. In order to reduce the area occupied by the SC circuit, while maintaining an acceptable efficiency value, the SC circuit uses MOSFET capacitors with a charge reusing scheme for the bottom plate parasitic capacitors. The circuit occupies an area of 0.31 mm2 in a 130 nm CMOS technology. The system was designed in order to work under realistic indoor light intensities. Experimental results show that the proposed system, using PV cells with an area of 14 cm2, is capable of starting-up from a 0 V condition, with an irradiance of only 0.32 W/m2. After starting-up, the system requires an irradiance of only 0.18 W/m2 (18 mW/cm2) to remain in operation. The ASM circuit can operate correctly using a local power supply voltage of 453 mV, dissipating only 0.085 mW. These values are, to the best of the authors’ knowledge, the lowest reported in the literature. The maximum efficiency of the SC converter is 70.3% for an input power of 48 mW, which is comparable with reported values from circuits operating at similar power levels.Portuguese Foundation for Science and Technology (FCT/MCTES), under project PEst-OE/EEI/UI0066/2011, and to the CTS multiannual funding, through the PIDDAC Program funds. I am also very grateful for the grant SFRH/PROTEC/67683/2010, financially supported by the IPL – Instituto Politécnico de Lisboa

InAs Nanowire Devices and Circuits

Since the introduction of the transistor and the integrated circuit, the semiconductor industry has developed at a remarkable pace. By continuously fabricating smaller and faster transistors, it has been possible to maintain an exponential increase in performance, a phenomenon famously described by Moore’s Law. Today, billions of transistors are integrated on a single chip and the size of a transistor is on the scale of tens of nanometres. Until recently, the improvements in performance and integration density have been mostly driven by scaling down the transistor size. However, as the length scale is rapidly approaching that of only a few atoms, this scaling paradigm may not continue forever. Instead, the research community, as well as the industry, is investigating alternative structures and materials in order to further increase the performance. One emerging technology for use in future electronic circuits is transistors based on nanowires. The nanowire transistor structure investigated in this work combines a number of key technologies to achieve a higher performance than traditional Si-based transistors. Epitaxially grown nanowires are naturally oriented in the vertical direction, which means that the devices may be fabricated from the bottom and up. This three-dimensional structure allows a higher integration density and enables the gate to completely surround the channel in a gate-all-around configuration. Combined with a high-k dielectric, this results in an excellent electrostatic gate control. Furthermore, nanowires have the unique ability to combine semiconductor materials with significantly different lattice constants. By introducing InAs as a channel material, a much higher electron mobility than for Si is achieved. In this work, simulations of nanowire-based devices are performed and the ultimate performance is predicted. A nanowire transistor architecture with a realistic footprint is proposed and a roadmap is established for the scaling of the device structure, based on a set of technology nodes. Benchmarking is performed against competing technologies, both from a device and circuit perspective. The physical properties of nanowire transistors, and the corresponding capacitor structure, are investigated by band-structure simulations. Based on these simulations, a ballistic transport model is used to derive the intrinsic transistor characteristics. This is combined with an extensive evaluation and optimization of the parasitic elements in the transistor structure for each technology node. It is demonstrated that an optimized nanowire transistor has the potential to operate at terahertz frequencies, while maintaining a low power consumption. A high quality factor and extremely high integration density is predicted for the nanowire capacitor structure. It is concluded that InAs nanowire devices show great potential for use in future electronic circuits, both in digital and analogue applications