Adaptive code division multiple access protocol for wireless network-on-chip architectures

Massive levels of integration following Moore\u27s Law ushered in a paradigm shift in the way on-chip interconnections were designed. With higher and higher number of cores on the same die traditional bus based interconnections are no longer a scalable communication infrastructure. On-chip networks were proposed enabled a scalable plug-and-play mechanism for interconnecting hundreds of cores on the same chip. Wired interconnects between the cores in a traditional Network-on-Chip (NoC) system, becomes a bottleneck with increase in the number of cores thereby increasing the latency and energy to transmit signals over them. Hence, there has been many alternative emerging interconnect technologies proposed, namely, 3D, photonic and multi-band RF interconnects. Although they provide better connectivity, higher speed and higher bandwidth compared to wired interconnects; they also face challenges with heat dissipation and manufacturing difficulties. On-chip wireless interconnects is one other alternative proposed which doesn\u27t need physical interconnection layout as data travels over the wireless medium. They are integrated into a hybrid NOC architecture consisting of both wired and wireless links, which provides higher bandwidth, lower latency, lesser area overhead and reduced energy dissipation in communication. However, as the bandwidth of the wireless channels is limited, an efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. This thesis proposes using a multiple access mechanism such as Code Division Multiple Access (CDMA) to enable multiple transmitter-receiver pairs to send data over the wireless channel simultaneously. It will be shown that such a hybrid wireless NoC with an efficient CDMA based MAC protocol can significantly increase the performance of the system while lowering the energy dissipation in data transfer. In this work it is shown that the wireless NoC with the proposed CDMA based MAC protocol outperformed the wired counterparts and several other wireless architectures proposed in literature in terms of bandwidth and packet energy dissipation. Significant gains were observed in packet energy dissipation and bandwidth even with scaling the system to higher number of cores. Non-uniform traffic simulations showed that the proposed CDMA-WiNoC was consistent in bandwidth across all traffic patterns. It is also shown that the CDMA based MAC scheme does not introduce additional reliability concerns in data transfer over the on-chip wireless interconnects

Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networksin- Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position paper makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges towards its realization are analyzed from the technological, communications, and computer architecture perspectives

Graphene-based wireless agile interconnects for massive heterogeneous multi-chip processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position article makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges toward its realization are analyzed from the technological, communications, and computer architecture perspectives.This publication is part of the Spanish I+D+i project TRAINER-A (ref. PID2020-118011GB-C21), funded by MCIN/AEI/10.13039/501100011033. This work has been also supported by the European Commission under H2020 grants WiPLASH (GA 863337), 2D-EPL (GA 952792), and Graphene Flagship (GA 881603); the FLAGERA framework under grant TUGRACO (HA 3022/9-1, LE 2440/3-1), the European Research Council under grants WINC (GA 101042080), COMPUSAPIEN (GA 725657), and PROJESTOR (GA 682675), the German Ministry of Education and Research under grant GIMMIK (03XP0210) and the and the German Research Foundation under grant HIPEDI (WA 4139/1-1).Peer ReviewedArticle signat per 21 autors/es: Sergi Abadal, Robert Guirado, Hamidreza Taghvaee, and Akshay Jain are with the Universitat Politècnica de Catalunya, Spain; Elana Pereira de Santana and Peter Haring Bolívar are with the University of Siegen, Germany; Mohamed Saeed, Renato Negra, Kun-Ta Wang, and Max C. Lemme are with RWTH Aachen University, Germany. Zhenxing Wang, Kun-Ta Wang, and Max C. Lemme are also with AMO GmbH, Germany; Joshua Klein, Marina Zapater, Alexandre Levisse, and David Atienza are with the Swiss Federal Institute of Technology, Switzerland. Marina Zapater is also with the University of Applied Sciences and Arts Western Switzerland; Davide Rossi and Francesco Conti are with the University of Bologna,Italy; Martino Dazzi, Geethan Karunaratne, Irem Boybat, and Abu Sebastian are with IBM Research Europe, SwitzerlandPostprint (author's final draft

Graphene-based Wireless Agile Interconnects for Massive Heterogeneous Multi-chip Processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position paper makes the case for wireless in-package nanonetworking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a nanonetworking vision and the main research challenges towards its realization are analyzed from the technological, communications, and computer architecture perspectives.Comment: 8 pages, 4 figures, 1 table - Accepted at IEEE Wireless Communications Magazin

Design Trade-offs for reliable On-Chip Wireless Interconnects in NoC Platforms

The massive levels of integration following Moore\u27s Law making modern multi-core chips prevail in various domains ranging from scientific applications to bioinformatics applications for consumer electronics. With higher and higher number of cores on the same die traditional bus based interconnections are no longer a scalable communication infrastructure. On-chip networks were proposed enabled a scalable plug-and-play mechanism for interconnecting hundreds of cores on the same chip. Wired interconnects between the cores in a traditional Network-on-Chip (NoC) system, becomes a bottleneck with increase in the number of cores thereby increasing the latency and energy to transmit signals over them. Hence, there has been many alternative emerging interconnect technologies proposed, namely, 3D, photonic and multi-band RF interconnects. Although they provide better connectivity, higher speed and higher bandwidth compared to wired interconnects; they also face challenges with heat dissipation and manufacturing difficulties. On-chip wireless interconnects is one other alternative proposed which doesn\u27t need physical interconnection layout as data travels over the wireless medium. They are integrated into a hybrid NOC architecture consisting of both wired and wireless links, which provides higher bandwidth, lower latency, lesser area overhead and reduced energy dissipation in communication. An efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. A token-passing protocol proposed to grant access of the wireless channel to competing transmitters. This limits the number of simultaneous users of the communication channel to one although multiple wireless hubs are deployed over the chip. In principle, a Frequency Division Multiple Access (FDMA) based medium access scheme would improve the utilization of the wireless resources. However, this requires design of multiple very precise, high frequency transceivers in non-overlapping frequency channels. Therefore, the scalability of this approach is limited by the state-of-the-art in transceiver design. The Code Division Multiple Access (CDMA) enables multiple transmitter-receiver pairs to send data over the wireless channel simultaneously. The CDMA protocol can significantly increase the performance of the system while lowering the energy dissipation in data transfer. The CDMA based MAC protocol outperforms the wired counterparts and several other wireless architectures proposed in literature in terms of bandwidth and packet energy dissipation. However, the reliability of CDMA based wireless NoC\u27s is limited, as the probability of error is eminent due to synchronization delays at the receiver. The thesis proposes the use of an advanced filter which improves the performance and also reduces the error due to synchronization delays. This thesis also proposes investigation of various channel modulation schemes on token passing wireless NoC\u27s to examine the performance and reliability of the system. The trade-off between performance and energy are established for the various conditions. The results are obtained using a modified cycle accurate simulator

FDMA Enabled Phase-based Wireless Network-on-Chip using Graphene-based THz-band Antennas

The future growth in System-on-chip design is moving in the direction of multicore systems. Design of efficient interconnects between cores are crucial for improving the performance of a multicore processor. Such trends are seen due to the benefits the multicore systems provide in terms of power reduction and scalability. Network-on-chips (NoC) are viewed as an emerging solution in the design of interconnects in multicore systems. However, Traditional Network-on-chip architectures are no longer able to satisfy the performance requirements due to long distance communication over multi-hop wireline paths. Multi-hop communication leads to higher energy consumption, increase in latency and reduction in bandwidth. Research in recent years has explored emerging technologies such as 3D integration, photonic and radio frequency based Network-on-chips. The use of wireless interconnects using mm-wave antennas are able to alleviate the performance issues in a wireline interconnect system. However, to satisfy the increasing demand for higher bandwidth and lower energy consumption, Wireless Network-on-Chip enabled with high speed direct links operating in THz band between distant cores is desired. Recent research has brought to light highly efficient graphene-based antennas operating in THz band. These antennas can provide high data rate and are found to consume less power with low area overheads. In this thesis, an innovative approach using novel devices based on graphene structures is proposed to provide a high-performance on-chip interconnection. This novel approach combines the regular NoC structure with the proposed wireless infrastructure to exploit the performance benefits. An architecture with wireless interfaces on every core is explored in this work. Simultaneous multiple communications in a network can be achieved by adopting Frequency Division Multiple access (FDMA). However, in a system where all cores are equipped with a wireless interface, FDMA requires more number of frequency bands. This becomes difficult to achieve as the system scales and the number of cores increase. Therefore, a FDMA protocol along with a 4-phased repetitive multi-band architecture is envisioned in this work. The phase-based protocol allows multiple wireless links to be active at a time, the phase-based protocol along with the FDMA protocol provides a reliable data transfer between cores with lesser number of frequency bands. In this thesis, an architecture with a combination of FDMA and phase-based protocol using point-to-point graphene-based wireless links is proposed. The proposed architecture is also extended for a multichip system. With cycle accurate system-level simulations, it is shown that the proposed architecture provides huge gains in performance and energy-efficiency in data transfer both in NoC based multicore and multichip systems

Towards a scalable and reliable wireless network-on-chip

Multi-core platforms are emerging trends in the design of Systems-on-Chip (SoCs). Interconnect fabrics for these multi-core SoCs play a crucial role in achieving the target performance. The Network-on-Chip (NoC) paradigm has been proposed as a promising solution for designing the interconnect fabric of multi-core SoCs. But the performance requirements of NoC infrastructures in future technology nodes cannot be met by relying only on material innovation with traditional scaling. The continuing demand for low power and high speed interconnects with technology scaling necessitates looking beyond the conventional planar metal/dielectric-based interconnect infrastructures. Among different possible alternatives, the on-chip wireless communication network is envisioned as a revolutionary methodology, capable of bringing significant performance gains for multi-core SoCs. Wireless NoCs (WiNoCs) can be designed by using miniaturized on-chip antennas as an enabling technology. In this work, design methodologies and technology requirements for scalable WiNoC architectures are presented and their performance is evaluated. It is demonstrated that WiNoCs outperform their wired counterparts in terms of network throughput and latency, and that energy dissipation improves by orders of magnitude under various experimental and real-life scenarios. A major challenge that NoC design is expected to face is related to the intrinsic unreliability of the interconnect infrastructure under technology limitations. The devices and components of the WiNoCs are expected to suffer high failure rates. By incorporating error control coding (ECC) schemes along the interconnects, NoC architectures will be able to provide correct functionality even in the presence of different sources of transient noise and yet have low energy dissipation. In this work, designs of novel joint crosstalk avoidance and multiple error correction/detection codes as well as burst error correction codes are proposed and their performance is evaluated in different WiNoC fabrics. It is demonstrated that by using the proposed codes WiNoCs can achieve the same reliability as a wireline NoC with much less energy dissipation and higher performance

Robust and Traffic Aware Medium Access Control Mechanisms for Energy-Efficient mm-Wave Wireless Network-on-Chip Architectures

To cater to the performance/watt needs, processors with multiple processing cores on the same chip have become the de-facto design choice. In such multicore systems, Network-on-Chip (NoC) serves as a communication infrastructure for data transfer among the cores on the chip. However, conventional metallic interconnect based NoCs are constrained by their long multi-hop latencies and high power consumption, limiting the performance gain in these systems. Among, different alternatives, due to the CMOS compatibility and energy-efficiency, low-latency wireless interconnect operating in the millimeter wave (mm-wave) band is nearer term solution to this multi-hop communication problem. This has led to the recent exploration of millimeter-wave (mm-wave) wireless technologies in wireless NoC architectures (WiNoC). To realize the mm-wave wireless interconnect in a WiNoC, a wireless interface (WI) equipped with on-chip antenna and transceiver circuit operating at 60GHz frequency range is integrated to the ports of some NoC switches. The WIs are also equipped with a medium access control (MAC) mechanism that ensures a collision free and energy-efficient communication among the WIs located at different parts on the chip. However, due to shrinking feature size and complex integration in CMOS technology, high-density chips like multicore systems are prone to manufacturing defects and dynamic faults during chip operation. Such failures can result in permanently broken wireless links or cause the MAC to malfunction in a WiNoC. Consequently, the energy-efficient communication through the wireless medium will be compromised. Furthermore, the energy efficiency in the wireless channel access is also dependent on the traffic pattern of the applications running on the multicore systems. Due to the bursty and self-similar nature of the NoC traffic patterns, the traffic demand of the WIs can vary both spatially and temporally. Ineffective management of such traffic variation of the WIs, limits the performance and energy benefits of the novel mm-wave interconnect technology. Hence, to utilize the full potential of the novel mm-wave interconnect technology in WiNoCs, design of a simple, fair, robust, and efficient MAC is of paramount importance. The main goal of this dissertation is to propose the design principles for robust and traffic-aware MAC mechanisms to provide high bandwidth, low latency, and energy-efficient data communication in mm-wave WiNoCs. The proposed solution has two parts. In the first part, we propose the cross-layer design methodology of robust WiNoC architecture that can minimize the effect of permanent failure of the wireless links and recover from transient failures caused by single event upsets (SEU). Then, in the second part, we present a traffic-aware MAC mechanism that can adjust the transmission slots of the WIs based on the traffic demand of the WIs. The proposed MAC is also robust against the failure of the wireless access mechanism. Finally, as future research directions, this idea of traffic awareness is extended throughout the whole NoC by enabling adaptiveness in both wired and wireless interconnection fabric