ARM Wrestling with Big Data: A Study of Commodity ARM64 Server for Big Data Workloads

ARM processors have dominated the mobile device market in the last decade due to their favorable computing to energy ratio. In this age of Cloud data centers and Big Data analytics, the focus is increasingly on power efficient processing, rather than just high throughput computing. ARM's first commodity server-grade processor is the recent AMD A1100-series processor, based on a 64-bit ARM Cortex A57 architecture. In this paper, we study the performance and energy efficiency of a server based on this ARM64 CPU, relative to a comparable server running an AMD Opteron 3300-series x64 CPU, for Big Data workloads. Specifically, we study these for Intel's HiBench suite of web, query and machine learning benchmarks on Apache Hadoop v2.7 in a pseudo-distributed setup, for data sizes up to $20GB$ files, $5M$ web pages and $500M$ tuples. Our results show that the ARM64 server's runtime performance is comparable to the x64 server for integer-based workloads like Sort and Hive queries, and only lags behind for floating-point intensive benchmarks like PageRank, when they do not exploit data parallelism adequately. We also see that the ARM64 server takes $\frac{1}{3}^{rd}$ the energy, and has an Energy Delay Product (EDP) that is $50-71\%$ lower than the x64 server. These results hold promise for ARM64 data centers hosting Big Data workloads to reduce their operational costs, while opening up opportunities for further analysis.Comment: Accepted for publication in the Proceedings of the 24th IEEE International Conference on High Performance Computing, Data, and Analytics (HiPC), 201

Memory Hierarchy Design for Next Generation Scalable Many-core Platforms

Performance and energy consumption in modern computing platforms is largely dominated by the memory hierarchy. The increasing computational power in the multiprocessors and accelerators, and the emergence of the data-intensive workloads (e.g. large-scale graph traversal and scientific algorithms) requiring fast transfer of large volumes of data, are two main trends which intensify this problem by putting even higher pressure on the memory hierarchy. This increasing gap between computation speed and data transfer speed is commonly referred as the “memory wall” problem. With the emergence of heterogeneous Three Dimensional (3D) Integration based on through-silicon-vias (TSV), this situation has started to recover in the past years. On one hand, it is now possible to improve memory access bandwidth and/or latency by either stacking memories directly on top of processors or through abstracted memory interfaces such as Micron’s Hybrid Memory Cube (HMC). On the other hand, near memory computation has become worthy of revisiting due to the cost-effective integration of logic and memory in 3D stacks. These two directions bring about several interesting opportunities including performance improvement, energy and cost reduction, product miniaturization, and modular design for improved time to market. In this research, we study the effectiveness of the 3D integration technology and the optimization opportunities which it can provide in the different layers of the memory hierarchy in cluster-based many-core platforms ranging from intra-cluster L1 to inter-cluster L2 scratchpad memories (SPMs), as well as the main memory. In addition, by moving a part of the computation to where data resides, in the 3D-stacked memory context, we demonstrate further energy and performance improvement opportunities

On understanding the energy consumption of ARM-based multicore servers

10.1145/2494232.2465553Performance Evaluation Review411 SPEC. ISS.267-278PERE