14,891 research outputs found

    High density Schottky barrier IRCCD sensors for SWIR applications at intermediate temperature

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    Monolithic 32 x 64 and 64 x 1:128 palladium silicide (Pd2Si) interline transfer infrared charge coupled devices (IRCCDs) sensitive in the 1 to 3.5 micron spectral band were developed. This silicon imager exhibits a low response nonuniformity of typically 0.2 to 1.6% rms, and was operated in the temperature range between 40 to 140 K. Spectral response measurements of test Pd2Si p-type Si devices yield quantum efficiencies of 7.9% at 1.25 microns, 5.6% at 1.65 microns 2.2% at 2.22 microns. Improvement in quantum efficiency is expected by optimizing the different structural parameters of the Pd2Si detectors. The spectral response of the Pd2Si detectors fit a modified Fowler emission model. The measured photo-electric barrier height for the Pd2Si detectors is 0.34 eV and the measured quantum efficiency coefficient, C1, is 19%/eV. The dark current level of Pd2Si Schottky barrier focal plane arrays (FPAs) is sufficiently low to enable operation at intermediate temperatures at TV frame rates. Typical dark current level measured at 120 K on the FPA is 2 nA/sq cm. The operating temperature of the Pd2Si FPA is compatible with passive cooler performance. In addition, high density Pd2Si Schottky barrier FPAs are manufactured with high yield and therefore represent an economical approach to short wavelength IR imaging. A Pd2Si Schottky barrier image sensor for push-broom multispectral imaging in the 1.25, 1.65, and 2.22 micron bands is being studied. The sensor will have two line arrays (dual band capability) of 512 detectors each, with 30 micron center-to-center detector spacing. The device will be suitable for chip-to-chip abutment, thus providing the capability to produce large, multiple chip focal planes with contiguous, in-line sensors

    Report of the sensor readout electronics panel

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    The findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals

    50 Years of Spaceflight with Fourier Transform Spectrometers (FTS) Built at NASA GSFC

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    Over the past 50 years, NASA Goddard Space Flight Center (GSFC) has been developing, building, testing and flying a series of Fourier Transform Spectrometers (FTS). This began with the IRIS instruments on the Earth-orbiting Nimbus satellites and progressed to more sophisticated designs optimized for interplanetary spacecraft sent to Mars and later to the outer solar system. Adaptions have been made over time, including progressively higher spectral resolution, sensitivity, numbers of detectors and complexity. Instrument operating temperatures have decreased to enable remote sensing of the cold giant planet systems. In this paper we describe the historical evolution of this instrument line, comparing and contrasting different aspects such as optical design and materials, detector types and data handling. We conclude by looking towards the future. At present the CIRS-Lite prototype is being tested at NASA GSFC for potential use on a future mission to the ice giants, Uranus and Neptune. Surpassing the previous performance of the Voyager IRIS instruments remains challenging, and new technologies that could enable these measurements are discussed

    QWIPs, SLS, Landsat and the International Space Station

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    In 1988 DARPA provided funding to NASAs Goddard Space Flight Center to support the development of GaAs Quantum Well Infrared Photodetectors (QWIP). The goal was to make a single element photodetector that might be expandable to a two-dimensional array format. Ultimately, this led to the development of a 128 x 128 element array in collaboration with AT&T Bell Labs and Rockwell Science Center in 1990. We continued to develop numerous generations of QWIP arrays most recently resulting in the multi-QWIP focal plane for the NASA-US Geological Survey (USGS) Landsat 8 mission launched in 2013 and a similar instrument on the Landsat 9 mission to be launched in 2020. Toward the end of the Landsat 8 QWIP-based Thermal Infrared Sensor (TIRS) instrument the potential of the newly developed Strained Layer Superlattice (SLS) detector array technology became of great interest to NASA for three primary reasons: 1) higher operating temperature; 2) broad spectral response and; 3) higher sensitivity. We have collaborated extensively with QmagiQ, LLC and Northwestern University to further pursue and advance the SLS technology ever since we started back in 2012. In December of 2018 we launched the first SLS-based IR camera system to the International Space Station on board the Robotic Refueling Mission #3 (RRM3). This paper will describe the evolution of QWIP technology leading to the current development of SLS-based imaging systems at the Goddard Space Flight Center over the past 30 years

    Report of the direct infrared sensors panel

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    The direct infrared sensors panel considered a wide range of options for technologies relevant to the science goals of the Astrotech 21 mission set. Among the technologies assessed are: large format arrays; photon counting detectors; higher temperature 1 to 10 micro-m arrays; impurity band conduction (IBC) or blocked impurity band (BIB) detectors; readout electronics; and adapting the Space Infrared Telescope Facility and Hubble Space Telescope. Detailed development plans were presented for each of these technology areas
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