Industry/University Collaboration at the University of Michigan-Dearborn: A Focus on Relevant Technology

https://deepblue.lib.umich.edu/bitstream/2027.42/154106/1/kampfner1998.pd

Industry/University Collaboration at the University of Michigan-Dearborn: A Focus on Relevant Technology

https://deepblue.lib.umich.edu/bitstream/2027.42/154104/1/kampfner1996.pd

Pre-Education Programs: A Comprehensive Project at Henry Ford Community College

Henry Ford Community College (HFCC) in Dearbom, Michigan is a two-year institution of higher education serving a diverse student population of approximately 13,000 students. In addition to providing a broad array of technical and vocational programs, the College provides the first two years of a baccalaureate program. However, the transferability of these programs is not assured. In the absence of a mandated state-wide curriculum, two- and four-year colleges and universities in Michigan develop courses and programs independently, and the transfer of courses between institutions is determined independently by the respective departments. The end result is often loss of credit when a community college student transfers. Other problems faced prospective education majors as well. Students were justifiably apprehensive about the suitability of their academic preparation for the challenges they would confront at the four-year institution. To address this and other problems, HFCC initiated a comprehensive project to develop a structured teacher education program. The project consisted of two components: 1) creation of pre-education programs and 2) institution of articulated transfer agreements as a result of collaboration with neighboring universities. The success of this reform is underscored by a dramatic increase in HFCC pre-education majors from 354 students in 1994 to 697 in 1997, with 80 students designating minority status in 1994 and 179 in 1997

Constructive Alignment in Simulation Education

Recent and ongoing developments are significantly augmenting both the demand for and the expectations of university simulation education. These developments include increased use of simulation in industry, increased variety of economic segments in which simulation is used, broader variation in demographics of simulation students, and higher expectations of both those students and their eventual employers. To meet the challenges these developments impose, it is vital that simulation educators aggressively and innovatively improve the teaching of simulation. To this end, we explore the application of constructive alignment concepts in simulation education, and compare and contrast its application in the context of two university course offerings. These concepts suggest continuation of some practices and revision of others relative to the learning objectives, learning activities, and assessment tasks in these and other simulation courses

Industry/University Collaboration at the University of Michigan-Dearborn: A Focus on Relevant Technology

https://deepblue.lib.umich.edu/bitstream/2027.42/154105/1/kampfner1997.pd

Expanding Rapid Prototyping for Electronic Systems Integration of Arbitrary Form

An innovative method for rapid prototyping (RP) of electronic circuits with components characteristic of typical electronics applications was demonstrated using an enhanced version of a previously developed hybrid stereolithography (SL) and direct write (DW) system, where an existing SL machine was integrated with a three-axis DW fluid dispensing system for combined arbitrary form electronic systems manufacturing. This paper presents initial efforts at embedding functional electronic circuits using the hybrid SL/DW system. A simple temperature-sensitive circuit was selected, which oscillated an LED at a frequency proportional to the temperature sensed by the thermistor. The circuit was designed to incorporate all the required electronic components within a 2.5” x 2” x 0.5” SL part. Electrical interconnects between electronic components were deposited on the SL part with a DW system using silver conductive ink lines. Several inks were deposited, cured, and tested on a variety of SL resin substrates, and the E 1660 ink (Ercon Inc, Wareham, MA) was selected due to its measured lowest average resistivity on the SL substrates. The finished circuit was compared with Printed Circuit Board (PCB) technology for functionality. The electronic components used here include a low voltage battery, LM 555 timer chip, resistors, a thermistor, capacitors, and Light Emitting Diodes (LEDs). This circuit was selected because it (1) represented a simple circuit combining many typically used electronic components and thus provided a useful demonstration for integrated electronic systems manufacturing applicable to a wide variety of devices, and (2) provided an indication of the parasitic resistances and capacitances introduced by the fabrication process due to its sensitivity to manufacturing variation. The hybrid technology can help achieve significant size reductions, enable systems integration in atypical forms, a natural resistance to reverse engineering and possibly increase maximum operating temperatures of electronic circuits as compared to the traditional PCB process. This research demonstrates the ability of the hybrid SL/DW technology for fabricating combined electronic systems for unique electronics applications in which arbitrary form is a requirement and traditional PCB technology cannot be used.Mechanical Engineerin