Channel Characterization for Chip-scale Wireless Communications within Computing Packages

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. WNoC takes advantage of an overlaid network composed by a set of millimeter-wave antennas to reduce latency and increase throughput in the communication between cores. Similarly, wireless inter-chip communication has been also proposed to improve the information transfer between processors, memory, and accelerators in multi-chip settings. However, the wireless channel remains largely unknown in both scenarios, especially in the presence of realistic chip packages. This work addresses the issue by accurately modeling flip-chip packages and investigating the propagation both its interior and its surroundings. Through parametric studies, package configurations that minimize path loss are obtained and the trade-offs observed when applying such optimizations are discussed. Single-chip and multi-chip architectures are compared in terms of the path loss exponent, confirming that the amount of bulk silicon found in the pathway between transmitter and receiver is the main determinant of losses.Comment: To be presented 12th IEEE/ACM International Symposium on Networks-on-Chip (NOCS 2018); Torino, Italy; October 201

A 1.2 V and 69 mW 60 GHz Multi-channel Tunable CMOS Receiver Design

A multi-channel receiver operating between 56 GHz and 70 GHz for coverage of different 60 GHz bands worldwide is implemented with a 90 nm Complementary Metal-Oxide Semiconductor (CMOS) process. The receiver containing an LNA, a frequency down-conversion mixer and a variable gain amplifier incorporating a band-pass filter is designed and implemented. This integrated receiver is tested at four channels of centre frequencies 58.3 GHz, 60.5 GHz, 62.6 GHz and 64.8 GHz, employing a frequency plan of an 8 GHz-intermediate frequency (IF). The achieved conversion gain by coarse gain control is between 4.8 dB–54.9 dB. The millimeter-wave receiver circuit is biased with a 1.2V supply voltage. The measured power consumption is 69 mW

Design and Implementation of HD Wireless Video Transmission System Based on Millimeter Wave

With the improvement of optical fiber communication network construction and the improvement of camera technology, the video that the terminal can receive becomes clearer, with resolution up to 4K. Although optical fiber communication has high bandwidth and fast transmission speed, it is not the best solution for indoor short-distance video transmission in terms of cost, laying difficulty and speed. In this context, this thesis proposes to design and implement a multi-channel wireless HD video transmission system with high transmission performance by using the 60GHz millimeter wave technology, aiming to improve the bandwidth from optical nodes to wireless terminals and improve the quality of video transmission. This thesis mainly covers the following parts: (1) This thesis implements wireless video transmission algorithm, which is divided into wireless transmission algorithm and video transmission algorithm, such as 64QAM modulation and demodulation algorithm, H.264 video algorithm and YUV420P algorithm. (2) This thesis designs the hardware of wireless HD video transmission system, including network processing unit (NPU) and millimeter wave module. Millimeter wave module uses RWM6050 baseband chip and TRX-BF01 rf chip. This thesis will design the corresponding hardware circuit based on the above chip, such as 10Gb/s network port, PCIE. (3) This thesis realizes the software design of wireless HD video transmission system, selects FFmpeg and Nginx to build the sending platform of video transmission system on NPU, and realizes video multiplex transmission with Docker. On the receiving platform of video transmission, FFmpeg and Qt are selected to realize video decoding, and OpenGL is combined to realize video playback. (4) Finally, the thesis completed the wireless HD video transmission system test, including pressure test, Web test and application scenario test. It has been verified that its HD video wireless transmission system can transmit HD VR video with three-channel bit rate of 1.2GB /s, and its rate can reach up to 3.7GB /s, which meets the research goal

Millimeter-Scale and Energy-Efficient RF Wireless System

This dissertation focuses on energy-efficient RF wireless system with millimeter-scale dimension, expanding the potential use cases of millimeter-scale computing devices. It is challenging to develop RF wireless system in such constrained space. First, millimeter-sized antennae are electrically-small, resulting in low antenna efficiency. Second, their energy source is very limited due to the small battery and/or energy harvester. Third, it is required to eliminate most or all off-chip devices to further reduce system dimension. In this dissertation, these challenges are explored and analyzed, and new methods are proposed to solve them. Three prototype RF systems were implemented for demonstration and verification. The first prototype is a 10 cubic-mm inductive-coupled radio system that can be implanted through a syringe, aimed at healthcare applications with constrained space. The second prototype is a 3x3x3 mm far-field 915MHz radio system with 20-meter NLOS range in indoor environment. The third prototype is a low-power BLE transmitter using 3.5x3.5 mm planar loop antenna, enabling millimeter-scale sensors to connect with ubiquitous IoT BLE-compliant devices. The work presented in this dissertation improves use cases of millimeter-scale computers by presenting new methods for improving energy efficiency of wireless radio system with extremely small dimensions. The impact is significant in the age of IoT when everything will be connected in daily life.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/147686/1/yaoshi_1.pd

Millimeter-wave interconnects for intra- and inter-chip transmission and beam steering in NoC-based multi-chip systems

The primary objective of this work is to investigate the communication capabilities of short-range millimeter-wave (mm-wave) communication among Network-on-Chip (NoC) based multi-core processors integrated on a substrate board. To address the demand for high-performance multi-chip computing systems, the present work studies the transmission coefficients between the on-chip antennas system for both intra- and inter-chip communication. It addresses techniques for enhancing transmission by using antenna arrays for beamforming. It also explores new and creative solutions to minimize the adverse effects of silicon on electromagnetic wave propagation using artificial magnetic conductors (AMC). The following summarizes the work performed and future work. Intra- and inter-chip transmission between wireless interconnects implemented as antennas on-chip (AoC), in a wire-bonded chip package are studied 30GHz and 60 GHz. The simulations are performed in ANSYS HFSS, which is based on the finite element method (FEM), to study the transmission and to analyze the electric field distribution. Simulation results have been validated with fabricated antennas at 30 GHz arranged in different orientations on silicon dies that can communicate with inter-chip transmission coefficients ranging from -45dB to -60dB while sustaining bandwidths up to 7GHz. The fabricated antennas show a shift in the resonant frequency to 25GHz. This shift is attributed to the Ground-Signal-Ground (GSG) probes used for measurement and to the Short-Open-Load (SOLT) calibration which has anomalies at millimeter-wave frequencies. Using measurements, a large-scale log-normal channel model is derived which can be used for system-level architecture design. Further, at 60 GHz densely packed multilayer copper wires in NoCs have been modeled to study their impact on the wireless transmission between antennas for both intra- and inter-chip links and are shown to be equivalent to copper sheets. It is seen that the antenna radiation efficiency reduces in the presence of these densely packed wires placed close to the antenna elements. Using this model, the reduction of inter-chip transmission is seen to be about 20dB as compared to a system with no wires. Lastly, the transmission characteristics of the antennas resonating at 60GHz in a flip-chip packaging environment are also presented

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework