Microfabrication of Laser-Driven Accelerator Structures

We discuss the potential for using microfabrication techniques for laser-driven accelerator construction. We introduce microfabrication processes in general, and then describe our investigation of a particular trial process. We conclude by considering the issues microfabrication raises for possible future structures.Comment: 7 pages, 3 figures; Submitted to Tenth Advanced Accelerator Concepts Workshop (AAC 2002), June 23--28, 2002, Mandalay Beach, California (AIP Conference Proceedings

Localization Transition in Incommensurate non-Hermitian Systems

A class of one-dimensional lattice models with incommensurate complex potential $V(\theta)=2[\lambda_r cos(\theta)+i \lambda_i sin(\theta)]$ is found to exhibit localization transition at $|\lambda_r|+|\lambda_i|=1$. This transition from extended to localized states manifests in the behavior of the complex eigenspectum. In the extended phase, states with real eigenenergies have finite measure and this measure goes to zero in the localized phase. Furthermore, all extended states exhibit real spectrum provided $|\lambda_r| \ge |\lambda_i|$. Another novel feature of the system is the fact that the imaginary part of the spectrum is sensitive to the boundary conditions {\it only at the onset to localization}

Lithographic band gap tuning in photonic band gap crystals

We describe the lithographic control over the spectral response of three-dimensional photonic crystals. By precise microfabrication of the geometry using a reproducible and reliable procedure consisting of electron beam lithography followed by dry etching, we have shifted the conduction band of crystals within the near-infrared. Such microfabrication has enabled us to reproducibly define photonic crystals with lattice parameters ranging from 650 to 730 nm. In GaAs semiconductor wafers, these can serve as high-reflectivity (> 95%) mirrors. Here, we show the procedure used to generate these photonic crystals and describe the geometry dependence of their spectral response

Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with 10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.Comment: 13 pages, 5 figure, journal publicatio

Recent Developments in Mems-Based Micro Fuel Cells

Micro fuel cells ($\mu$-FC) represent promising power sources for portable applications. Today, one of the technological ways to make $\mu$-FC is to have recourse to standard microfabrication techniques used in the fabrication of micro electromechanical systems (MEMS). This paper shows an overview on the applications of MEMS techniques on miniature FC by presenting several solutions developed throughout the world. It also describes the latest developments of a new porous silicon-based miniature fuel cell. Using a silane grafted on an inorganic porous media as the proton-exchange membrane instead of a common ionomer such as Nafion, the fuel cell achieved a maximum power density of 58 mW cm-2 at room temperature with hydrogen as fuel.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Numerical Study on the Recoating Process in Microstereolithography

Microstereolithography is a promising RP-based micro-fabrication technique that aims to meet the demands for complex geometry micro-scale parts. Projection microstereolithography incorporates a Dynamic Pattern Generator to obtain high resolution in the parallel plane. However, its lateral resolution has been always limited by the final layer thickness and the long resin settling time, both of which rely on the recoating process. In order to find the critical factors behind the recoating process, a numerical simulation method (Computational Fluid Dynamics, CFD) has been used to investigate the relationships among final layer thickness, settling time, resin viscosity and ratio of object/container size. These results are helpful for the selection of resin characteristics and the design of the microstereolithography machine.Mechanical Engineerin

Chemical patterning for the highly specific and programmed assembly of nanostructures

We have developed a new chemical patterning technique based on standard lithography-based processes to assemble nanostructures on surfaces with extraordinarily high selectivity. This patterning process is used to create patterns of aminosilane molecular layers surrounded by highly inert poly (ethylene glycol) (PEG) molecules. While the aminosilane regions facilitate nanostructure assembly, the PEG coating prevents adsorption of molecules and nanostructures, thereby priming the semiconductor substrate for the highly localized and programmed assembly of nanostructures. We demonstrate the power and versatility of this manufacturing process by building multilayered structures of gold nanoparticles attached to molecules of DNA onto the aminosilane patterns, with zero nanocrystal adsorption onto the surrounding PEG regions. The highly specific surface chemistry developed here can be used in conjunction with standard microfabrication and emerging nanofabrication technology to seamlessly integrate various nanostructures with semiconductor electronics