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4 research outputs found
Interconnect Testing and Test-Path Scheduling for Interposer-Based 2.5-D ICs
Author
Krishnendu Chakrabarty
Ran Wang
Sudipta Bhawmik
Publication venue
'Institute of Electrical and Electronics Engineers (IEEE)'
Publication date
Field of study
No full text
Crossref
Reliable Design of Three-Dimensional Integrated Circuits
Author
Wang Shengcheng
Publication venue
KIT-Bibliothek, Karlsruhe
Publication date
01/01/2018
Field of study
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KITopen
No full text
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