Placement driven retiming with a coupled edge timing model

Retiming is a widely investigated technique for performance optimization. It performs powerful modifications on a circuit netlist. However, often it is not clear, whether the predicted performance improvement will still be valid after placement has been performed. This paper presents a new retiming algorithm using a highly accurate timing model taking into account the effect of retiming on capacitive loads of single wires as well as fanout systems. We propose the integration of retiming into a timing-driven standard cell placement environment based on simulated annealing. Retiming is used as an optimization technique throughout the whole placement process. The experimental results show the benefit of the proposed approach. In comparison with the conventional design flow based on standard FEAS our approach achieved an improvement in cycle time of up to 34% and 17% on the average

Retiming with wire delay and post-retiming register placement.

Tong Ka Yau Dennis.Thesis (M.Phil.)--Chinese University of Hong Kong, 2004.Includes bibliographical references (leaves 77-81).Abstracts in English and Chinese.Chapter 1 --- Introduction --- p.1Chapter 1.1 --- Motivations --- p.1Chapter 1.2 --- Progress on the Problem --- p.2Chapter 1.3 --- Our Contributions --- p.3Chapter 1.4 --- Thesis Organization --- p.4Chapter 2 --- Background on Retiming --- p.5Chapter 2.1 --- Introduction --- p.5Chapter 2.2 --- Preliminaries --- p.7Chapter 2.3 --- Retiming Problem --- p.9Chapter 3 --- Literature Review on Retiming --- p.10Chapter 3.1 --- Introduction --- p.10Chapter 3.2 --- The First Retiming Paper --- p.11Chapter 3.2.1 --- """Retiming Synchronous Circuitry""" --- p.11Chapter 3.3 --- Important Extensions of the Basic Retiming Algorithm --- p.14Chapter 3.3.1 --- """A Fresh Look at Retiming via Clock Skew Optimization""" --- p.14Chapter 3.3.2 --- """An Improved Algorithm for Minimum-Area Retiming""" --- p.16Chapter 3.3.3 --- """Efficient Implementation of Retiming""" --- p.17Chapter 3.4 --- Retiming in Physical Design Stages --- p.19Chapter 3.4.1 --- """Physical Planning with Retiming""" --- p.19Chapter 3.4.2 --- """Simultaneous Circuit Partitioning/Clustering with Re- timing for Performance Optimization" --- p.20Chapter 3.4.3 --- """Performance Driven Multi-level and Multiway Parti- tioning with Retiming" --- p.22Chapter 3.5 --- Retiming with More Sophisticated Timing Models --- p.23Chapter 3.5.1 --- """Retiming with Non-zero Clock Skew, Variable Register, and Interconnect Delay""" --- p.23Chapter 3.5.2 --- """Placement Driven Retiming with a Coupled Edge Tim- ing Model""" --- p.24Chapter 3.6 --- Post-Retiming Register Placement --- p.26Chapter 3.6.1 --- """Layout Driven Retiming Using the Coupled Edge Tim- ing Model""" --- p.26Chapter 3.6.2 --- """Integrating Logic Retiming and Register Placement""" --- p.27Chapter 4 --- Retiming with Gate and Wire Delay [2] --- p.29Chapter 4.1 --- Introduction --- p.29Chapter 4.2 --- Problem Formulation --- p.30Chapter 4.3 --- Optimal Approach [2] --- p.31Chapter 4.3.1 --- Original Mathematical Framework for Retiming --- p.31Chapter 4.3.2 --- A Modified Optimal Approach --- p.33Chapter 4.4 --- Near-Optimal Fast Approach [2] --- p.37Chapter 4.4.1 --- Considering Wire Delay Only --- p.38Chapter 4.4.2 --- Considering Both Gate and Wire Delay --- p.42Chapter 4.4.3 --- Computational Complexity --- p.43Chapter 4.4.4 --- Experimental Results --- p.44Chapter 4.5 --- Lin's Optimal Approach [23] --- p.47Chapter 4.5.1 --- Theoretical Results --- p.47Chapter 4.5.2 --- Algorithm Description --- p.51Chapter 4.5.3 --- Computational Complexity --- p.52Chapter 4.5.4 --- Experimental Results --- p.52Chapter 4.6 --- Summary --- p.54Chapter 5 --- Register Insertion in Placement [36] --- p.55Chapter 5.1 --- Introduction --- p.55Chapter 5.2 --- Problem Formulation --- p.57Chapter 5.3 --- Placement of Registers After Retiming --- p.60Chapter 5.3.1 --- Topology Finding --- p.60Chapter 5.3.2 --- Register Placement --- p.69Chapter 5.4 --- Experimental Results --- p.71Chapter 5.5 --- Summary --- p.74Chapter 6 --- Conclusion --- p.75Bibliography --- p.7

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio

Integrating logic retiming and register placement

Retiming relocates registers in a circuit to shorten the clock cycle time. In deep sub-micron era, conventional pre-layout retiming cannot work properly because of dominant interconnection delay that is not available before layout. Although some retiming algorithms incorporating interconnection delay have been proposed, layout information is still not utilized e ectively nor e ciently. Retiming and layout is combined for the rst time in this paper. We present heuristics for two key problems: interconnection delay estimation and post-retiming incremental placement. An e cient retiming algorithm incorporating interconnection delay is also proposed. Experimental results show that on the average we can improve the circuit speed by 5:4 % targeted toward a0:5um CMOS technology. Scaling down the technology to 0:1um, asmuch as25:6 % improvement have been achieved.