Modelling of grinding mechanics : a review

Grinding is one of the most widely used material removal methods at the end of many process chains. Grinding force is related to almost all grinding parameters, which has a great influence on material removal rate, dimensional and shape accuracy, surface and subsurface integrity, thermodynamics, dynamics, wheel durability, and machining system deformation. Considering that grinding force is related to almost all grinding parameters, grinding force can be used to detect grinding wheel wear, energy calculation, chatter suppression, force control and grinding process simulation. Accurate prediction of grinding forces is important for optimizing grinding parameters and the structure of grinding machines and fixtures. Although there are substantial research papers on grinding mechanics, a comprehensive review on the modeling of grinding mechanics is still absent from the literature. To fill this gap, this work reviews and introduces theoretical methods and applications of mechanics in grinding from the aspects of modeling principles, limitations and possible future trendencies

Elements for the design of precision machine tools and their application to a prototype 450mm Si-wafer grinder

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 155-160).Next generation precision machines will require ever more rigid elements to achieve the required machining tolerances. The presented work focuses on the application of ultra stiff servo-controllable kinematic couplings and hydrostatic bearings to minimize the structural loop of multi-axis precision grinding machines while reducing complexity. The fundamental importance of these ultra stiff, adjustable machine elements is demonstrated in the design of a grinding machine for 450mm diameter silicon wafers. A new generation of silicon wafer grinding machines is needed to back-grind large (450mm diameter) wafers from the production thickness of up to 1 mm down to less than 50pm so as to reduce the cost of Si-wafer based components. The grinding process needs to be done in about 90 sec (fine-grinding, e.g. -200 micron) to 160 sec (coarse grinding, e.g. -600 micron). After completion of the fine grinding process the wafer must be flat to 0.1 pm/o45mm and parallel to 0.6pm/450mm diameter. The surface roughness must be less than Rymax 0.1 pm and Ra 0.01 pm. Even though the required machining forces are 1 N/nm is required, which is many times stiffer than a typical machine tool (0.1 to 0.3 N/nm). In cooperation with industry, this work had the aim of creating a new machine design philosophy, with an example application that focuses on nano-adjustable kinematic coupling and feedback controlled water hydrostatic bearing technology. This new design philosophy is needed to enable the design of a relatively small footprint, compact precision machines. In particular, a ball screw preloaded height adjustable kinematic coupling and a magnetically preloaded hydrostatic thrust bearing were designed and built. The adjustable kinematic coupling allows for up to 8mm of vertical height adjust and 7N/nm stiffness at 26 kN preload. By varying the preload on the coupling by +/- 10%, in-process nm to micron height and tilt adjustment at >95% of the nominal stiffness is possible. Under the assumption of a constant flow supply, the hydrostatic bearing achieves a theoretical stiffness of 1 N/ nm at a 20 micron bearing gap and 7000 N combined gravitational and magnetic preload. In practice, the stiffness is limited by the pressure flow characteristics of the supplying pumps. To increase the bearing stiffness to a required 4N/ nm, various control loops have been developed and tested.by Gerald Rothenhöfer.Ph.D

In-process force monitoring for precision grinding semiconductor silicon wafers

Abstract: Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of grinding forces without introducing compliance into the structural loop of the grinding machine. Aerostatic spindles are used in precision wafer grinding requiring high stiffness and very low error motions (5–25 nm). Several experiments evaluate this force sensing approach in detecting workpiece contact, process monitoring with small depths of cut, and detecting workpiece defects. The results indicate that force measurements offer good performance for monitoring precision wafer grinding since this approach provides excellent contact sensitivity, high signal resolution, and has sufficient bandwidth to detect events occurring within a single revolution of the grinding wheel