Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

Gain Enhancement of On-Chip Wireless interconnects at 60 GHz Using an Artificial Magnetic Conductor

The motivation for this work comes from the increased demand for short range high frequency data communication within and between integrated circuit (IC) chips. The use of wireless interconnects introduces flexibility to the circuit design, reduces power consumption and production costs, since the antennas can be integrated into a standard CMOS process. These findings have been well noted in literature. In addition, wireless interconnects operating in the mm-wave frequency range, at 60GHz, allow for a high data rate of over 1Gb/s for short range of transmissions. The drawback of wireless interconnects operating at high frequencies is the distortion in the radiation pattern caused by the silicon substrate inherent in a standard CMOS process. The high permittivity and a low resistivity of silicon in a CMOS process introduce radiation losses. These losses distort the radiating signal, reducing the directive gain and the antenna efficiency. The objective of the work is to enhance antenna gain and improve the radiation efficiency with the use of a Jerusalem-Cross Artificial Magnetic Conductor (AMC). The Jerusalem Cross AMC can mitigate the effects of the silicon and improve data transmission for inter-Chip data communications. A Yagi antenna was optimized for end-fire radiation in the plane of the chip. It’s performance was studied when it was placed in the center and along the front edge of a standard 10mm by 10mm chip, with the AMC layer extending only below the feed system, Partial AMC, and then compared when it extends under the entire antenna, Full AMC. To examine the transmission characteristics two chips were placed facing one another, on an FR4 slab, with the antennas first placed at the front edges of both chips then in the center of their respective chips. For direct comparison a third configuration was made with one antenna in the center of a chip and the other at the edge of the second chip. The performance of this inter-chip transmission was examined with the three AMC layer configurations: No AMC, Partial AMC, and Full AMC. All simulations were performed using ANSYS HFSS. The results show that the partial AMC improves the performance of the Yagi antenna when it was placed at the front edge of the chip facing out. The directive gain (Endfire direction) with the partial AMC was increased by 0.79 dB or 46% when compared to the antenna without an AMC. The radiation efficiency increased from 39% to 45%. When examining the antenna in the center of the larger substrate the full AMC layer improved performance. The directive gain increased by 0.93 dB or 5%. The full AMC layer improved the directional gain of the antenna in the center of the chip because it is more susceptible to the effects of the silicon substrate. Whereas when placed at the edge of the chip the antenna is mainly radiating in free space and not as influenced by the losses due to the silicon. Which is why the partial AMC improves radiation performance for the antenna placed at the edge of the chip. This is more clearly shown by the transmission results. When both antennas were placed at the front edges of their respective chips with full AMC layers the gain increased by 11% and the radiation efficiency increases by 12%; while when both antennas are placed in the center the directive gain increases by 26% and the radiation efficiency increases by only 2%. In the model with one antenna at the front edge of the first chip and the other antenna in the center of the second chip the full AMC improved the directive gain by 12% and 29% respectively. Both results show that the full AMC has a positive effect on the directive gain of the antenna, especially when placed in the center of the substrate

Wireless Interconnects for Intra-chip & Inter-chip Transmission

With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6’’ silicon wafer with resistivity of 55Ω-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different configurations of antenna orientations and coolants. The return loss and transmission coefficients are simulated using ANSYS HFSS

Interconnect Planning for Physical Design of 3D Integrated Circuits

Vertical stacking—based on modern manufacturing and integration technologies—of multiple 2D chips enables three-dimensional integrated circuits (3D ICs). This exploitation of the third dimension is generally accepted for aiming at higher packing densities, heterogeneous integration, shorter interconnects, reduced power consumption, increased data bandwidth, and realizing highly-parallel systems in one device. However, the commercial acceptance of 3D ICs is currently behind its expectations, mainly due to challenges regarding manufacturing and integration technologies as well as design automation. This work addresses three selected, practically relevant design challenges: (i) increasing the constrained reusability of proven, reliable 2D intellectual property blocks, (ii) planning different types of (comparatively large) through-silicon vias with focus on their impact on design quality, as well as (iii) structural planning of massively-parallel, 3D-IC-specific interconnect structures during 3D floorplanning. A key concept of this work is to account for interconnect structures and their properties during early design phases in order to support effective and high-quality 3D-IC-design flows. To tackle the above listed challenges, modular design-flow extensions and methodologies have been developed. Experimental investigations reveal the effectiveness and efficiency of the proposed techniques, and provide findings on 3D integration with particular focus on interconnect structures. We suggest consideration of these findings when formulating guidelines for successful 3D-IC design automation.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary BibliographyDreidimensional integrierte Schaltkreise (3D-ICs) beruhen auf neuartigen Herstellungs- und Integrationstechnologien, wobei vor allem “klassische” 2D-ICs vertikal zu einem neuartigen 3D-System gestapelt werden. Dieser Ansatz zur Erschließung der dritten Dimension im Schaltkreisentwurf ist nach Expertenmeinung dazu geeignet, höhere Integrationsdichten zu erreichen, heterogene Integration zu realisieren, kürzere Verdrahtungswege zu ermöglichen, Leistungsaufnahmen zu reduzieren, Datenübertragungsraten zu erhöhen, sowie hoch-parallele Systeme in einer Baugruppe umzusetzen. Aufgrund von technologischen und entwurfsmethodischen Schwierigkeiten bleibt jedoch bisher die kommerzielle Anwendung von 3D-ICs deutlich hinter den Erwartungen zurück. In dieser Arbeit werden drei ausgewählte, praktisch relevante Problemstellungen der Entwurfsautomatisierung von 3D-ICs bearbeitet: (i) die Verbesserung der (eingeschränkten) Wiederverwendbarkeit von zuverlässigen 2D-Intellectual-Property-Blöcken, (ii) die komplexe Planung von verschiedenartigen, verhältnismäßig großen Through-Silicion Vias unter Beachtung ihres Einflusses auf die Entwurfsqualität, und (iii) die strukturelle Einbindung von massiv-parallelen, 3D-IC-spezifischen Verbindungsstrukturen während der Floorplanning-Phase. Das Ziel dieser Arbeit besteht darin, Verbindungsstrukturen mit deren wesentlichen Eigenschaften bereits in den frühen Phasen des Entwurfsprozesses zu berücksichtigen. Dies begünstigt einen qualitativ hochwertigen Entwurf von 3D-ICs. Die in dieser Arbeit vorgestellten modularen Entwurfsprozess-Erweiterungen bzw. -Methodiken dienen zur effizienten Lösung der oben genannten Problemstellungen. Experimentelle Untersuchungen bestätigen die Wirksamkeit sowie die Effektivität der erarbeiten Methoden. Darüber hinaus liefern sie praktische Erkenntnisse bezüglich der Anwendung von 3D-ICs und der Planung deren Verbindungsstrukturen. Diese Erkenntnisse sind zur Ableitung von Richtlinien für den erfolgreichen Entwurf von 3D-ICs dienlich.:1 Introduction 1.1 The 3D Integration Approach for Electronic Circuits 1.2 Technologies for 3D Integrated Circuits 1.3 Design Approaches for 3D Integrated Circuits 2 State of the Art in Design Automation for 3D Integrated Circuits 2.1 Thermal Management 2.2 Partitioning and Floorplanning 2.3 Placement and Routing 2.4 Power and Clock Delivery 2.5 Design Challenges 3 Research Objectives 4 Planning Through-Silicon Via Islands for Block-Level Design Reuse 4.1 Problems for Design Reuse in 3D Integrated Circuits 4.2 Connecting Blocks Using Through-Silicon Via Islands 4.2.1 Problem Formulation and Methodology Overview 4.2.2 Net Clustering 4.2.3 Insertion of Through-Silicon Via Islands 4.2.4 Deadspace Insertion and Redistribution 4.3 Experimental Investigation 4.3.1 Wirelength Estimation 4.3.2 Configuration 4.3.3 Results and Discussion 4.4 Summary and Conclusions 5 Planning Through-Silicon Vias for Design Optimization 5.1 Deadspace Requirements for Optimized Planning of Through-Silicon Vias 5.2 Multiobjective Design Optimization of 3D Integrated Circuits 5.2.1 Methodology Overview and Configuration 5.2.2 Techniques for Deadspace Optimization 5.2.3 Design-Quality Analysis 5.2.4 Planning Different Types of Through-Silicon Vias 5.3 Experimental Investigation 5.3.1 Configuration 5.3.2 Results and Discussion 5.4 Summary and Conclusions 6 3D Floorplanning for Structural Planning of Massive Interconnects 6.1 Block Alignment for Interconnects Planning in 3D Integrated Circuits 6.2 Corner Block List Extended for Block Alignment 6.2.1 Alignment Encoding 6.2.2 Layout Generation: Block Placement and Alignment 6.3 3D Floorplanning Methodology 6.3.1 Optimization Criteria and Phases and Related Cost Models 6.3.2 Fast Thermal Analysis 6.3.3 Layout Operations 6.3.4 Adaptive Optimization Schedule 6.4 Experimental Investigation 6.4.1 Configuration 6.4.2 Results and Discussion 6.5 Summary and Conclusions 7 Research Summary, Conclusions, and Outlook Dissertation Theses Notation Glossary Bibliograph

High-performance and Low-power Clock Network Synthesis in the Presence of Variation.

Semiconductor technology scaling requires continuous evolution of all aspects of physical design of integrated circuits. Among the major design steps, clock-network synthesis has been greatly affected by technology scaling, rendering existing methodologies inadequate. Clock routing was previously sufficient for smaller ICs, but design difficulty and structural complexity have greatly increased as interconnect delay and clock frequency increased in the 1990s. Since a clock network directly influences IC performance and often consumes a substantial portion of total power, both academia and industry developed synthesis methodologies to achieve low skew, low power and robustness from PVT variations. Nevertheless, clock network synthesis under tight constraints is currently the least automated step in physical design and requires significant manual intervention, undermining turn-around-time. The need for multi-objective optimization over a large parameter space and the increasing impact of process variation make clock network synthesis particularly challenging. Our work identifies new objectives, constraints and concerns in the clock-network synthesis for systems-on-chips and microprocessors. To address them, we generate novel clock-network structures and propose changes in traditional physical-design flows. We develop new modeling techniques and algorithms for clock power optimization subject to tight skew constraints in the presence of process variations. In particular, we offer SPICE-accurate optimizations of clock networks, coordinated to reduce nominal skew below 5 ps, satisfy slew constraints and trade-off skew, insertion delay and power, while tolerating variations. To broaden the scope of clock-network-synthesis optimizations, we propose new techniques and a methodology to reduce dynamic power consumption by 6.8%-11.6% for large IC designs with macro blocks by integrating clock network synthesis within global placement. We also present a novel non-tree topology that is 2.3x more power-efficient than mesh structures. We fuse several clock trees to create large-scale redundancy in a clock network to bridge the gap between tree-like and mesh-like topologies. Integrated optimization techniques for high-quality clock networks described in this dissertation strong empirical results in experiments with recent industry-released benchmarks in the presence of process variation. Our software implementations were recognized with the first-place awards at the ISPD 2009 and ISPD 2010 Clock-Network Synthesis Contests organized by IBM Research and Intel Research.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/89711/1/ejdjsy_1.pd

Design and automation of voltage-scaled clock networks

In this dissertation, a vital step of VLSI physical design flow, synthesis of clock distribution networks, is investigated. Clock network synthesis (CNS) involves large and complex optimization problems to achieve high performance and low power demands of current integrated circuits (ICs). Ineffectiveness of existing methodologies to provide high performance at lower voltage nodes is the main driver for this dissertation research. A design and automation flow for voltage-scaled clock networks is proposed to satisfy tight timing constraints at high frequency (for high performance) and low voltage (for low power) operation. One implementation of voltage-scaled clock networks is low (voltage) swing clocking, which is a known technique, yet its applicability remains limited to designs with low performance demands. In this dissertation, novel methodologies are introduced to i) apply low swing clocking to legacy designs as a power saving methodology, ii) develop a complete CNS flow for low swing clocking of high performance ICs. These methodologies include slew-driven approaches that are better suited to future transistor and interconnect technologies. Second implementation of voltage-scaled clock networks is multi-voltage clocking, which is another known technique, yet its applicability remains limited to clock tree topology. In this dissertation, multi-voltage clocking with a clock mesh topology is investigated in order to address a missing aspect in the current IC design flows. Practical considerations of the current IC design flows are also investigated in this dissertation to expand the applicability of the proposed CNS flow. A novel methodology is introduced to facilitate clock gating within low swing clocking. The applicability of low swing clocking to FinFET technology, which is currently the industry norm, is shown to be effective.Ph.D., Electrical Engineering -- Drexel University, 201