Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and operational environment will individually dictate the packaging requirement. Due to the lack of standardized testing procedures, the reliability of those MEMS packages sometimes can only be proven by taking into consideration its functionality over lifetime. Innovation with regards to cost reduction and standardization in the field of packaging is therefore of utmost importance to the speed of commercialisation of MEMS devices. Nowadays heavily driven by consumer applications the MEMS device market is forecasted to enjoy a compound annual growth rate (CAGR) above 13%, which is when compared to the IC device market, an outstanding growth rate. Nevertheless this forecasted value can drift upwards or downwards depending on the rate of innovation in the field of packaging. MEMS devices typically require a specific fabrication process where the device wafer is bonded to a second wafer which effectively encapsulates the MEMS structure. This method leaves the device free to move within a vacuum or an inert gas atmosphere.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Development of system supervision and control software for a micromanipulation system

This paper presents the realization of a modular software architecture that is capable of handling the complex supervision structure of a multi degree of freedom open architecture and reconfigurable micro assembly workstation. This software architecture initially developed for a micro assembly workstation is later structured to form a framework and design guidelines for precise motion control and system supervision tasks explained subsequently through an application on a micro assembly workstation. The software is separated by design into two different layers, one for real-time and the other for non-realtime. These two layers are composed of functional modules that form the building blocks for the precise motion control and the system supervision of complex mechatronics systems

Micro-manufacturing : research, technology outcomes and development issues

Besides continuing effort in developing MEMS-based manufacturing techniques, latest effort in Micro-manufacturing is also in Non-MEMS-based manufacturing. Research and technological development (RTD) in this field is encouraged by the increased demand on micro-components as well as promised development in the scaling down of the traditional macro-manufacturing processes for micro-length-scale manufacturing. This paper highlights some EU funded research activities in micro/nano-manufacturing, and gives examples of the latest development in micro-manufacturing methods/techniques, process chains, hybrid-processes, manufacturing equipment and supporting technologies/device, etc., which is followed by a summary of the achievements of the EU MASMICRO project. Finally, concluding remarks are given, which raise several issues concerning further development in micro-manufacturing

Using Cross-Linked SU-8 to Flip-Chip Bond, Assemble, and Package MEMS Devices

This paper investigates using an SU-8 photoresist as an adhesive material for flip-chip bonding, assembling, and packaging microelectromechanical systems devices. An important factor, when using SU-8 as an adhesive material is to control ultraviolet (UV) exposure during fabrication to maximize bond strength due to material cross linking. This approach is much improved over previous efforts where SU-8 bake times and temperatures where changed to alter material cross-linking. In this paper, bake times and temperatures were maintained constant and total UV exposure energy was varied. Once fabricated, bond strength was systematically tested to determine the tensile loads needed to separate bonded structures. The resulting separation force was shown to increase with UV exposure and ranged from 0.25 (5-s exposure) to 1.25 N (15-s exposure). The separation test data were then analyzed to determine the statistical significance of varying UV exposure time and its effect on SU-8 cross-linking and bond strength. The data show that total UV exposure dose is directly correlated with the bond strength of SU-8 bonded structures. By varying only UV dose, the separation force data exhibited a statistically significant dependence on SU-8 cross linking with a 5% probability of error. Further, SU-8 etch resiliency increased by approximately 40%-60% as cross linking was increased with UV exposures ranging from 5 to 15 s

Parameter Identification of Pressure Sensors by Static and Dynamic Measurements

Fast identification methods of pressure sensors are investigated. With regard to a complete accurate sensor parameter identification two different measurement methods are combined. The approach consists on one hand in performing static measurements - an applied pressure results in a membrane deformation measured interferometrically and the corresponding output voltage. On the other hand optical measurements of the modal responses of the sensor membranes are performed. This information is used in an inverse identification algorithm to identify geometrical and material parameters based on a FE model. The number of parameters to be identified is thereby generally limited only by the number of measurable modal frequencies. A quantitative evaluation of the identification results permits furthermore the classification of processing errors like etching errors. Algorithms and identification results for membrane thickness, intrinsic stress and output voltage will be discussed in this contribution on the basis of the parameter identification of relative pressure sensors.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features

EFAB (Electrochemical FABrication) is a new SFF process with the potential to economically fabricate prototypes or mass production quantities of functional, mesoscale-microscale parts and mechanisms. EFAB generates an entire layer simultaneously-versus serially, as with most SFF. Based on electrodeposition, EFAB allows ultra-thin layers (2-10 microns, or even submicron) that minimize stairsteps, and generates a net-shape, fully-dense metal structure that can be homogeneous and isotropic. Minimum feature width is approximately 25 microns, and can be reduced further. EFAB can be used to manufacture micromachines and microelectromechanical systems (MEMS), offering significant advantages over current processes: e.g., true 3-D geometry, IC compatibility, low capital investment, and process automation.Mechanical Engineerin

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Design, evaluation, and control of nexus: a multiscale additive manufacturing platform with integrated 3D printing and robotic assembly.

Additive manufacturing (AM) technology is an emerging approach to creating three-dimensional (3D) objects and has seen numerous applications in medical implants, transportation, aerospace, energy, consumer products, etc. Compared with manufacturing by forming and machining, additive manufacturing techniques provide more rapid, economical, efficient, reliable, and complex manufacturing processes. However, additive manufacturing also has limitations on print strength and dimensional tolerance, while traditional additive manufacturing hardware platforms for 3D printing have limited flexibility. In particular, part geometry and materials are limited to most 3D printing hardware. In addition, for multiscale and complex products, samples must be printed, fabricated, and transferred among different additive manufacturing platforms in different locations, which leads to high cost, long process time, and low yield of products. This thesis investigates methods to design, evaluate, and control the NeXus, which is a novel custom robotic platform for multiscale additive manufacturing with integrated 3D printing and robotic assembly. NeXus can be used to prototype miniature devices and systems, such as wearable MEMS sensor fabrics, microrobots for wafer-scale microfactories, tactile robot skins, next generation energy storage (solar cells), nanostructure plasmonic devices, and biosensors. The NeXus has the flexibility to fixture, position, transport, and assemble components across a wide spectrum of length scales (Macro-Meso-Micro-Nano, 1m to 100nm) and provides unparalleled additive process capabilities such as 3D printing through both aerosol jetting and ultrasonic bonding and forming, thin-film photonic sintering, fiber loom weaving, and in-situ Micro-Electro-Mechanical System (MEMS) packaging and interconnect formation. The NeXus system has a footprint of around 4m x 3.5m x 2.4m (X-Y-Z) and includes two industrial robotic arms, precision positioners, multiple manipulation tools, and additive manufacturing processes and packaging capabilities. The design of the NeXus platform adopted the Lean Robotic Micromanufacturing (LRM) design principles and simulation tools to mitigate development risks. The NeXus has more than 50 degrees of freedom (DOF) from different instruments, precise evaluation of the custom robots and positioners is indispensable before employing them in complex and multiscale applications. The integration and control of multi-functional instruments is also a challenge in the NeXus system due to different communication protocols and compatibility. Thus, the NeXus system is controlled by National Instruments (NI) LabVIEW real-time operating system (RTOS) with NI PXI controller and a LabVIEW State Machine User Interface (SMUI) and was programmed considering the synchronization of various instruments and sequencing of additive manufacturing processes for different tasks. The operation sequences of each robot along with relevant tools must be organized in safe mode to avoid crashes and damage to tools during robots’ motions. This thesis also describes two demonstrators that are realized by the NeXus system in detail: skin tactile sensor arrays and electronic textiles. The fabrication process of the skin tactile sensor uses the automated manufacturing line in the NeXus with pattern design, precise calibration, synchronization of an Aerosol Jet printer, and a custom positioner. The fabrication process for electronic textiles is a combination of MEMS fabrication techniques in the cleanroom and the collaboration of multiple NeXus robots including two industrial robotic arms and a custom high-precision positioner for the deterministic alignment process

A Workstation for microassembly

In this paper, an open-architecture, reconfigurable microassembly workstation for efficient and reliable assembly of micromachined parts is presented. The workstation is designed to be used as a research tool for investigation of the problems in microassembly. The development of such a workstation includes the design of: (i) a manipulation system consisting of motion stages providing necessary travel range and precision for the realization of assembly tasks, (ii) a vision system to visualize the microworld and the determination of the position and orientation of micro components to be assembled, (iii) a robust control system and necessary mounts for the end effectors in such a way that according to the task to be realized, the manipulation tools can be easily changed and the system will be ready for the predefined task. In addition tele-operated and semi-automated assembly concepts are implemented. The design is verified by implementing the range of the tasks in micro-parts manipulation. The versatility of the workstation is demonstrated and high accuracy of positioning is sho