High Density out-of-Plane Microprobe Array

MEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures, which included bridge, cantilever and membrane structures. Even the more complex structures were no exception. The cantilever with the property of simple design and easy fabrication among three kinds of fundamental structure, therefore, it was popular used in the design of MEMS device.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Development and testing of a micromachined probe card.

This thesis is concerned with the design, fabrication and testing of micro scale probes. The probes were designed to act as temporary electrical connections to allow wafer level testing of integrated circuits. The work initially focused on the creation of free standing nickel cantilevers, angled up from the substrate with probe tips at the free end. These were fabricated using a novel method, combining pseudo grey scale lithography and thick photoresist sacrificial layers. Detailed analysis of the fabrication method, in particular the resist processing and lithography was undertaken and the limitations of the method explored.EThOS - Electronic Theses Online ServiceGBUnited Kingdo