568 research outputs found

    Macromodeling of Electrical Interconnects and Packages via PEEC Approach

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    Addressing Computational Complexity of High Speed Distributed Circuits Using Model Order Reduction

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    Advanced in the fabrication technology of integrated circuits (ICs) over the last couple of years has resulted in an unparalleled expansion of the functionality of microelectronic systems. Today’s ICs feature complex deep-submicron mixed-signal designs and have found numerous applications in industry due to their lower manufacturing costs and higher performance levels. The tendency towards smaller feature sizes and increasing clock rates is placing higher demands on signal integrity design by highlighting previously negligible interconnect effects such as distortion, reflection, ringing, delay, and crosstalk. These effects if not predicted in the early stages of the design cycle can severely degrade circuit performance and reliability. The objective of this thesis is to develop new model order reduction (MOR) techniques to minimize the computational complexity of non-linear circuits and electronic systems that have delay elements. MOR techniques provide a mechanism to generate reduced order models from the detailed description of the original modified nodal analysis (MNA) formulation. The following contributions are made in this thesis: 1. The first project presents a methodology for reduction of Partial Element Equivalent Circuit (PEEC) models. PEEC method is widely used in electromagnetic compatibility and signal integrity problems in both the time and frequency domains. The PEEC model with retardation has been applied to 3-D analysis but often result in large and dense matrices, which are computationally expensive to solve. In this thesis, a new moment matching technique based on Multi-order Arnoldi is described to model PEEC networks with retardation. 2. The second project deals with developing an efficient model order reduction algorithm for simulating large interconnect networks with nonlinear elements. The proposed methodology is based on a multidimensional subspace method and uses constraint equations to link the nonlinear elements and biasing sources to the reduced order model. This approach significantly improves the simulation time of distributed nonlinear systems, since additional ports are not required to link the nonlinear elements to the reduced order model, yielding appreciable savings in the size of the reduced order model and computational time. 3. A parameterized reduction technique for nonlinear systems is presented. The proposed method uses multidimensional subspace and variational analysis to capture the variances of design parameters and approximates the weakly nonlinear functions as a Taylor series. An SVD approach is presented to address the efficiency of reduced order model. The proposed methodology significantly improves the simulation time of weakly nonlinear systems since the size of the reduced system is smaller than the original system and a new reduced model is not required each time a design parameter is changed

    Fast methods for full-wave electromagnetic simulations of integrated circuit package modules

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    Fast methods for the electromagnetic simulation of integrated circuit (IC) package modules through model order reduction are demonstrated. The 3D integration of multiple functional IC chip/package modules on a single platform gives rise to geometrically complex structures with strong electromagnetic phenomena. This motivates our work on a fast full-wave solution for the analysis of such modules, thus contributing to the reduction in design cycle time without loss of accuracy. Traditionally, fast design approaches consider only approximate electromagnetic effects, giving rise to lumped-circuit models, and therefore may fail to accurately capture the signal integrity, power integrity, and electromagnetic interference effects. As part of this research, a second order frequency domain full-wave susceptance element equivalent circuit (SEEC) model will be extracted from a given structural layout. The model so obtained is suitably reduced using model order reduction techniques. As part of this effort, algorithms are developed to produce stable and passive reduced models of the original system, enabling fast frequency sweep analysis. Two distinct projection-based second order model reduction approaches will be considered: 1) matching moments, and 2) matching Laguerre coefficients, of the original system's transfer function. Further, the selection of multiple frequency shifts in these schemes to produce a globally representative model is also studied. Use of a second level preconditioned Krylov subspace process allows for a memory-efficient way to address large size problems.Ph.D.Committee Chair: Swaminathan Madhavan; Committee Member: Papapolymerou John; Committee Member: Chatterjee Abhijit; Committee Member: Peterson Andrew; Committee Member: Sitaraman Sures

    Dual approach to circuit quantization using loop charges

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    The conventional approach to circuit quantization is based on node fluxes and traces the motion of node charges on the islands of the circuit. However, for some devices, the relevant physics can be best described by the motion of polarization charges over the branches of the circuit that are in general related to the node charges in a highly nonlocal way. Here, we present a method, dual to the conventional approach, for quantizing planar circuits in terms of loop charges. In this way, the polarization charges are directly obtained as the differences of the two loop charges on the neighboring loops. The loop charges trace the motion of fluxes through the circuit loops. We show that loop charges yield a simple description of the flux transport across phase-slip junctions. We outline a concrete construction of circuits based on phase-slip junctions that are electromagnetically dual to arbitrary planar Josephson junction circuits. We argue that loop charges also yield a simple description of the flux transport in conventional Josephson junctions shunted by large impedances. We show that a mixed circuit description in terms of node fluxes and loop charges yields an insight into the flux decompactification of a Josephson junction shunted by an inductor. As an application, we show that the fluxonium qubit is well approximated as a phase-slip junction for the experimentally relevant parameters. Moreover, we argue that the 00-π\pi qubit is effectively the dual of a Majorana Josephson junction.Comment: 20 pages, 11 figures. Version accepted for publication in PRB. Changes: introduction has become less technical and an example for the inclusion of offset charges has been adde

    Tensor Computation: A New Framework for High-Dimensional Problems in EDA

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    Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System
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