Estudi de la coautoria de publicacions científiques entre UPC i nou universitats dels Estats Units: Brown University, University of Chicago, Northwestern University, Stanford University, Columbia University, Cornell University, Harvard University, Princeton University i Duke University

S'analitza la coautoria de la UPC amb autors vinculats a institucions acadèmiques dels Estats Units, per totes les àrees temàtiques i sense considerar límits cronològics o documentals.Postprint (published version

A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components that may be unreliable. In order to do so, it is crucial to understand the close interplay between the different layers of a system: technology, platform, and application. This will enable the most general tradeoff exploration, reaping the most benefits in power, performance and reliability. This paper surveys various cross layer techniques and approaches for power, performance, and reliability tradeoffs are technology, circuit, architecture and application layers. © 2013 Elsevier B.V. All rights reserved