Heterogeneous 2.5D integration on through silicon interposer

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity

Constraint-Aware, Scalable, and Efficient Algorithms for Multi-Chip Power Module Layout Optimization

Moving towards an electrified world requires ultra high-density power converters. Electric vehicles, electrified aerospace, data centers, etc. are just a few fields among wide application areas of power electronic systems, where high-density power converters are essential. As a critical part of these power converters, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the emerging MCPM layouts is surpassing the capability of a manual, iterative design process to produce an optimum design with agile development requirements. An electronic design automation tool called PowerSynth has been introduced with ongoing research toward enhanced capabilities to speed up the optimized MCPM layout design process. This dissertation presents the PowerSynth progression timeline with the methodology updates and corresponding critical results compared to v1.1. The first released version (v1.1) of PowerSynth demonstrated the benefits of layout abstraction, and reduced-order modeling techniques to perform rapid optimization of the MCPM module compared to the traditional, manual, and iterative design approach. However, that version is limited by several key factors: layout representation technique, layout generation algorithms, iterative design-rule-checking (DRC), optimization algorithm candidates, etc. To address these limitations, and enhance PowerSynth’s capabilities, constraint-aware, scalable, and efficient algorithms have been developed and implemented. PowerSynth layout engine has evolved from v1.3 to v2.0 throughout the last five years to incorporate the algorithm updates and generate all 2D/2.5D/3D Manhattan layout solutions. These fundamental changes in the layout generation methodology have also called for updates in the performance modeling techniques and enabled exploring different optimization algorithms. The latest PowerSynth 2 architecture has been implemented to enable electro-thermo-mechanical and reliability optimization on 2D/2.5D/3D MCPM layouts, and set up a path toward cabinet-level optimization. PowerSynth v2.0 computer-aided design (CAD) flow has been hardware-validated through manufacturing and testing of an optimized novel 3D MCPM layout. The flow has shown significant speedup compared to the manual design flow with a comparable optimization result

Circuit Design Obfuscation for Hardware Security

Nowadays, chip design and chip fabrication are normally conducted separately by independent companies. Most integrated circuit (IC) design companies are now adopting a fab-less model: they outsource the chip fabrication to offshore foundries while concentrating their effort and resource on the chip design. Although it is cost-effective, the outsourced design faces various security threats since the offshore foundries might not be trustworthy. Attacks on the outsourced IC design can take on many forms, such as piracy, counterfeiting, overproduction and malicious modification, which are referred to as IC supply chain attacks. In this work, we investigate several circuit design obfuscation techniques to prevent the IC supply chain attacks by untrusted foundries. Logic locking is a gate-level design obfuscation technique that's proposed to protect the outsourced IC designs from piracy and counterfeiting by untrusted foundries. A locked IC preserves the correct functionality only when a correct key is provided. Recently, the security of logic locking is threatened by a strong attack called SAT attack, which can decipher the correct key of most logic locking techniques within a few hours even for a reasonably large key-size. In this dissertation, we investigate design techniques to improve the security of logic locking in three directions. Firstly, we propose a new locking technique called Anti-SAT to thwart the SAT attack. The Anti-SAT can make the complexity of SAT attack grow exponentially in key-size, hence making the attack computationally infeasible. Secondly, we consider an approximate version of SAT attack and investigate its application on fault-tolerant hardware such as neural network chips. Countermeasure to this approximate SAT attack is proposed and validated with rigorous proof and experiments. Lastly, we explore new opportunities in obfuscating the parametric characteristics of a circuit design (e.g. timing) so that another layer of defense can be added to existing countermeasures. Split fabrication based on 3D integration technology is another approach to obfuscate the outsourced IC designs. 3D integration is a technology that integrates multiple 2D dies to create a single high-performance chip, referred to as 3D IC. With 3D integration, a designer can choose a portion of IC design at his discretion and send them to a trusted foundry for secure fabrication while outsourcing the rest to untrusted foundries for advanced fabrication technology. In this dissertation, we propose a security-aware physical design flow for interposer-based 3D IC (also known as 2.5D IC). The design flow consists of security-aware partitioning and placement phases, which aim at obfuscating the circuit while preventing potential attacks such as proximity attack. Simulation results show that our proposed design flow is effective for producing secure chip layouts against the IC supply chain attacks. The circuit design obfuscation techniques presented in this dissertation enable future chip designers to take security into consideration at an early phase while optimizing the chip's performance, power, and reliability

US Microelectronics Packaging Ecosystem: Challenges and Opportunities

The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more features into the silicon footprint. One promising approach is Heterogeneous Integration (HI), which involves advanced packaging techniques to integrate independently designed and manufactured components using the most suitable process technology. However, adopting HI introduces design and security challenges. To enable HI, research and development of advanced packaging is crucial. The existing research raises the possible security threats in the advanced packaging supply chain, as most of the Outsourced Semiconductor Assembly and Test (OSAT) facilities/vendors are offshore. To deal with the increasing demand for semiconductors and to ensure a secure semiconductor supply chain, there are sizable efforts from the United States (US) government to bring semiconductor fabrication facilities onshore. However, the US-based advanced packaging capabilities must also be ramped up to fully realize the vision of establishing a secure, efficient, resilient semiconductor supply chain. Our effort was motivated to identify the possible bottlenecks and weak links in the advanced packaging supply chain based in the US.Comment: 22 pages, 8 figure

Design, Extraction, and Optimization Tool Flows and Methodologies for Homogeneous and Heterogeneous Multi-Chip 2.5D Systems

Chip and packaging industries are making significant progress in 2.5D design as a result of increasing popularity of their application. In advanced high-density 2.5D packages, package redistribution layers become similar to chip Back-End-of-Line routing layers, and the gap between them scales down with pin density improvement. Chiplet-package interactions become significant and severely affect system performance and reliability. Moreover, 2.5D integration offers opportunities to apply novel design techniques. The traditional die-by-die design approach neither carefully considers these interactions nor fully exploits the cross-boundary design opportunities. This thesis presents chiplet-package cross-boundary design, extraction, analysis, and optimization tool flows and methodologies for high-density 2.5D packaging technologies. A holistic flow is presented that can capture all parasitics from chiplets and the package and improve system performance through iterative optimizations. Several design techniques are demonstrated for agile development and quick turn-around time. To validate the flow in silicon, a chip was taped out and studied in TSMC 65nm technology. As the holistic flow cannot handle heterogeneous technologies, in-context flows are presented. Three different flavors of the in-context flow are presented, which offer trade-offs between scalability and accuracy in heterogeneous 2.5D system designs. Inductance is an inseparable part of a package design. A holistic flow is presented that takes package inductance into account in timing analysis and optimization steps. Custom CAD tools are developed to make these flows compatible with the industry standard tools and the foundry model. To prove the effectiveness of the flows several design cases of an ARM Cortex-M0 are implemented for comparitive study

Doctor of Philosophy

dissertationMicrowave/millimeter-wave imaging systems have become ubiquitous and have found applications in areas like astronomy, bio-medical diagnostics, remote sensing, and security surveillance. These areas have so far relied on conventional imaging devices (empl

A Survey on Integrated Circuit Trojans

Traditionally, computer security has been associated with the software security, or the information-data security. Surprisingly, the hardware on which the software executes or the information stored-processed-transmitted has been assumed to be a trusted base of security. The main building blocks of any electronic device are Integrated circuits (ICs) which form the fabric of a computer system. Lately, the use of ICs has expanded from handheld calculators and personal computers (PCs) to smartphones, servers, and Internet-of-Things (IoT) devices. However, this significant growth in the IC market created intense competition among IC vendors, leading to new trends in IC manufacturing. System-on-chip (SoC) design based on intellectual property (IP), a globally spread supply chain of production and distribution of ICs are the foremost of these trends. The emerging trends have resulted in many security and trust weaknesses and vulnerabilities, in computer systems. This includes Hardware Trojans attacks, side-channel attacks, Reverse-engineering, IP piracy, IC counterfeiting, micro probing, physical tampering, and acquisition of private or valuable assets by debugging and testing. IC security and trust vulnerabilities may cause loss of private information, modified/altered functions, which may cause a great economical hazard and big damage to society. Thus, it is crucial to examine the security and trust threats existing in the IC lifecycle and build defense mechanisms against IC Trojan threats. In this article, we examine the IC supply chain and define the possible IC Trojan threats for the parties involved. Then we survey the latest progress of research in the area of countermeasures against the IC Trojan attacks and discuss the challenges and expectations in this area. Keywords: IC supply chain, IC security, IP privacy, hardware trojans, IC trojans DOI: 10.7176/CEIS/12-2-01 Publication date: April 30th 202