Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Design Space Exploration and Resource Management of Multi/Many-Core Systems

The increasing demand of processing a higher number of applications and related data on computing platforms has resulted in reliance on multi-/many-core chips as they facilitate parallel processing. However, there is a desire for these platforms to be energy-efficient and reliable, and they need to perform secure computations for the interest of the whole community. This book provides perspectives on the aforementioned aspects from leading researchers in terms of state-of-the-art contributions and upcoming trends

Exploration Methodology for BTI-Induced Failures on RRAM-Based Edge AI Systems

Resistive switching memory technologies (RRAM) are seen by most of the scientific community as an enabler for Edge-level applications such as embedded deep Learning, AI or signal processing of audio and video signals. However, going beyond a "simple'' replacement of eFlash in micro-controller and introducing RRAM inside the memory hierarchy is not a straightforward move. Indeed, integrating a RRAM technology inside the cache hierarchy requires higher endurance requirement than for eFlash replacement, and thus necessitates relaxed programming conditions. By doing so, the reliability bottleneck is moved from programming to the read operations (i.e., read margin is reduced and the risk of read failure is increased). Based on this observation, in this work, we propose to explore how Edge-level applications running on a RRAM-based Edge device could fail because of Bias Temperature Instability (BTI). BTI causes threshold voltage (Vt) degradation on the transistors along the memory WordLines (WL), leading to a reduction of the read margin along regularly used WLs. We thereby propose a 3-steps methodology consisting in (i) characterizing the RRAM bitcell and identifying beyond which Vt shift the read operation is going to fail. (ii) characterizing applications and extracting the memory traces. And (iii) running a long term BTI simulation to extract the actual Vt shift of the bitcells sharing the same array WordLine. Based on this, we show that for a 1T1R bitcell featuring a 250% High/Low Resistance State (HRS/LRS) ratio, read failures tend to happen after less than a month in the case of a constantly running convolution kernel. These simulations highlight the fact that transistor-level reliability can be critical for embedded RRAM and that specific workload aware simulation frameworks are required to assess their effects