Resistance switching of electrodeposited cuprous oxide

In this work, the resistance switching behavior of electrodeposited cuprous oxide (Cu2O) thin films in Au/Cu2O/top electrode (Pt, Au-Pd, Al) cells was studied. After an initial FORMING process, the fabricated cells show reversible switching between a low resistance state (16.6 Ω) and a high resistance state (0.4 x 106 Ω). Changing the resistance states in cuprous oxide films depends on the magnitude of the applied voltage which corresponds to unipolar resistance switching behavior of this material. The endurance and retention tests indicate a potential application of the fabricated cells for nonvolatile resistance switching random access memory (RRAM). The results suggest formation and rupture of one or several nanoscale copper filaments as the resistance switching mechanism in the cuprous oxide films. At high electric voltage in the as-deposited state of Au/Cu2O/Au-Pd cell structure, the conduction behavior follows Poole-Frenkel emission. Various parameters, such as the compliance current, the cuprous oxide microstructure, the cuprous oxide thickness, top electrode area, and top electrode material, affect the resistance switching characteristics. The required FORMING voltage is higher for Au/Cu2O/Al cell compared with the Au/Cu2O/Pt which is related to the Schottky behavior of Al contact with Cu2O. Cu2O nanowires in Au-Pt/ Cu2O/Au-Pt cell also show resistance switching behavior, indicating scalable potential of this cell for usage as RRAM. After an initial FORMING process under an electric field of 3 x 106 V/m, the Cu2O nanowire is switched to the LRS. During the FORMING process physical damages are observed in the cell, which may be caused by Joule heating and gas evolution --Abstract, page iii

Treated HfO2 based rram devices with ru, tan, tin as top electrode for in-memory computing hardware

The scalability and power efficiency of the conventional CMOS technology is steadily coming to a halt due to increasing problems and challenges in fabrication technology. Many non-volatile memory devices have emerged recently to meet the scaling challenges. Memory devices such as RRAMs or ReRAM (Resistive Random-Access Memory) have proved to be a promising candidate for analog in memory computing applications related to inference and learning in artificial intelligence. A RRAM cell has a MIM (Metal insulator metal) structure that exhibits reversible resistive switching on application of positive or negative voltage. But detailed studies on the power consumption, repeatability and retention of during multi-level operation have not been undertaken previously. Transition metal oxide-based RRAMs, using HfO2, executes change in resistance (switching behavior) via electrochemical migration of oxygen vacancies. This thesis investigates the role of extra oxygen vacancies, introduced by plasma exposure (treated), in HfO2 to reduce the power consumption of RRAM. In addition to oxygen vacancy rich HfO2, various top metal electrodes including Ruthenium (Ru) are explored to enhance the switching behavior and power consumption. Use of Ru as a top metal reduced the switching energy of the treated HfO2 RRAM device

Status and Prospects of ZnO-Based Resistive Switching Memory Devices

In the advancement of the semiconductor device technology, ZnO could be a prospective alternative than the other metal oxides for its versatility and huge applications in different aspects. In this review, a thorough overview on ZnO for the application of resistive switching memory (RRAM) devices has been conducted. Various efforts that have been made to investigate and modulate the switching characteristics of ZnO-based switching memory devices are discussed. The use of ZnO layer in different structure, the different types of filament formation, and the different types of switching including complementary switching are reported. By considering the huge interest of transparent devices, this review gives the concrete overview of the present status and prospects of transparent RRAM devices based on ZnO. ZnO-based RRAM can be used for flexible memory devices, which is also covered here. Another challenge in ZnO-based RRAM is that the realization of ultra-thin and low power devices. Nevertheless, ZnO not only offers decent memory properties but also has a unique potential to be used as multifunctional nonvolatile memory devices. The impact of electrode materials, metal doping, stack structures, transparency, and flexibility on resistive switching properties and switching parameters of ZnO-based resistive switching memory devices are briefly compared. This review also covers the different nanostructured-based emerging resistive switching memory devices for low power scalable devices. It may give a valuable insight on developing ZnO-based RRAM and also should encourage researchers to overcome the challenges

Memristors using solution-based IGZO nanoparticles

Solution-based indium-gallium-zinc oldde (IGZO) nanoparticles deposited by spin coating have been investigated as a resistive switching layer in metal-insulator-metal structures for nonvolatile memory applications. Optimized devices show a bipolar resistive switching behavior, low programming voltages of +/- 1 V, on/off ratios higher than 10, high endurance, and a retention time of up to 104 s. The better performing devices were achieved with annealing temperatures of 200 degrees C and using asymmetric electrode materials of titanium and silver. The physics behind the improved switching properties of the devices is discussed in terms of the oxygen deficiency of IGZO. Temperature analysis of the conductance states revealed a nonmetallic filamentary conduction. The presented devices are potential candidates for the integration of memory functionality into low-cost System-on-Panel technology.National Funds through FCT - Portuguese Foundation for Science and Technology [UID/CTM/50025/2013, SFRH/BDP/99136/2013]; FEDER [POCI-01-0145-FEDER-007688]info:eu-repo/semantics/publishedVersio

The Efficacy of Programming Energy Controlled Switching in Resistive Random Access Memory (RRAM)

Current state-of-the-art memory technologies such as FLASH, Static Random Access Memory (SRAM) and Dynamic RAM (DRAM) are based on charge storage. The semiconductor industry has relied on cell miniaturization to increase the performance and density of memory technology, while simultaneously decreasing the cost per bit. However, this approach is not sustainable because the charge-storage mechanism is reaching a fundamental scaling limit. Although stack engineering and 3D integration solutions can delay this limit, alternate strategies based on non-charge storage mechanisms for memory have been introduced and are being actively pursued. Resistive Random Access Memory (RRAM) has emerged as one of the leading candidates for future high density non-volatile memory. The superior scalability of RRAMs is based on the highly localized active switching region and filamentary conductive path. Coupled with its simple structure and compatibility with complementary metal oxide semiconductor (CMOS) processes; RRAM cells have demonstrated switching performance comparable to volatile memory technologies such as DRAMs and SRAMs. However, there are two serious barriers to RRAM commercialization. The first is the variability of the resistance state which is associated with the inherent randomness of the resistive switching mechanism. The second is the filamentary nature of the conductive path which makes it susceptible to noise. In this experimental thesis, a novel program-verify (P-V) technique was developed with the objective to specifically address the programming errors and to provide solutions to the most challenging issues associated with these intrinsic failures in current RRAM technology. The technique, called Compliance-free Ultra-short Smart Pulse Programming (CUSPP), utilizes sub-nanosecond pulses in a compliance-free setup to minimize the programming energy delivered per pulse. In order to demonstrate CUSPP, a custom-built picosecond pulse generator and feedback control circuit was designed. We achieved high (108 cycles) endurance with state verification for each cycle and established high-speed performance, such as 100 ps write/erase speed and 500 kHz cycling rate of HfO2-based RRAM cells. We also investigate switching failure and the short-term instability of the RRAM using CUSPP

Solution-based IGZO nanoparticles memristor

This work aims to characterize Indium-Gallium-Zinc-Oxide nanoparticles (IGZOnp) as a resistive switching matrix in metal-insulator-metal (MIM) structures for memristor application. IGZOnp was produced by low cost solution-based process and deposited by spin-coating technique. Several top and bottom electrodes combinations, including IZO, Pt, Au, Ti, Ag were investigated to evaluate memory performance, yield and switching properties. The effect of ambient and annealing temperature using 350 ºC and 200 ºC was also analysed in order to get more insight into resistive switching mechanism. The Ag/IGZOnp/Ti memristor structure annealed at 200 ºC exhibits the best results with a large yield. The device shows a self-compliant bipolar resistive switching behavior. The switching event is achieved by the set/reset voltages of -1 V/+1 V respectively with an operating window of 10, and it can be programmed for more than 100 endurance cycles. The retention time of on and off-states is up to 104 s. The obtained results suggest that Ag/IGZOnp/Ti structure could be applied in system on a panel (SoP) as a viable device

Leakage current and resistive switching mechanisms in SrTiO3

PhD ThesisResistive switching random access memory devices have attracted considerable attention due to exhibiting fast programming, non-destructive readout, low power-consumption, high-density integration, and low fabrication-cost. Resistive switching has been observed in a wide range of materials but the underpinning mechanisms still have not been understood completely. This thesis presents a study of the leakage current and resistive switching mechanisms of SrTiO3 metal-insulator-metal devices fabricated using atomic layer deposition and pulse laser deposition techniques. First, the conduction mechanisms in SrTiO3 are investigated. The leakage current characteristics are highly sensitive to the polarity and magnitude of applied voltage bias, punctuated by sharp increases at high field. The characteristics are also asymmetric with bias and the negative to positive current crossover point always occurs at a negative voltage bias. A model comprising thermionic field emission and tunnelling phenomena is proposed to explain ii the dependence of leakage current upon the device parameters quantitatively. SrTiO3 also demonstrates bipolar switching behaviour where the current-density versus voltage (J-V) characteristics show asymmetry at all temperatures examined, with resistive switching behaviour observed at elevated temperatures. The asymmetry is explained by the relative lack of electron traps at one electrode, which is determined from the symmetric J-V curve obtained at room temperature due to the redistribution of the dominant electrical defects in the film. Evidence is presented for a model of resistive switching that originates from defect diffusion (possibly oxygen vacancies) at high temperatures. Finally, a peculiar resistive switching behaviour was observed in pulse laser deposited SrTiO3. This switching depends on both the amplitude and polarity of the applied voltage, and cannot be described as either bipolar or unipolar resistive switching. This behaviour is termed antipolar due to the opposite polarity of the set voltage relative to the previous reset voltage. The proposed model based on electron injection by tunnelling at interfaces and a Poole-Frenkel mechanism through the bulk is extended to explain the antipolar resistive switching behaviour. This model is quantified by use of a simple mathematical equation to simulate the experimental results

RESISTIVE SWITCHING CHARACTERISTICS OF NANOSTRUCTURED AND SOLUTION-PROCESSED COMPLEX OXIDE ASSEMBLIES

Miniaturization of conventional nonvolatile (NVM) memory devices is rapidly approaching the physical limitations of the constituent materials. An emerging random access memory (RAM), nanoscale resistive RAM (RRAM), has the potential to replace conventional nonvolatile memory and could foster novel type of computing due to its fast switching speed, high scalability, and low power consumption. RRAM, or memristors, represent a class of two terminal devices comprising an insulating layer, such as a metal oxide, sandwiched between two terminal electrodes that exhibits two or more distinct resistance states that depend on the history of the applied bias. While the sudden resistance reduction into a conductive state in metal oxide insulators has been known for almost 50 years, the fundamental resistive switching mechanism is a complex phenomenon that is still long-debated, complex process. Further improvements to existing memristor performance require a complete understanding of memristive properties under various operation conditions. Additional technical issues also remain, such as the development of facile, low-cost fabrication methods as an alternative to expensive, ultra-high vacuum (UHV) deposition methods. This collection of work explores resistive switching within metal oxide-based memristive material assemblies by analyzing the fundamental physical insulating material properties. Chapter 3 aims to translate the utility and simplicity of the highly ordered anodic aluminum oxide (AAO) template structure to complex, yet more functional (memristive) materials. Functional oxides possessing ordered, scalable nanoporous arrays and nanocapacitor arrays over a large area is of interest to both the fields of next-generation electronics and energy storing/harvesting devices. Here their switching performance will be evaluated using conductive atomic force microscopy (C-AFM). Chapter 4 demonstrates a convective self-assembly fabrication method that effectively enables the synthesis of a low-cost solution processed memristor comprising binary oxide and perovskite ABO3 nanocrystals of varying diameter. Chapter 5 systematically compares the influence of inter-nanoparticle distance on the threshold switching SET voltage of hafnium oxide (HfO2) memristors. Utilizing shorter phosphonic acid ligands with higher binding affinity on the nanocrystal surface enabled a record-low SET voltage to be achieved. Chapter 6 extends the scope to the fine tuning of solution processed memristors with two types of perovskites nanocrystals. The primary advantage of nanocrystal memristors is the ability to draw from additional degrees of freedom by tuning the constituent nanocrystal material properties. Recent advancement of solution phase techniques enables a high degree of controllability over the nanocrystal size and structure. Thus, this work found in this dissertation aims to understand and decouple the effects of the geometric size and substitutional nanocrystal parameters on resistive switching