Using MCD-DVS for dynamic thermal management performance improvement

With chip temperature being a major hurdle in microprocessor design, techniques to recover the performance loss due to thermal emergency mechanisms are crucial in order to sustain performance growth. Many techniques for power reduction in the past and some on thermal management more recently have contributed to alleviate this problem. Probably the most important thermal control technique is dynamic voltage and frequency scaling (DVS) which allows for almost cubic reduction in power with worst-case performance penalty only linear. So far, DVS techniques for temperature control have been studied at the chip level. Finer grain DVS is feasible if a globally-asynchronous locally-synchronous (GALS) design style is employed. GALS, also known as multiple-clock domain (MCD), allows for an independent voltage and frequency control for each one of the clock domains that are part of the chip. There are several studies on DVS for GALS that aim to improve energy and power efficiency but not temperature. This paper proposes and analyses the usage of DVS at the domain level to control temperature in a clustered MCD microarchitecture with the goal of improving the performance of applications that do not meet the thermal constraints imposed by the designers.Peer ReviewedPostprint (published version

Distributing the Frontend for Temperature Reduction

Due to increasing power densities, both on-chip average and peak temperatures are fast becoming a serious bottleneck in processor design. This is due to the cost of removing the heat generated, and the performance impact of dealing with thermal emergencies. So far microarchitectural techniques to control temperature have mainly focused on the processor backend (in particular the execution units), whereas the frontend has not received much attention. However, as the temperature of the backend remains controlled and the processor throughput increases, the heat dissipated by the frontend becomes more significant, and one of the major contributors to the total average temperature. This paper proposes and evaluates a distributed frontend for clustered microarchitectures that is able to reduce power density and temperature. First, a distributed mechanism for renaming and committing instructions is proposed. Second, a sub-banked trace cache with a bank hopping mechanism is presented. Finally, a method to improve the sub-banking is proposed based on a biased mapping function to distribute bank accesses to balance temperature. 1

Distributing the frontend for temperature reduction

Due to increasing power densities, both on-chip average and peak temperatures are fast becoming a serious bottleneck in processor design. This is due to the cost of removing the heat generated, and the performance impact of dealing with thermal emergencies. So far microarchitectural techniques to control temperature have mainly focused on the processor backend (in particular the execution units), whereas the frontend has not received much attention. However, as the temperature of the backend remains controlled and the processor throughput increases, the heat dissipated by the frontend becomes more significant, and one of the major contributors to the total average temperature. This paper proposes and evaluates a distributed frontend for clustered microarchitectures that is able to reduce power density and temperature. First, a distributed mechanism for renaming and committing instructions is proposed. Second, a sub-banked trace cache with a bank hopping mechanism is presented. Finally, a method to improve the sub-banking is proposed based on a biased mapping function to distribute bank accesses to balance temperature.Peer Reviewe