A Second-Order ΣΔ ADC using sputtered IGZO TFTs with multilayer dielectric

This dissertation combines materials science and electronics engineering to implement, for the first time, a 2nd-order ∑∆ ADC using oxide TFTs. The transistors employ a sputtered IGZO semiconductor and an optimizeddielectric layer, based on mixtures of sputtered Ta2O5and SiO2. These dielectrics are studied in multilayer configurations, being the best results achieved for 7 layers: IG7.5 MV/cm, while keeping κ>10, yielding a major improvement over Ta2O5single-layer. After annealing at 200 °C, TFTs with these dielectrics exhibit μSAT≈13 cm2/Vs, On/Off≈107and S≈0.2 V/dec. An a-Si:H TFT RPI model is adapted to simulate these devices with good fitting to experimental data. Concerning circuits, the ∑∆ architecture is naturally selected to deal with device mismatch. After design optimization, ADC simulations achieve SNDR≈57 dB, DR≈65 dB and power dissipation, approximately, of 22 mW (VDD=10 V), which are above the current state-of-the-art for competing thinfilm technologies, such as organics or even LTPS. Mask layouts are currently under verification to enable successful circuit fabrication in the next months.This work is a major step towards the design of complex multifunctional electronic systems with oxide TFT technology, being integrated in ongoing EU-funded and FCT-funded research projects at CENIMAT and UNINOVA

Design of sigma-delta modulators for analog-to-digital conversion intensively using passive circuits

This thesis presents the analysis, design implementation and experimental evaluation of passiveactive discrete-time and continuous-time Sigma-Delta (ΣΔ) modulators (ΣΔMs) analog-todigital converters (ADCs). Two prototype circuits were manufactured. The first one, a discrete-time 2nd-order ΣΔM, was designed in a 130 nm CMOS technology. This prototype confirmed the validity of the ultra incomplete settling (UIS) concept used for implementing the passive integrators. This circuit, clocked at 100 MHz and consuming 298 μW, achieves DR/SNR/SNDR of 78.2/73.9/72.8 dB, respectively, for a signal bandwidth of 300 kHz. This results in a Walden FoMW of 139.3 fJ/conv.-step and Schreier FoMS of 168 dB. The final prototype circuit is a highly area and power efficient ΣΔM using a combination of a cascaded topology, a continuous-time RC loop filter and switched-capacitor feedback paths. The modulator requires only two low gain stages that are based on differential pairs. A systematic design methodology based on genetic algorithm, was used, which allowed decreasing the circuit’s sensitivity to the circuit components’ variations. This continuous-time, 2-1 MASH ΣΔM has been designed in a 65 nm CMOS technology and it occupies an area of just 0.027 mm2. Measurement results show that this modulator achieves a peak SNR/SNDR of 76/72.2 dB and DR of 77dB for an input signal bandwidth of 10 MHz, while dissipating 1.57 mW from a 1 V power supply voltage. The ΣΔM achieves a Walden FoMW of 23.6 fJ/level and a Schreier FoMS of 175 dB. The innovations proposed in this circuit result, both, in the reduction of the power consumption and of the chip size. To the best of the author’s knowledge the circuit achieves the lowest Walden FOMW for ΣΔMs operating at signal bandwidth from 5 MHz to 50 MHz reported to date