State detection of bond wires in IGBT modules using eddy current pulsed thermography

Insulated gate bipolar transistor (IGBT) modules are important safety critical components in electrical power systems. Bond wire lift-off, a plastic deformation between wire bond and adjacent layers of a device caused by repeated power/thermal cycles, is the most common failure mechanism in IGBT modules. For the early detection and characterization of such failures, it is important to constantly detect or monitor the health state of IGBT modules, and the state of bond wires in particular. This paper introduces eddy current pulsed thermography (ECPT), a nondestructive evaluation technique, for the state detection and characterization of bond wire lift-off in IGBT modules. After the introduction of the experimental ECPT system, numerical simulation work is reported. The presented simulations are based on the 3-D electromagnetic-thermal coupling finite-element method and analyze transient temperature distribution within the bond wires. This paper illustrates the thermal patterns of bond wires using inductive heating with different wire statuses (lifted-off or well bonded) under two excitation conditions: nonuniform and uniform magnetic field excitations. Experimental results show that uniform excitation of healthy bonding wires, using a Helmholtz coil, provides the same eddy currents on each, while different eddy currents are seen on faulty wires. Both experimental and numerical results show that ECPT can be used for the detection and characterization of bond wires in power semiconductors through the analysis of the transient heating patterns of the wires. The main impact of this paper is that it is the first time electromagnetic induction thermography, so-called ECPT, has been employed on power/electronic devices. Because of its capability of contactless inspection of multiple wires in a single pass, and as such it opens a wide field of investigation in power/electronic devices for failure detection, performance characterization, and health monitoring

Radio frequency non-destructive testing and evaluation of defects under insulation

PhD ThesisThe use of insulation such as paint coatings has grown rapidly over the past decades. However, defects and corrosion under insulation (CUI) still present challenges for current non-destructive testing and evaluation (NDT&E) techniques. One of such challenges is the large lift-off introduced by thick insulation layer. Inaccessibility due to insulation leads corrosion and defects to be undetected, which can lead to catastrophic failure. Furthermore, lift-off effects due to the insulation layers reduce the sensitivities. The limitations of existing NDT&E techniques heighten the need for novel approaches to the characterisation of corrosion and defects under insulation. This research project is conducted in collaboration with International Paint®, and a radio frequency non-destructive evaluation for monitoring structural condition is proposed. High frequency (HF) passive RFID in conjunction with microwave NDT is proposed for monitoring and imaging under insulation. The small-size, battery-free and cost-efficient nature of RFID makes it attractive for long-term condition monitoring. To overcome the limitations of RFID-based sensing system such as effective monitoring area and lift-off tolerance, microwave NDT is proposed for the imaging of larger areas under thick insulation layers. Experimental studies are carried out in conjunction with specially designed mild steel sample sets to demonstrate the detection capabilities of the proposed systems. The contributions of this research can be summarised as follows. Corrosion detection using HF passive RFID-based sensing and microwave NDT is demonstrated in experimental feasibility studies considering variance in surface roughness, conductivity and permeability. The lift-off effects introduced by insulation layers are reduced by applying feature extraction with principal component analysis and non-negative matrix factorisation. The problem of thick insulation layers is overcome by employing a linear sweep frequency with PCA to improve the sensitivity and resolution of microwave NDT-based imaging. Finally, the merits of microwave NDT are identified for imaging defects under thick insulation in a realistic test scenario. In conclusion, HF passive RFID can be adapted for long term corrosion monitoring of steel under insulation, but sensing area and lift-off tolerance are limited. In contrast, the microwave NDT&E has shown greater potential and capability for monitoring corrosion and defects under insulation