Statistical Reliability Estimation of Microprocessor-Based Systems

What is the probability that the execution state of a given microprocessor running a given application is correct, in a certain working environment with a given soft-error rate? Trying to answer this question using fault injection can be very expensive and time consuming. This paper proposes the baseline for a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success. The presented work goes beyond the dependability evaluation problem; it also has the potential to become the backbone for new tools able to help engineers to choose the best hardware and software architecture to structurally maximize the probability of a correct execution of the target softwar

Fault-tolerant sub-lithographic design with rollback recovery

Shrinking feature sizes and energy levels coupled with high clock rates and decreasing node capacitance lead us into a regime where transient errors in logic cannot be ignored. Consequently, several recent studies have focused on feed-forward spatial redundancy techniques to combat these high transient fault rates. To complement these studies, we analyze fine-grained rollback techniques and show that they can offer lower spatial redundancy factors with no significant impact on system performance for fault rates up to one fault per device per ten million cycles of operation (Pf = 10^-7) in systems with 10^12 susceptible devices. Further, we concretely demonstrate these claims on nanowire-based programmable logic arrays. Despite expensive rollback buffers and general-purpose, conservative analysis, we show the area overhead factor of our technique is roughly an order of magnitude lower than a gate level feed-forward redundancy scheme

Combined Time and Information Redundancy for SEU-Tolerance in Energy-Efficient Real-Time Systems

Recently the trade-off between energy consumption and fault-tolerance in real-time systems has been highlighted. These works have focused on dynamic voltage scaling (DVS) to reduce dynamic energy dissipation and on time redundancy to achieve transient-fault tolerance. While the time redundancy technique exploits the available slack time to increase the fault-tolerance by performing recovery executions, DVS exploits slack time to save energy. Therefore we believe there is a resource conflict between the time-redundancy technique and DVS. The first aim of this paper is to propose the usage of information redundancy to solve this problem. We demonstrate through analytical and experimental studies that it is possible to achieve both higher transient fault-tolerance (tolerance to single event upsets (SEU)) and less energy using a combination of information and time redundancy when compared with using time redundancy alone. The second aim of this paper is to analyze the interplay of transient-fault tolerance (SEU-tolerance) and adaptive body biasing (ABB) used to reduce static leakage energy, which has not been addressed in previous studies. We show that the same technique (i.e. the combination of time and information redundancy) is applicable to ABB-enabled systems and provides more advantages than time redundancy alone

Extensive SEU impact analysis of a PIC microprocessor for selective hardening

In order to increase the robustness of a circuit against SEUs, fault injection is commonly used to locate weak areas. autonomous emulation is a very powerful tool to locate these areas by executing huge fault injection campaigns. In this work, fault injection has been extensively applied to a PIC18 microprocessor, while executing three different workloads. A 80 million fault campaign has been performed, and results show that a failure rate lower than 1% can be obtained by hardening a 24% of the circuit flip-flops, for the given applications