Radiation safety based on the sky shine effect in reactor

In the reactor operation, neutrons and gamma rays are the most dominant radiation. As protection, lead and concrete shields are built around the reactor. However, the radiation can penetrate the water shielding inside the reactor pool. This incident leads to the occurrence of sky shine where a physical phenomenon of nuclear radiation sources was transmitted panoramic that extends to the environment. The effect of this phenomenon is caused by the fallout radiation into the surrounding area which causes the radiation dose to increase. High doses of exposure cause a person to have stochastic effects or deterministic effects. Therefore, this study was conducted to measure the radiation dose from sky shine effect that scattered around the reactor at different distances and different height above the reactor platform. In this paper, the analysis of the radiation dose of sky shine effect was measured using the experimental metho

Clock Network Design for 2.5D Heterogeneous Systems

The CMOS process technology scaling may have reached its pinnacle, yet not all ele- ments of computing can be manufactured at lower technological nodes. This has led to the development of a new branch of chip designing that allows chiplets on different technolog- ical nodes to be integrated on to a single package using interposers, the passive intercon- nection mediums. However, establishing a high-frequency communication over an entirely passive layer is one of the significant design challenges of 2.5D systems. My research will focus on building a robust clocking architecture for 2.5D systems, using a 64 core processor benchmark. The clocking scheme of any 2.5D design consists of two major components, viz., Interposer Clocking, and On-Chiplet Clocking. The interposer clocking consists of clocks used to achieve global synchronicity and clocks for inter-chiplet communication es- tablished using AIB protocol. These clocking components will be built using commercial EDA tools and analyzed using standard tools, and package/interconnect models. I will also be comparing these results against a 2D design of the same benchmark and against a differ- ent 2.5D clocking architecture to study if the 2.5D clock network can be designed to offer better power performance than the 2D counterpart.M.S

Power Reduction Techniques in Clock Distribution Networks with Emphasis on LC Resonant Clocking

In this thesis we propose a set of independent techniques in the overall concept of LC resonant clocking where each technique reduces power consumption and improve system performance. Low-power design is becoming a crucial design objective due to the growing demand on portable applications and the increasing difficulties in cooling and heat removal. The clock distribution network delivers the clock signal which acts as a reference to all sequential elements in the synchronous system. The clock distribution network consumes a considerable amount of power in synchronous digital systems. Resonant clocking is an emerging promising technique to reduce the power of the clock network. The inductor used in resonant clocking enables the conversion of the electric energy stored on the clock capacitance to magnetic energy in the inductor and vice versa. In this thesis, the concept of the slack in the clock skew has been extended for an LC fully-resonant clock distribution network. This extra slack in comparison to standard clock distribution networks can be used to reduce routing complexity, achieve reduction in wire elongation, total wire length, and power consumption. Simulation results illustrate that by utilizing the proposed approach, an average reduction of 53% in the number of wire elongations and 11% reduction in total wire length can be achieved. A dual-edge clocking scheme introduced in the literature to enable the operation of the flip-flop at the rising- and falling edges of the clock has been modified. The interval by which the charging elements in the flip-flop are being switched-on was reduced causing a reduction in power consumption. Simulating the flip-flop in STMicroelectronics 90-nm technology shows correct functionality of the Sense Amplifier flip-flop with a resonant clock signal of 500 MHz and a throughput of 1 GHz under process, voltage, and temperature (PVT) variations. Modeling the resonant system with the proposed flip-flop illustrates that dual-edge compared to single-edge triggering can achieve up to 58% reduction in power consumption when the clock capacitance is the dominating factor. The application of low-swing clocking to LC resonant clock distribution network has been investigated on-chip. The proposed low-swing resonant clocking scheme operates with one voltage supply and does not require an additional supply voltage. The Differential Conditional Capturing flip-flop introduced in the literature was modified to operate with a low-swing sinusoidal clock. Low-swing resonant clocking achieved around 5.8% reduction in total power with 5.7% area overhead. Modeling the clock network with the proposed flip-flop illustrates that low-swing clocking can achieve up to 58% reduction in the power consumption of the resonant clock. An analytical approach was introduced to estimate the required driver strength in the clock generator. Using the proposed approach early in the design stage reduces area and power overhead by eliminating the need for programmable switches in the driving circuit

Méthodologies de conception ASIC pour des systèmes sur puce 3D hétérogènes à base de réseaux sur puce 3D

Dans cette thèse, nous étudions les architectures 3D NoC grâce à des implémentations de conception physiques en utilisant la technologie 3D réel mis en oeuvre dans l'industrie. Sur la base des listes d'interconnexions en déroute, nous procédons à l'analyse des performances d'évaluer le bénéfice de l'architecture 3D par rapport à sa mise en oeuvre 2D. Sur la base du flot de conception 3D proposé en se concentrant sur la vérification temporelle tirant parti de l'avantage du retard négligeable de la structure de microbilles pour les connexions verticales, nous avons mené techniques de partitionnement de NoC 3D basé sur l'architecture MPSoC y compris empilement homogène et hétérogène en utilisant Tezzaron 3D IC technlogy. Conception et mise en oeuvre de compromis dans les deux méthodes de partitionnement est étudiée pour avoir un meilleur aperçu sur l'architecture 3D de sorte qu'il peut être exploitée pour des performances optimales. En utilisant l'approche 3D homogène empilage, NoC topologies est explorée afin d'identifier la meilleure topologie entre la topologie 2D et 3D pour la mise en œuvre MPSoC 3D sous l'hypothèse que les chemins critiques est fondée sur les liens inter-routeur. Les explorations architecturales ont également examiné les différentes technologies de traitement. mettant en évidence l'effet de la technologie des procédés à la performance d'architecture 3D en particulier pour l'interconnexion dominant du design. En outre, nous avons effectué hétérogène 3D d'empilage pour la mise en oeuvre MPSoC avec l'approche GALS de style et présenté plusieurs analyses de conception physiques connexes concernant la conception 3D et la mise en œuvre MPSoC utilisant des outils de CAO 2D. Une analyse plus approfondie de l'effet microbilles pas à la performance de l'architecture 3D à l'aide face-à-face d'empilement est également signalé l'identification des problèmes et des limitations à prendre en considération pendant le processus de conception.In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the proposed 3D design flow focusing on timing verification by leveraging the benefit of negligible delay of microbumps structure for vertical connections, we have conducted partitioning techniques for 3D NoC-based MPSoC architecture including homogeneous and heterogeneous stacking using Tezzaron 3D IC technlogy. Design and implementation trade-off in both partitioning methods is investigated to have better insight about 3D architecture so that it can be exploited for optimal performance. Using homogeneous 3D stacking approach, NoC architectures are explored to identify the best topology between 2D and 3D topology for 3D MPSoC implementation. The architectural explorations have also considered different process technologies highlighting the wire delay effect to the 3D architecture performance especially for interconnect-dominated design. Additionally, we performed heterogeneous 3D stacking of NoC-based MPSoC implementation with GALS style approach and presented several physical designs related analyses regarding 3D MPSoC design and implementation using 2D EDA tools. Finally we conducted an exploration of 2D EDA tool on different 3D architecture to evaluate the impact of 2D EDA tools on the 3D architecture performance. Since there is no commercialize 3D design tool until now, the experiment is important on the basis that designing 3D architecture using 2D EDA tools does not have a strong and direct impact to the 3D architecture performance mainly because the tools is dedicated for 2D architecture design.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF

Modeling and Design Techniques for 3-D ICs under Process, Voltage, and Temperature Variations

Three-dimensional (3-D) integration is a promising solution to further enhance the density and performance of modern integrated circuits (ICs). In 3-D ICs, multiple dies (tiers or planes) are vertically stacked. These dies can be designed and fabricated separately. In addition, these dies can be fabricated in different technologies. The effect of different sources of variations on 3-D circuits, consequently, differ from 2-D ICs. As technology scales, these variations significantly affect the performance of circuits. Therefore, it is increasingly important to accurately and efficiently model different sources of variations in 3-D ICs. The process, voltage, and temperature variations in 3-D ICs are investigated in this dissertation. Related modeling and design techniques are proposed to design a robust 3-D IC. Process variations in 3-D ICs are first analyzed. The effect of process variations on synchronization and 3-D clock distribution networks, is carefully studied. A novel statistical model is proposed to describe the timing variation in 3-D clock distribution networks caused by process variations. Based on this model, different topologies of 3-D clock distribution networks are compared in terms of skew variation. A set of guidelines is proposed to design 3-D clock distribution networks with low clock uncertainty. Voltage variations are described by power supply noise. Power supply noise in 3-D ICs is investigated considering different characteristics of potential 3-D power grids in this thesis. A new algorithm is developed to fast analyze the steady-state IR-drop in 3-D power grids. The first droop of power supply noise, also called resonant supply noise, is usually the deepest voltage drop in power distribution networks. The effect of resonant supply noise on 3-D clock distribution networks is investigated. The combined effect of process variations and power supply noise is modeled by skitter consisting of both skew and jitter. A novel statistical model of skitter is proposed. Based on this proposed model and simulation results, a set of guidelines has been proposed to mitigate the negative effect of process and voltage variations on 3-D clock distribution networks. Thermal issues in 3-D ICs are considered by carefully modeling thermal through silicon vias (TTSVs) in this dissertation. TTSVs are vertical vias which do not carry signals, dedicated to facilitate the propagation of heat to reduce the temperature of 3-D ICs. Two analytic models are proposed to describe the heat transfer in 3-D circuits related to TTSVs herein, providing proper closed-form expressions for the thermal resistance of the TTSVs. The effect of different physical and geometric parameters of TTSVs on the temperature of 3-D ICs is analyzed. The proposed models can be used to fast and accurately estimate the temperature to avoid the overuse of TTSVs occupying a large portion of area. A set of models and design techniques is proposed in this dissertation to describe and mitigate the deleterious effects of process, voltage, and temperature variations in 3-D ICs. Due to the continuous shrink in the feature size of transistors, the large number of devices within one circuit, and the high operating frequency, the effect of these variations on the performance of 3-D ICs becomes increasingly significant. Accurately and efficiently estimating and controlling these variations are, consequently, critical tasks for the design of 3-D ICs

Clock Distribution Networks in 3-D Integrated Systems

Abstract—3-D integration is an important technology that addresses fundamental limitations in on-chip interconnects. Several design issues related to 3-D circuits, such as multiplane synchronization, however, need to be addressed. A comparison of three 3-D clock distribution network topologies is presented in this paper. Good agreement is shown between the modeled and experimental results of a 3-D test circuit composed of three device planes. Successful operation of the 3-D test circuit at 1.4 GHz is demonstrated. Clock skew, clock delay, signal slew, and power dissipation measurements for the different clock topologies are also provided. The measurements suggest that each topology provides certain advantages and disadvantages in terms of different performance criteria. The proper choice, consequently, of a clock distribution network is not dictated by a single design objective but rather by the overall 3-D system design requirements including availability of resources and number of bonded planes. Index Terms—3-D clock characterization, 3-D clock distribution, 3-D clock modeling, 3-D synchronization. I