Electrical Connection Network Within an Electrically Conductive Adhesive

This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and differences between failures within soldered joints and electrically conductive adhesive joints. This article compares theoretical models with real measurement and properties of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described

Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed

Integral skin electrode for electrocardiography is expendable

Inexpensive, expendable skin electrode for use in electrocardiography combines an electrical contact, conductive paste, and a skin-attachment adhesive. Application of the electrode requires only degreasing of the skin area

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail

Method and apparatus for detection and location of microleaks Patent

Microleak detector mounted on weld seam of propellant tank of launch vehicl

Method for making a hot wire anemometer and product thereof

A hot wire anemometer probe is described that includes a ceramic body supporting two conductive rods parallel to each other. The body has a narrow edge surface from which the rods protrude. A probe wire is welded to the rods and extends along the edge surface. A ceramic adhesive is used to secure the probe wire to the surface so that the probe wire is rigid. A method for fabricating the probe is also described in which the body is molded and precisely shaped by machining techniques before the probe wires are installed

Thermal conductive connection and method of making same Patent

Thermal conductive, electrically insulated cleavable adhesive connection between electronic module and heat sin

Preparation of Electrically Conductive Adhesives Modified with AgNO3

The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler particles and decrease electrical resistivity of adhesive this way. Ag+ ions have been formed by dissociation of AgNO3. Adhesives formed of bisphenol epoxy resin and silver flakes (one component and two components types) have been used for experiments. Two ways have been used for modification of adhesives with AgNO3: nitrate has been added in adhesive and dissociated during curing and annealing of adhesive, or nitrate has been dissociated in ethanol at first and this solution has been mixed up into adhesive. It has been found an improvement of electrical conductivity of two components adhesive after this modification

Inkjet Printing of Functional Electronic Memory Cells: A Step Forward to Green Electronics

open access journalNowadays, the environmental issues surrounding the production of electronics, from the perspectives of both the materials used and the manufacturing process, are of major concern. The usage, storage, disposal protocol and volume of waste material continue to increase the environmental footprint of our increasingly “throw away society”. Almost ironically, society is increasingly involved in pollution prevention, resource consumption issues and post-consumer waste management. Clearly, a dichotomy between environmentally aware usage and consumerism exists. The current technology used to manufacture functional materials and electronic devices requires high temperatures for material deposition processes, which results in the generation of harmful chemicals and radiation. With such issues in mind, it is imperative to explore new electronic functional materials and new manufacturing pathways. Here, we explore the potential of additive layer manufacturing, inkjet printing technology which provides an innovative manufacturing pathway for functional materials (metal nanoparticles and polymers), and explore a fully printed two terminal electronic memory cell. In this work, inkjetable materials (silver (Ag) and poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS)) were first printed by a piezoelectric Epson Stylus P50 inkjet printer as stand-alone layers, and secondly as part of a metal (Ag)/active layer (PEDOT:PSS)/metal (Ag) crossbar architecture. The quality of the individual multi-layers of the printed Ag and PEDOT:PSS was first evaluated via optical microscopy and scanning electron microscopy (SEM). Furthermore, an electrical characterisation of the printed memory elements was performed using an HP4140B picoammeter

Developing the knowledge-based human resources that support the implementation of the National Dual Training System (NDTS): evaluation of TVET teacher's competency at MARA Training Institutions

Development in the world of technical and vocational education and training (TVET) on an ongoing basis is a challenge to the profession of the TVET-teachers to maintain their performance. The ability of teachers to identify the competencies required by their profession is very critical to enable them to make improvements in teaching and learning. For a broader perspective the competency needs of the labour market have to be matched by those developed within the vocational learning processes. Consequently, this study has focused on developing and validating the new empirical based TVET-teacher competency profile and evaluating teacher’s competency. This study combines both quantitative and qualitative research methodology that was designed to answer all the research questions. The new empirical based competency profile development and TVET-teacher evaluation was based upon an instructional design model. In addition, a modified Delphi technique has also been adopted throughout the process. Initially, 98 elements of competencies were listed by expert panel and rated by TVET institutions as important. Then, analysis using manual and statistical procedure found that 112 elements of competencies have emerged from seventeen (17) clusters of competencies. Prior to that, using the preliminary TVET-teacher competency profile, the level of TVETteacher competencies was found to be Proficient and the finding of 112 elements of competencies with 17 clusters was finally used to develop the new empirical based competency profile for MARA TVET-teacher. Mean score analysis of teacher competencies found that there were gaps in teacher competencies between MARA institutions (IKM) and other TVET institutions, where MARA-teacher was significantly better than other TVET teacher. ANOVA and t-test analysis showed that there were significant differences between teacher competencies among all TVET institutions in Malaysia. On the other hand, the study showed that teacher’s age, grade and year of experience are not significant predictors for TVET-teacher competency. In the context of mastering the competency, the study also found that three competencies are classified as most difficult or challenging, twelve competencies are classified as should be improved, and eight competencies are classified as needed to be trained. Lastly, to make NDTS implementation a reality for MARA the new empirical based competency profile and the framework for career development and training pathway were established. This Framework would serve as a significant tool to develop the knowledge based human resources needed. This will ensure that TVET-teachers at MARA are trained to be knowledgeable, competent, and professional and become a pedagogical leader on an ongoing basis towards a world class TVET-education system