Reliability Investigations of MOSFETs using RF Small Signal Characterization

Modern technology needs and advancements have introduced various new concepts such as Internet-of-Things, electric automotive, and Artificial intelligence. This implies an increased activity in the electronics domain of analog and high frequency. Silicon devices have emerged as a cost-effective solution for such diverse applications. As these silicon devices are pushed towards higher performance, there is a continuous need to improve fabrication, power efficiency, variability, and reliability. Often, a direct trade-off of higher performance is observed in the reliability of semiconductor devices. The acceleration-based methodologies used for reliability assessment are the adequate time-saving solution for the lifetime's extrapolation but come with uncertainty in accuracy. Thus, the efforts to improve the accuracy of reliability characterization methodologies run in parallel. This study highlights two goals that can be achieved by incorporating high-frequency characterization into the reliability characteristics. The first one is assessing high-frequency performance throughout the device's lifetime to facilitate an accurate description of device/circuit functionality for high-frequency applications. Secondly, to explore the potential of high-frequency characterization as the means of scanning reliability effects within devices. S-parameters served as the high-frequency device's response and mapped onto a small-signal model to analyze different components of a fully depleted silicon-on-insulator MOSFET. The studied devices are subjected to two important DC stress patterns, i.e., Bias temperature instability stress and hot carrier stress. The hot carrier stress, which inherently suffers from the self-heating effect, resulted in the transistor's geometry-dependent magnitudes of hot carrier degradation. It is shown that the incorporation of the thermal resistance model is mandatory for the investigation of hot carrier degradation. The property of direct translation of small-signal parameter degradation to DC parameter degradation is used to develop a new S-parameter based bias temperature instability characterization methodology. The changes in gate-related small-signal capacitances after hot carrier stress reveals a distinct signature due to local change of flat-band voltage. The measured effects of gate-related small-signal capacitances post-stress are validated through transient physics-based simulations in Sentaurus TCAD.:Abstract Symbols Acronyms 1 Introduction 2 Fundamentals 2.1 MOSFETs Scaling Trends and Challenges 2.1.1 Silicon on Insulator Technology 2.1.2 FDSOI Technology 2.2 Reliability of Semiconductor Devices 2.3 RF Reliability 2.4 MOSFET Degradation Mechanisms 2.4.1 Hot Carrier Degradation 2.4.2 Bias Temperature Instability 2.5 Self-heating 3 RF Characterization of fully-depleted Silicon on Insulator devices 3.1 Scattering Parameters 3.2 S-parameters Measurement Flow 3.2.1 Calibration 3.2.2 De-embedding 3.3 Small-Signal Model 3.3.1 Model Parameters Extraction 3.3.2 Transistor Figures of Merit 3.4 Characterization Results 4 Self-heating assessment in Multi-finger Devices 4.1 Self-heating Characterization Methodology 4.1.1 Output Conductance Frequency dependence 4.1.2 Temperature dependence of Drain Current 4.2 Thermal Resistance Behavior 4.2.1 Thermal Resistance Scaling with number of fingers 4.2.2 Thermal Resistance Scaling with finger spacing 4.2.3 Thermal Resistance Scaling with GateWidth 4.2.4 Thermal Resistance Scaling with Gate length 4.3 Thermal Resistance Model 4.4 Design for Thermal Resistance Optimization 5 Bias Temperature Instability Investigation 5.1 Impact of Bias Temperature Instability stress on Device Metrics 5.1.1 Experimental Details 5.1.2 DC Parameters Drift 5.1.3 RF Small-Signal Parameters Drift 5.2 S-parameter based on-the-fly Bias Temperature Instability Characterization Method 5.2.1 Measurement Methodology 5.2.2 Results and Discussion 6 Investigation of Hot-carrier Degradation 6.1 Impact of Hot-carrier stress on Device performance 6.1.1 DC Metrics Degradation 6.1.2 Impact on small-signal Parameters 6.2 Implications of Self-heating on Hot-carrier Degradation in n-MOSFETs 6.2.1 Inclusion of Thermal resistance in Hot-carrier Degradation modeling 6.2.2 Convolution of Bias Temperature Instability component in Hot-carrier Degradation 6.2.3 Effect of Source and Drain Placement in Multi-finger Layout 6.3 Vth turn-around effect in p-MOSFET 7 Deconvolution of Hot-carrier Degradation and Bias Temperature Instability using Scattering parameters 7.1 Small-Signal Parameter Signatures for Hot-carrier Degradation and Bias Temperature Instability 7.2 TCAD Dynamic Simulation of Defects 7.2.1 Fixed Charges 7.2.2 Interface Traps near Gate 7.2.3 Interface Traps near Spacer Region 7.2.4 Combination of Traps 7.2.5 Drain Series Resistance effect 7.2.6 DVth Correction 7.3 Empirical Modeling based deconvolution of Hot-carrier Degradation 8 Conclusion and Recommendations 8.1 General Conclusions 8.2 Recommendations for Future Work A Directly measured S-parameters and extracted Y-parameters B Device Dimensions for Thermal Resistance Modeling C Frequency response of hot-carrier degradation (HCD) D Localization Effect of Interface Traps Bibliograph

22-32 GHz Low-Noise Amplifier Design in 22-nm CMOS-SOI Technology

This thesis explores the use of a 22-nm CMOS-SOI technology in the design of a two-stage amplifier which targets wide bandwidth, low noise and modest linearity in the 28 GHz band. A design methodology with a transformer-coupled, noise-matching interstage is presented for minimizing the noise factor of the two-stage amplifier. Furthermore, benefits of interstage noise matching are discussed. Next, a transistor layout for minimizing noise and maintaining sufficient electromigration reliability is described. It is followed by an analysis of transformer configurations and a transformer layout example is depicted. To verify the design methodology, two amplifier prototypes with noise-matching interstage were fabricated. Measurement shows that the first design achieves a peak gain of 20.7 dB and better-than-10-dB input and output return losses within a frequency range of 22.5 to 32.2 GHz. The lowest noise figure of 1.81 dB is achieved within the frequency range. Input IP3 of -13.4 dBm is achieved with the cost of 17.3 mW DC power consumption. When the bias at the back-gate is lowered from 2 V to 0.62 V, the power consumption is decreased to 5.6 mW and the peak gain drops down to 17.9 dB. Minimum noise figure increases from 1.81 to 2.13 dB and input IP3 drops to -14.4 dBm. The folded output stage in the second design improves the input IP3 to -6.7 dBm at the cost of 35 mW total power consumption. The peak gain of the second design is 20.1 dB, and the lowest noise figure of 1.73 dB within a frequency range of 23.8 to 32.4 GHz. Both designs occupy about 0.05 mm2 active area

Low-Noise Amplifier and Noise/Distortion Shaping Beamformer

The emergence of advanced technologies has increased the need for fast and efficient mobile communication that can facilitate transferring large amounts of data and simultaneously serve multiple users. Future wireless systems will rely on millimeter-wave frequencies, enabled by recent silicon hardware advancements. High-frequency millimeter-wave technology and low-noise receiver front ends and amplifiers are key for improved performance and energy efficiency. This thesis proposes two LNA topologies that offer wide input-power-matched bandwidths and low noise figures, eliminating the need for complex matching networks at the LNA input. These topologies use intrinsic feedback through gate-drain networks and/or the resistance of the SOI-transistor back-gate terminal to achieve the real part of the input impedance. The two LNAs are experimentally demonstrated with two 22-nm FDSOI LNAs. One LNA, matched with the assistance of the gate-drain network, exhibits a bandwidth ranging from 7.7-33.3 GHz, which is further improved to 6-38.7 GHz through the application of the back-gate-resistance method. The two LNAs have noise-figure minima of 1.8 and 1.9 dB, maximum gains of 14.7 and 15.6 dB, and maximum IP1dBs of -9.1 and -7.8 dBm while consuming 10 and 7.8 mW of power and occupying 0.04 and 0.03 mm^2 of active areas, respectively. This thesis also presents the first experimental demonstration of noise/distortion (ND) shaping beamformer. The NDs originating in the receiver itself are spatio-temporally shaped away from the beamformer region of support, thereby permitting their suppression by the beamformer. The demonstrator is a 24.3-28.7 GHz, 79.28 mW 4-port receiver for a 4-element antenna array implemented in 22-nm FDSOI CMOS. When shaping was enabled, the concept demonstrator provided average improvements to the NF and IP1dB of 1.6 dB and 2.25 dB, respectively (compared to a reference design), and achieved NF=2.6 dB and IP1dB=-18.7dBm while consuming 19.8 mW/channel

Ultra-thin silicon technology for tactile sensors

In order to meet the requirements of high performance flexible electronics in fast growing portable consumer electronics, robotics and new fields such as Internet of Things (IoT), new techniques such as electronics based on nanostructures, molecular electronics and quantum electronics have emerged recently. The importance given to the silicon chips with thickness below 50 μm is particularly interesting as this will advance the 3D IC technology as well as open new directions for high-performance flexible electronics. This doctoral thesis focusses on the development of silicon–based ultra-thin chip (UTC) for the next generation flexible electronics. UTCs, on one hand can provide processing speed at par with state-of-the-art CMOS technology, and on the other provide the mechanical flexibility to allow smooth integration on flexible substrates. These development form the motivation behind the work presented in this thesis. As the thickness of any silicon piece decreases, the flexural rigidity decreases. The flexural rigidity is defined as the force couple required to bend a non-rigid structure to a unit curvature, and therefore the flexibility increases. The new approach presented in this thesis for achieving thin silicon exploits existing and well-established silicon infrastructure, process, and design modules. The thin chips of thicknesses ranging between 15 μm – 30 μm, were obtained from processed bulk wafer using anisotropic chemical etching. The thesis also presents thin wafer transfer using two-step transfer printing approach, packaging by lamination or encapsulation between two flexible layerand methods to get the electrical connections out of the chip. The devices realised on the wafer as part of front-end processing, consisted capacitors and transistors, have been tested to analyse the effect of bending on the electrical characteristics. The capacitance of metal-oxide-semiconductor (MOS) capacitors increases by ~5% during bending and similar shift is observed in flatband and threshold voltages. Similarly, the carrier mobility in the channel region of metal-oxide-semiconductor field effect transistor (MOSFET) increases by 9% in tensile bending and decreases by ~5% in compressive bending. The analytical model developed to capture the effect of banding on device performance showed close matching with the experimental results. In order to employ these devices as tactile sensors, two types of piezoelectric materials are investigated, and used in extended gate configuration with the MOSFET. Firstly, a nanocomposite of Poly(vinylidene fluoride-co-trifluoroethylene), P(VDF-TrFE) and barium titanate (BT) was developed. The composite, due to opposite piezo and pyroelectric coefficients of constituents, was able to suppress the sensitivity towards temperature when force and temperature varied together, The sensitivity to force in extended gate configuration was measured to be 630 mV/N, and sensitivity to temperature was 6.57 mV/oC, when it was varied during force application. The process optimisation for sputtering piezoelectric Aluminium Nitride (AlN) was also carried out with many parametric variation. AlN does not require poling to exhibit piezoelectricity and therefore offers an attractive alternative for the piezoelectric layer used in devices such as POSFET (where piezoelectric material is directly deposited over the gate area of MOSFET). The optimised process gave highly orientated columnar structure AlN with piezoelectric coefficient of 5.9 pC/N and when connected in extended gate configuration, a sensitivity (normalised change in drain current per unit force) of 2.65 N-1 was obtained