8,563 research outputs found
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Department of Computer Science and EngineeringAs deep learning has grown fast, so did the desire to interpret deep learning black boxes. As
a result, many analysis tools have emerged to interpret it. Interpretation in deep learning has
in fact popularized the use of deep learning in many areas including research, manufacturing,
finance, and healthcare which needs relatively accurate and reliable decision making process.
However, there is something we should not overlook. It is uncertainty. Uncertainties of models
are directly reflected in the results of interpretations of model decision as explaining tools are
dependent to models. Therefore, uncertainties of interpreting output from deep learning models
should be also taken into account as quality and cost are directly impacted by measurement
uncertainty. This attempt has not been made yet.
Therefore, we suggest Bayesian input attribution rather than discrete input attribution by
approximating Bayesian inference in deep Gaussian process through dropout to input attribution
in this paper. Then we extract candidates that can sufficiently affect the output of the model,
taking into account both input attribution itself and uncertainty of it.clos
Bayesian Deep Net GLM and GLMM
Deep feedforward neural networks (DFNNs) are a powerful tool for functional
approximation. We describe flexible versions of generalized linear and
generalized linear mixed models incorporating basis functions formed by a DFNN.
The consideration of neural networks with random effects is not widely used in
the literature, perhaps because of the computational challenges of
incorporating subject specific parameters into already complex models.
Efficient computational methods for high-dimensional Bayesian inference are
developed using Gaussian variational approximation, with a parsimonious but
flexible factor parametrization of the covariance matrix. We implement natural
gradient methods for the optimization, exploiting the factor structure of the
variational covariance matrix in computation of the natural gradient. Our
flexible DFNN models and Bayesian inference approach lead to a regression and
classification method that has a high prediction accuracy, and is able to
quantify the prediction uncertainty in a principled and convenient way. We also
describe how to perform variable selection in our deep learning method. The
proposed methods are illustrated in a wide range of simulated and real-data
examples, and the results compare favourably to a state of the art flexible
regression and classification method in the statistical literature, the
Bayesian additive regression trees (BART) method. User-friendly software
packages in Matlab, R and Python implementing the proposed methods are
available at https://github.com/VBayesLabComment: 35 pages, 7 figure, 10 table
Towards a Multi-Subject Analysis of Neural Connectivity
Directed acyclic graphs (DAGs) and associated probability models are widely
used to model neural connectivity and communication channels. In many
experiments, data are collected from multiple subjects whose connectivities may
differ but are likely to share many features. In such circumstances it is
natural to leverage similarity between subjects to improve statistical
efficiency. The first exact algorithm for estimation of multiple related DAGs
was recently proposed by Oates et al. 2014; in this letter we present examples
and discuss implications of the methodology as applied to the analysis of fMRI
data from a multi-subject experiment. Elicitation of tuning parameters requires
care and we illustrate how this may proceed retrospectively based on technical
replicate data. In addition to joint learning of subject-specific connectivity,
we allow for heterogeneous collections of subjects and simultaneously estimate
relationships between the subjects themselves. This letter aims to highlight
the potential for exact estimation in the multi-subject setting.Comment: to appear in Neural Computation 27:1-2
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Gaussian process regression for virtual metrology of microchip quality and the resulting strategic sampling scheme
Manufacturing of integrated circuits involves many sequential processes, often ex- ecuted to nanoscale tolerances, and the yield depends on the often unmeasured quality of intermediate steps. In the high-throughput industry of fabricating microelectronics on semi-conducting wafers, scheduling measurements of product quality before the electrical test of the complete IC can be expensive. We therefore seek to predict metrics of product quality based on sensor readings describing the environment within the relevant tool during the processing of each wafer, or to apply the concept of virtual metrology (VM) to monitor these intermediate steps. We model the data using Gaussian process regression (GPR), adapted to simultaneously learn the nonlinear dynamics that govern the quality characteristic, as well as their operating space, expressed by a linear embedding of the sensor traces’ features. Such Bayesian models predict a distribution for the target metric, such as a critical dimension, so one may assess the model’s credibility through its predictive uncertainty. Assuming measurements of the quality characteristic of interest are budgeted, we seek to hasten convergence of the GPR model to a credible form through an active sampling scheme, whereby the predictive uncertainty informs which wafer’s quality to measure next. We evaluate this convergence when predicting and updating online, as if in a factory, using a large dataset for plasma-enhanced chemical vapor deposition (PECVD), with measured thicknesses for ~32,000 wafers. By approximately optimizing the information extracted from this seemingly repetitive data describing a tightly controlled process, GPR achieves ~10% greater accuracy on average than a baseline linear model based on partial least squares (PLS). In a derivative study, we seek to discern the degree of drift in the process over the several months the data spans. We express this drift by how unusual the relevant features, as embedded by the GPR model, appear as the in- puts compensate for degrading conditions. This method detects the onset of consistently unusual behavior that extends to a bimodal thickness fault, anticipating its flagging by as much as two days.Mechanical Engineerin
Online Tool Condition Monitoring Based on Parsimonious Ensemble+
Accurate diagnosis of tool wear in metal turning process remains an open
challenge for both scientists and industrial practitioners because of
inhomogeneities in workpiece material, nonstationary machining settings to suit
production requirements, and nonlinear relations between measured variables and
tool wear. Common methodologies for tool condition monitoring still rely on
batch approaches which cannot cope with a fast sampling rate of metal cutting
process. Furthermore they require a retraining process to be completed from
scratch when dealing with a new set of machining parameters. This paper
presents an online tool condition monitoring approach based on Parsimonious
Ensemble+, pENsemble+. The unique feature of pENsemble+ lies in its highly
flexible principle where both ensemble structure and base-classifier structure
can automatically grow and shrink on the fly based on the characteristics of
data streams. Moreover, the online feature selection scenario is integrated to
actively sample relevant input attributes. The paper presents advancement of a
newly developed ensemble learning algorithm, pENsemble+, where online active
learning scenario is incorporated to reduce operator labelling effort. The
ensemble merging scenario is proposed which allows reduction of ensemble
complexity while retaining its diversity. Experimental studies utilising
real-world manufacturing data streams and comparisons with well known
algorithms were carried out. Furthermore, the efficacy of pENsemble was
examined using benchmark concept drift data streams. It has been found that
pENsemble+ incurs low structural complexity and results in a significant
reduction of operator labelling effort.Comment: this paper has been published by IEEE Transactions on Cybernetic
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