The future of computing beyond Moore's Law.

Moore's Law is a techno-economic model that has enabled the information technology industry to double the performance and functionality of digital electronics roughly every 2 years within a fixed cost, power and area. Advances in silicon lithography have enabled this exponential miniaturization of electronics, but, as transistors reach atomic scale and fabrication costs continue to rise, the classical technological driver that has underpinned Moore's Law for 50 years is failing and is anticipated to flatten by 2025. This article provides an updated view of what a post-exascale system will look like and the challenges ahead, based on our most recent understanding of technology roadmaps. It also discusses the tapering of historical improvements, and how it affects options available to continue scaling of successors to the first exascale machine. Lastly, this article covers the many different opportunities and strategies available to continue computing performance improvements in the absence of historical technology drivers. This article is part of a discussion meeting issue 'Numerical algorithms for high-performance computational science'

Emerging cad and bim trends in the aec education: An analysis from students\u27 perspective

As the construction industry is moving towards collaborative design and construction practices globally, training the architecture, engineering, and construction (AEC) students professionally related to CAD and BIM became a necessity rather than an option. The advancement in the industry has led to collaborative modelling environments, such as building information modelling (BIM), as an alternative to computer-aided design (CAD) drafting. Educators have shown interest in integrating BIM into the AEC curriculum, where teaching CAD and BIM simultaneously became a challenge due to the differences of two systems. One of the major challenges was to find the appropriate teaching techniques, as educators were unaware of the AEC students’ learning path in CAD and BIM. In order to make sure students learn and benefit from both CAD and BIM, the learning path should be revealed from students’ perspective. This paper summarizes the background and differences of CAD and BIM education, and how the transition from CAD to BIM can be achieved for collaborative working practices. The analysis was performed on freshman and junior level courses to learn the perception of students about CAD and BIM education. A dual-track survey was used to collect responses from AEC students in four consecutive years. The results showed that students prefer BIM to CAD in terms of the friendliness of the user-interface, help functions, and self-detection of mistakes. The survey also revealed that most of the students believed in the need for a BIM specialty course with Construction Management (CM), Structure, and Mechanical-Electrical-Plumbing (MEP) areas. The benefits and challenges of both CAD and BIM-based software from students’ perspectives helps to improve the learning outcomes of CAD/BIM courses to better help students in their learning process, and works as a guideline for educators on how to design and teach CAD/BIM courses simultaneously by considering the learning process and perspectives of students. © 2018 The autho

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

The Future of High Frequency Circuit Design

The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced a unique opportunity for a completely new class of holistic circuit design combining electromagnetics, device physics, circuits, and communication system theory in one place. In this paper, we discuss some of these opportunities and their associated challenges in greater detail and provide a few of examples of how they can be used in practice

Phased Array Systems in Silicon

Phased array systems, a special case of MIMO systems, take advantage of spatial directivity and array gain to increase spectral efficiency. Implementing a phased array system at high frequency in a commercial silicon process technology presents several challenges. This article focuses on the architectural and circuit-level trade-offs involved in the design of the first silicon-based fully integrated phased array system operating at 24 GHz. The details of some of the important circuit building blocks are also discussed. The measured results demonstrate the feasibility of using integrated phased arrays for wireless communication and vehicular radar applications at 24 GHz

(Invited) mm-wave silicon ICs: An opportunity for holistic design

Millimeter-waves integrated circuits offer a unique opportunity for a holistic design approach encompassing RF, analog, and digital, as well as radiation and electromagnetics. The ability to deal with the complete system from the digital circuitry to on-chip antennas and everything in between offers unparalleled opportunities for completely new architectures and topologies, previously impossible due the traditional partitioning of various blocks in conventional design. This opens a plethora of new architectural and system level innovation within the integrated circuit platform. This paper reviews some of the challenges and opportunities for mm-wave ICs and presents several solutions to them

mm-Wave Silicon ICs: Challenges and Opportunities

Millimeter-waves offer promising opportunities and interesting challenges to silicon integrated circuit and system designers. These challenges go beyond standard circuit design questions and span a broader range of topics including wave propagation, antenna design, and communication channel capacity limits. It is only meaningful to evaluate the benefits and shortcoming of silicon-based mm-wave integrated circuits in this broader context. This paper reviews some of these issues and presents several solutions to them