An empirical study of manufacturing flexibility in printed-circuit board assembly

Includes bibliographical references (p. 19-21).Funded by the Leaders for Manufacturing Program and the International Center for Research on the Management of Technology.Fernando F. Suarez, Michael A. Cusumano, and Charles F. Fine [i.e. Charles H. Fine]

An empirical study of manufacturing flexibility in printed-circuit board assembly

Includes bibliographical references (p. 19-21).Funded by the Leaders for Manufacturing Program and the International Center for Research on the Management of Technology, both at the Massachusetts Instutute of Technology.Fernando F. Suarez, Michael A. Cusumano, and Charles F. Fine [i.e. Charles H. Fine]

Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufacture

In order to design and implement the information systems and modules that could comprise an “industrial strong” knowledge-based tool, links to shop floor systems containing real-time production data and PCA customer information (e.g. bill of materials (BOM), CAD drawings) are required. Details of the issues of implementing the tool in an industrial organisation and the integration of various data sources (e.g. “in-house” developed systems, enterprise resource planning systems, ad-hoc developed databases, machine data and CAD data) are presented in this paper. The application of the CLOVES system in an industrial setup highlights the difficulties in integrating information from design as CAD data and shows how these setbacks could be overcome if the electronics industry were to adopt a common CAD assembly information exchange platform. Hence, this paper concludes that existing automation tool manufacturers should focus exclusively on developing generic connections by adopting industry standards that can facilitate the deployment of “plug and play” tools. This standardisation could in turn help software developers, to provide the electronics industry with more integrated systems that communicate better among loosely coupled information systems and avoid depending on extensive time consuming manual data input

Design and manufacturing of a Selective Laser Sintering test bench to test sintering materials

The goal of this project is to design and build a prototype of recoating system for a laser cutting machine to turn it into a selective laser sintering printing machine. This prototype will be used to study new sintering materials and to design, if decided, a SLS 3D printing Machine (Selective Laser Sintering). This project has been developed in the installations and funded by Fundació CIM. The project develops the mechanical design and the electronic system design. Both parts are explained on this paper, so new users can use the machine and can understand the system. With this paper, it is expected that it can be improved in a future to test other parameters and configurations. The paper is divided in three basic blocks that are summed up here: The first block is an introduction to the 3D printing technologies. The most used of them are explained and selective laser sintering is explained in deep. With this block the reader can understand why it is important to develop the SLS technology and what has to be done to improve the machines and the technology. The second block is a discussion on the mechanical design of the machine. The general idea of the machine is explained so the user can understand why the machine is designed in this way. After that, each part is detailed to see how the different mechanical challenges where overtaken. At the end of the block, there is a small calculations section needed on the electronic part. The third block is an extensive explanation of the electronic system that controls and moves the machine. In that block, the different components are explained so the user can understand its basics working principles. It is also explained how the selection of the electronic components was done. Then everything is put together to see the whole electronic system. Along with this paper, there are annexes that provide some extra information for the reader. One of this annexes refers to the mechanical part and the other one has some datasheets and coding for the electronic section. The whole design has been done in SOLIDWORKS cad software and its electric extension ELECWORKS. The programming job was done with Arduino compiler

Improving cross-functional communication about product architecture

Product architecture decisions, such as product modularity, component commonality, and design reuse, are important for balancing costs, responsiveness, quality, and other important business objectives. Firms are challenged with complex tradeoffs between competing design priorities, face the need to facilitate communication between functional silos, and to learn from past experiences. In this paper we present a qualitative approach for systematically evaluating the product architecture of an existing product or product family, linking the original architecture objectives and actual experiences. The intended contribution of our research is to present a framework that brings together a diverse set of product architecture-related decisions that are relevant from a business point of view (and not from a technical point of view) and a set of business performance elements. This framework can be used in workshop that improves cross-functional communication about the product architecture of an existing product family, and this results in practical improvement actions for future architecture design projects. Initial experiences with this approach have been obtained in pilots with Philips domestic appliances & personal care, and Philips consumer electronics

Infrared testing of electronic components Final report, 5 Apr. 1965 - 5 Jun. 1966

Infrared radiation nondestructive test technique for electrical/electronic equipmen

A Multi-Exchange Neighborhood Search Heuristic for an Integrated Clustering and Machine Setup Model for PCB Manufacturing

In the manufacture of printed circuit boards, electronic components are attached to a blank board by one or more pick-and-place machines. Frequent machine setups, though time consuming, can reduce overall processing time. We consider the Integrated Clustering and Machine Setup (ICMS) model, which incorporates this tradeoff between processing time and setup time and seeks to minimize the sum of the two. Solving this model to optimality is intractable for very large-scale instances. We show that ICMS is NP-hard and consequently propose and test a heuristic based on multi-exchange neighborhood search structures. Initial numerical results are very encouraging. Keywords: Printed circuit board assembly, feeder slot assignment, product clustering, integer programming, computational complexity, heuristics

Internationalisation of Innovation: Why Chip Design Moving to Asia

This paper will appear in International Journal of Innovation Management, special issue in honor of Keith Pavitt, (Peter Augsdoerfer, Jonathan Sapsed, and James Utterback, guest editors), forthcoming. Among Keith Pavitt's many contributions to the study of innovation is the proposition that physical proximity is advantageous for innovative activities that involve highly complex technological knowledge But chip design, a process that creates the greatest value in the electronics industry and that requires highly complex knowledge, is experiencing a massive dispersion to leading Asian electronics exporting countries. To explain why chip design is moving to Asia, the paper draws on interviews with 60 companies and 15 research institutions that are doing leading-edge chip design in Asia. I demonstrate that "pull" and "policy" factors explain what attracts design to particular locations. But to get to the root causes that shift the balance in favor of geographical decentralization, I examine "push" factors, i.e. changes in design methodology ("system-on-chip design") and organization ("vertical specialization" within global design networks). The resultant increase in knowledge mobility explains why chip design - that, in Pavitt's framework is not supposed to move - is moving from the traditional centers to a few new specialized design clusters in Asia. A completely revised and updated version has been published as: " Complexity and Internationalisation of Innovation: Why is Chip Design Moving to Asia?," in International Journal of Innovation Management, special issue in honour of Keith Pavitt, Vol. 9,1: 47-73.

Late Innovation Strategies in Asian Electronics Industries: A Conceptual Framework and Illustrative Evidence

This paper was published in Oxford Development Studies special issue in honor of the late Professor Linsu Kim. The paper reviews evidence on the evolution of electronics design in Asia's leading electronics exporting countries, to establish what capabilities have been developed, and to shed light on the forces that are driving "late innovation" strategies. It also reviews intellectual sources that can be used to theoretically ground these hypotheses. Using a well-known taxonomy of innovation that distinguishes incremental, modular, architectural and radical innovations, and the concept of "disruptive technologies", I argue that Asian firms may have realistic chances to engage in incremental innovations as well as in architectural innovations. However, to sustain "late innovation" strategies over a longer period, "complex system integration" capabilities are necessary to provide the missing link.

Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics

The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.