One step growth of GaN/SiO2 core/shell nanowire in vapor-liquid-solid route by chemical vapor deposition technique

GaN/SiO2 core/shell nanowires are grown by cobalt phthalocyanine catalyst assisted vapor-liquid-solid route, in which Si wafer coated with a mixture of gallium and indium is used as the source for Ga and Si and ammonia is used as the precursor for nitrogen and hydrogen. Gallium in the presence of indium and hydrogen, which results from the dissociation of ammonia, forms Si-Ga-In alloy at the growth temperature around 910 degree Celsius. This alloy acts as the source of Si, Ga and In. A detailed study using a variety of characterization tools reveals that these wires, which are several tens of micron long, has a diameter distribution of the core ranging from 20 to 50 nm, while the thickness of the amorphous SiO2 shell layer is about 10 nm. These wires grow along direction. It has also been observed that the average width of these wires decreases, while their density increases as the gallium proportion in the Ga-In mixture is increased.Comment: 14 pages, 4 figure

Electric-field-induced strong enhancement of electroluminescence in multilayer molybdenum disulfide.

The layered transition metal dichalcogenides have attracted considerable interest for their unique electronic and optical properties. While the monolayer MoS2 exhibits a direct bandgap, the multilayer MoS2 is an indirect bandgap semiconductor and generally optically inactive. Here we report electric-field-induced strong electroluminescence in multilayer MoS2. We show that GaN-Al2O3-MoS2 and GaN-Al2O3-MoS2-Al2O3-graphene vertical heterojunctions can be created with excellent rectification behaviour. Electroluminescence studies demonstrate prominent direct bandgap excitonic emission in multilayer MoS2 over the entire vertical junction area. Importantly, the electroluminescence efficiency observed in multilayer MoS2 is comparable to or higher than that in monolayers. This strong electroluminescence can be attributed to electric-field-induced carrier redistribution from the lowest energy points (indirect bandgap) to higher energy points (direct bandgap) in k-space. The electric-field-induced electroluminescence is general for other layered materials including WSe2 and can open up a new pathway towards transition metal dichalcogenide-based optoelectronic devices

Light effect in photoionization of traps in GaN MESFETs

Trapping of hot electron behavior by trap centers located in buffer layer of a wurtzite phase GaN MESFET has been simulated using an ensemble Monte Carlo simulation. The results of the simulation show that the trap centers are responsible for current collapse in GaN MESFET at low temperatures. These electrical traps degrade the performance of the device at low temperature. On the opposite, a light-induced increase in the trap-limited drain current, results from the photoionization of trapped carriers and their return to the channel under the influence of the built in electric field associated with the trapped charge distribution. The simulated device geometries and doping are matched to the nominal parameters described for the experimental structures as closely as possible, and the predicted drain current and other electrical characteristics for the simulated device including trapping center effects show close agreement with the available experimental data.Comment: 5 pages, 2 figure

The Effects of Temperature and Electron Radiation on the Electrical Properties of AlGaN/GaN Heterostructure Field Effect Transistors

AlxGa1-xN/GaN Heterostructure Field Effect Transistors (HFETs) have come under increased study, in recent years, owing to their highly desirable material and electrical properties, ruggedness, and survivability even during and after exposure to extreme temperature and radiation environments. These devices or similar devices constructed of AlGaN and/or GaN materials are being researched for their potential applications in many military and space based systems. In this study, unpassivated and SiN passivated Al0.27Ga0.73N/GaN HFETs were subjected to electron radiation at incident energies of 0.5MeV and 1.0MeV and fluences from 5x1014 to 5x1015 [e-/cm2] while maintained in a 10-6 Torr or higher vacuum at liquid nitrogen temperature (LN). The primary focus of the research was the effects of electron radiation and temperature on drain current, gate leakage current, threshold voltage shift, and gate-channel capacitance. Measurements were taken of transistor current, gate-channel capacitance, and gate leakage current vs. gate bias at 4°K temperature intervals beginning at LN through room temperature (RT). The resulting gate leakage currents were fitted to a Trap-Assisted Tunneling model and transistor currents were compared to a Charge Control model to evaluate post-irradiation change mechanisms to the parameters of these models. Post-irradiation drain currents increased for all devices, with a consistently lesser increase observed for passivated devices. Most post-irradiation increases returned to nearly pre-irradiation levels after an RT anneal period. Threshold voltage shifts averaged -0.5V for unpassivated and -0.2V for passivated HFETs, showed negligible temperature dependence, and returned to near pre-irradiation values, after RT anneal periods. Gate leakage currents showed post-irradiation increases for all devices

Large Signal Performance of the Gallium Nitride Heterostructure Field-Effect Transistor With a Graphene Heat-Removal System

The self-heating effect exerts a considerable influence on the characteristics of high-power electronic and optoelectronic devices based on gallium nitride. An extremely non-uniform distribution of the dissipated power and a rise in the average temperature in the gallium nitride heterostructure field-effect transistor lead to the formation of a hot spot near the conductive channel and result in the degradation of the drain current, power gain and device reliability. The purpose of this work is to design a gallium nitride heterostructure field-effect transistor with an effective graphene heat-removal system and to study using numerical simulation the thermal phenomena specific to it. The object of the research is the device structure formed on sapphire with a grapheme heat-spreading element placed on its top surface and a trench in the passivation layer filled with diamond grown by chemical vapor deposition. The subject of the research is the large signal performance quantities. The simulation results confirm the effectiveness of the heat-removal system integrated into the heterostructure field-effect transistor and leading to the suppression of the self-heating effect and to the improvement of the device performance. The advantage of our concept is that the heat-spreading element is structurally connected with a heat sink and is designed to remove the heat immediately from the maximum temperature area through the trench in which a high thermal conductivity material is deposited. The results of this work can be used by the electronics industry of the Republic of Belarus for developing the hardware components of gallium nitride power electronics.The self-heating effect exerts a considerable influence on the characteristics of high-power electronic and optoelectronic devices based on gallium nitride. An extremely non-uniform distribution of the dissipated power and a rise in the average temperature in the gallium nitride heterostructure field-effect transistor lead to the formation of a hot spot near the conductive channel and result in the degradation of the drain current, power gain and device reliability. The purpose of this work is to design a gallium nitride heterostructure field-effect transistor with an effective graphene heat-removal system and to study using numerical simulation the thermal phenomena specific to it. The object of the research is the device structure formed on sapphire with a grapheme heat-spreading element placed on its top surface and a trench in the passivation layer filled with diamond grown by chemical vapor deposition. The subject of the research is the large signal performance quantities. The simulation results confirm the effectiveness of the heat-removal system integrated into the heterostructure field-effect transistor and leading to the suppression of the self-heating effect and to the improvement of the device performance. The advantage of our concept is that the heat-spreading element is structurally connected with a heat sink and is designed to remove the heat immediately from the maximum temperature area through the trench in which a high thermal conductivity material is deposited. The results of this work can be used by the electronics industry of the Republic of Belarus for developing the hardware components of gallium nitride power electronics

Strain-stress study of AlxGa1-xN/AlN heterostructures on c-plane sapphire and related optical properties

This work presents a systematic study of stress and strain of AlxGa1-xN/AlN with composition ranging from GaN to AlN, grown on a c-plane sapphire by metal-organic chemical vapor deposition, using synchrotron radiation high-resolution X-ray diffraction and reciprocal space mapping. The c-plane of the AlxGa1-xN epitaxial layers exhibits compressive strain, while the a-plane exhibits tensile strain. The biaxial stress and strain are found to increase with increasing Al composition, although the lattice mismatch between the AlxGa1-xN and the buffer layer AlN gets smaller. A reduction in the lateral coherence lengths and an increase in the edge and screw dislocations are seen as the AlxGa1-xN composition is varied from GaN to AlN, exhibiting a clear dependence of the crystal properties of AlxGa1-xN on the Al content. The bandgap of the epitaxial layers is slightly lower than predicted value due to a larger tensile strain effect on the a-axis compared to the compressive strain on the c-axis. Raman characteristics of the AlxGa1-xN samples exhibit a shift in the phonon peaks with the Al composition. The effect of strain is also discussed on the optical phonon energies of the epitaxial layers. The techniques discussed here can be used to study other similar materials.Comment: 14 pages, 5 figures, 2 table