Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach

The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages

Quasi-simultaneous coupling methods for partitioned problems in computational hemodynamics

The paper describes the numerical coupling challenges in multiphysics problems like the simulation of blood flow in compliant arteries. In addition to an iterative coupling between the fluid flow and elastic vessel walls, i.e. fluid-structure interaction, also the coupling between a detailed 3D local (arterial) flow model and a more global 0D model (representing a global circulation) is analyzed. Most of the coupling analysis is formulated in the more abstract setting of electrical-network models. Both, weak (segregated) and strong (monolithic) coupling approaches are studied, and their numerical stability limitations are discussed. Being a hybrid combination, the quasi-simultaneous coupling method, developed for partitioned problems in aerodynamics, is shown to be a robust and flexible approach for hemodynamic applications too