Effect of Jitter on the Settling Time of Mesochronous Clock Retiming Circuits

It is well known that timing jitter can degrade the bit error rate (BER) of receivers that recover the clock from input data. However, timing jitter can also result in an indefinite increase in the settling time of clock recovery circuits, particularly in low swing mesochronous systems. Mesochronous clock retiming circuits are required in repeaterless low swing on-chip interconnects. We first discuss how timing jitter can result in a large increase in the settling time of the clock recovery circuit. Next, the circuit is modelled as a Markov chain with absorbing states. The mean time to absorption of the Markov chain, which represents the mean settling time of the circuit, is determined. The model is validated through behavioural simulations of the circuit, the results of which match well with the model predictions. We consider circuits with (i) data dependent jitter, (ii) random jitter, and (iii) combination of both of them. We show that a mismatch between the strengths of up and down corrections of the retiming can reduce the settling time. In particular, a 10% mismatch can reduce the mean settling time by up to 40%. We leverage this fact toward improving the settling time performance, and propose useful techniques based on biased training sequences and mismatched charge pumps. We also present a coarse+fine clock retiming circuit, which can operate in coarse first mode, to reduce the settling time substantially. These fast settling retiming circuits are verified with circuit simulations.Comment: 23 pages, 40 figure

An Energy-Efficient Reconfigurable Mobile Memory Interface for Computing Systems

The critical need for higher power efficiency and bandwidth transceiver design has significantly increased as mobile devices, such as smart phones, laptops, tablets, and ultra-portable personal digital assistants continue to be constructed using heterogeneous intellectual properties such as central processing units (CPUs), graphics processing units (GPUs), digital signal processors, dynamic random-access memories (DRAMs), sensors, and graphics/image processing units and to have enhanced graphic computing and video processing capabilities. However, the current mobile interface technologies which support CPU to memory communication (e.g. baseband-only signaling) have critical limitations, particularly super-linear energy consumption, limited bandwidth, and non-reconfigurable data access. As a consequence, there is a critical need to improve both energy efficiency and bandwidth for future mobile devices.;The primary goal of this study is to design an energy-efficient reconfigurable mobile memory interface for mobile computing systems in order to dramatically enhance the circuit and system bandwidth and power efficiency. The proposed energy efficient mobile memory interface which utilizes an advanced base-band (BB) signaling and a RF-band signaling is capable of simultaneous bi-directional communication and reconfigurable data access. It also increases power efficiency and bandwidth between mobile CPUs and memory subsystems on a single-ended shared transmission line. Moreover, due to multiple data communication on a single-ended shared transmission line, the number of transmission lines between mobile CPU and memories is considerably reduced, resulting in significant technological innovations, (e.g. more compact devices and low cost packaging to mobile communication interface) and establishing the principles and feasibility of technologies for future mobile system applications. The operation and performance of the proposed transceiver are analyzed and its circuit implementation is discussed in details. A chip prototype of the transceiver was implemented in a 65nm CMOS process technology. In the measurement, the transceiver exhibits higher aggregate data throughput and better energy efficiency compared to prior works

A 3 Gb/s optical detector in standard CMOS for 850 nm optical communication

This paper presents a monolithic optical detector, consisting of an integrated photodiode and a preamplifier in a standard 0.18-/spl mu/m CMOS technology. A data rate of 3 Gb/s at BER <10/sup -11/ was achieved for /spl lambda/=850 nm with 25-/spl mu/W peak-peak optical power. This data rate is more than four times than that of current state-of-the-art optical detectors in standard CMOS reported so far. High-speed operation is achieved without reducing circuit responsivity by using an inherently robust analog equalizer that compensates (in gain and phase) for the photodiode roll-off over more than three decades. The presented solution is applicable to various photodiode structures, wavelengths, and CMOS generations

Integrated phased array systems in silicon

Silicon offers a new set of possibilities and challenges for RF, microwave, and millimeter-wave applications. While the high cutoff frequencies of the SiGe heterojunction bipolar transistors and the ever-shrinking feature sizes of MOSFETs hold a lot of promise, new design techniques need to be devised to deal with the realities of these technologies, such as low breakdown voltages, lossy substrates, low-Q passives, long interconnect parasitics, and high-frequency coupling issues. As an example of complete system integration in silicon, this paper presents the first fully integrated 24-GHz eight-element phased array receiver in 0.18-μm silicon-germanium and the first fully integrated 24-GHz four-element phased array transmitter with integrated power amplifiers in 0.18-μm CMOS. The transmitter and receiver are capable of beam forming and can be used for communication, ranging, positioning, and sensing applications

Architectures and Circuits Leveraging Injection-Locked Oscillators for Ultra-Low Voltage Clock Synthesis and Reference-less Receivers for Dense Chip-to-Chip Communications

High performance computing is critical for the needs of scientific discovery and economic competitiveness. An extreme-scale computing system at 1000x the performance of today’s petaflop machines will exhibit massive parallelism on multiple vertical fronts, from thousands of computational units on a single processor to thousands of processors in a single data center. To facilitate such a massively-parallel extreme-scale computing, a key challenge is power. The challenge is not power associated with base computation but rather the problem of transporting data from one chip to another at high enough rates. This thesis presents architectures and techniques to achieve low power and area footprint while achieving high data rates in a dense very-short reach (VSR) chip-to-chip (C2C) communication network. High-speed serial communication operating at ultra-low supplies improves the energy-efficiency and lowers the power envelop of a system doing an exaflop of loops. One focus area of this thesis is clock synthesis for such energy-efficient interconnect applications operating at high speeds and ultra-low supplies. A sub-integer clockfrequency synthesizer is presented that incorporates a multi-phase injection-locked ring-oscillator-based prescaler for operation at an ultra-low supply voltage of 0.5V, phase-switching based programmable division for sub-integer clock-frequency synthesis, and automatic calibration to ensure injection lock. A record speed of 9GHz has been demonstrated at 0.5V in 45nm SOI CMOS. It consumes 3.5mW of power at 9.12GHz and 0.052 of area, while showing an output phase noise of -100dBc/Hz at 1MHz offset and RMS jitter of 325fs; it achieves a net of -186.5 in a 45-nm SOI CMOS process. This thesis also describes a receiver with a reference-less clocking architecture for high-density VSR-C2C links. This architecture simplifies clock-tree planning in dense extreme-scaling computing environments and has high-bandwidth CDR to enable SSC for suppressing EMI and to mitigate TX jitter requirements. It features clock-less DFE and a high-bandwidth CDR based on master-slave ILOs for phase generation/rotation. The RX is implemented in 14nm CMOS and characterized at 19Gb/s. It is 1.5x faster that previous reference-less embedded-oscillator based designs with greater than 100MHz jitter tolerance bandwidth and recovers error-free data over VSR-C2C channels. It achieves a power-efficiency of 2.9pJ/b while recovering error-free data (BER 200MHz and the INL of the ILO-based phase-rotator (32- Steps/UI) is <1-LSB. Lastly, this thesis develops a time-domain delay-based modeling of injection locking to describe injection-locking phenomena in nonharmonic oscillators. The model is used to predict the locking bandwidth, and the locking dynamics of the locked oscillator. The model predictions are verified against simulations and measurements of a four-stage differential ring oscillator. The model is further used to predict the injection-locking behavior of a single-ended CMOS inverter based ring oscillator, the lock range of a multi-phase injection-locked ring-oscillator-based prescaler, as well as the dynamics of tracking injection phase perturbations in injection-locked masterslave oscillators; demonstrating its versatility in application to any nonharmonic oscillator

Low-Power, High-Bandwidth and Ultra-Small Memory Module Design

The main memory subsystem has become inefficient. The performance gained has come at the expenses of power consumption, capacity, and cost. This dissertation proposes novel module, DRAM, and interconnect architectures in an attempt to alleviate these trends. The proposed architectures utilize low-cost interconnects and packaging innovations to substantially reduce the power, and increase the capacity and bandwidth of the main memory system. This dissertation develops the theory behind a low-cost packaging technology to create an 8-die and 32-die memory module. The 32-die memory module measures less than 2 cm3. This dissertation also proposes a 4 Gb DRAM architecture utilizing 64 data pins to supplement the memory module design. This DRAM architecture is inline with ITRS roadmaps and consumes 50% less power while increasing bandwidth by 100%. The large number of data pins is made possible with the use of a low power capacitive-coupled interconnect. As part of the capacitive-coupled interconnect, this dissertation proposes a receiver circuit designed for the capacitive interface. The designs were fabricated in 0.5 μm and 65 nm CMOS technologies. The 0.5 μm design operated at 200 Mbps, and consumed less than 3 pJ/bit of energy. While the 65 nm design operated at 4 Gbps, and consumed less than 15 fJ/bit

Electronic Photonic Integrated Circuits and Control Systems

Photonic systems can operate at frequencies several orders of magnitude higher than electronics, whereas electronics offers extremely high density and easily built memories. Integrated photonic-electronic systems promise to combine advantage of both, leading to advantages in accuracy, reconfigurability and energy efficiency. This work concerns of hybrid and monolithic electronic-photonic system design. First, a high resolution voltage supply to control the thermooptic photonic chip for time-bin entanglement is described, in which the electronics system controller can be scaled with more number of power channels and the ability to daisy-chain the devices. Second, a system identification technique embedded with feedback control for wavelength stabilization and control model in silicon nitride photonic integrated circuits is proposed. Using the system, the wavelength in thermooptic device can be stabilized in dynamic environment. Third, the generation of more deterministic photon sources with temporal multiplexing established using field programmable gate arrays (FPGAs) as controller photonic device is demonstrated for the first time. The result shows an enhancement to the single photon output probability without introducing additional multi-photon noise. Fourth, multiple-input and multiple-output (MIMO) control of a silicon nitride thermooptic photonic circuits incorporating Mach Zehnder interferometers (MZIs) is demonstrated for the first time using a dual proportional integral reference tracking technique. The system exhibits improved performance in term of control accuracy by reducing wavelength peak drift due to internal and external disturbances. Finally, a monolithically integrated complementary metal oxide semiconductor (CMOS) nanophotonic segmented transmitter is characterized. With segmented design, the monolithic Mach Zehnder modulator (MZM) shows a low link sensitivity and low insertion loss with driver flexibility

Integrated Circuit Design for Hybrid Optoelectronic Interconnects

This dissertation focuses on high-speed circuit design for the integration of hybrid optoelectronic interconnects. It bridges the gap between electronic circuit design and optical device design by seamlessly incorporating the compact Verilog-A model for optical components into the SPICE-like simulation environment, such as the Cadence design tool. Optical components fabricated in the IME 130nm SOI CMOS process are characterized. Corresponding compact Verilog-A models for Mach-Zehnder modulator (MZM) device are developed. With this approach, electro-optical co-design and hybrid simulation are made possible. The developed optical models are used for analyzing the system-level specifications of an MZM based optoelectronic transceiver link. Link power budgets for NRZ, PAM-4 and PAM-8 signaling modulations are simulated at system-level. The optimal transmitter extinction ratio (ER) is derived based on the required receiver\u27s minimum optical modulation amplitude (OMA). A limiting receiver is fabricated in the IBM 130 nm CMOS process. By side- by-side wire-bonding to a commercial high-speed InGaAs/InP PIN photodiode, we demonstrate that the hybrid optoelectronic limiting receiver can achieve the bit error rate (BER) of 10-12 with a -6.7 dBm sensitivity at 4 Gb/s. A full-rate, 4-channel 29-1 length parallel PRBS is fabricated in the IBM 130 nm SiGe BiCMOS process. Together with a 10 GHz phase locked loop (PLL) designed from system architecture to transistor level design, the PRBS is demonstrated operating at more than 10 Gb/s. Lessons learned from high-speed PCB design, dealing with signal integrity issue regarding to the PCB transmission line are summarized