Challenges in flexible microsystem manufacturing : fabrication, robotic assembly, control, and packaging.

Microsystems have been investigated with renewed interest for the last three decades because of the emerging development of microelectromechanical system (MEMS) technology and the advancement of nanotechnology. The applications of microrobots and distributed sensors have the potential to revolutionize micro and nano manufacturing and have other important health applications for drug delivery and minimal invasive surgery. A class of microrobots studied in this thesis, such as the Solid Articulated Four Axis Microrobot (sAFAM) are driven by MEMS actuators, transmissions, and end-effectors realized by 3-Dimensional MEMS assembly. Another class of microrobots studied here, like those competing in the annual IEEE Mobile Microrobot Challenge event (MMC) are untethered and driven by external fields, such as magnetic fields generated by a focused permanent magnet. A third class of microsystems studied in this thesis includes distributed MEMS pressure sensors for robotic skin applications that are manufactured in the cleanroom and packaged in our lab. In this thesis, we discuss typical challenges associated with the fabrication, robotic assembly and packaging of these microsystems. For sAFAM we discuss challenges arising from pick and place manipulation under microscopic closed-loop control, as well as bonding and attachment of silicon MEMS microparts. For MMC, we discuss challenges arising from cooperative manipulation of microparts that advance the capabilities of magnetic micro-agents. Custom microrobotic hardware configured and demonstrated during this research (such as the NeXus microassembly station) include micro-positioners, microscopes, and controllers driven via LabVIEW. Finally, we also discuss challenges arising in distributed sensor manufacturing. We describe sensor fabrication steps using clean-room techniques on Kapton flexible substrates, and present results of lamination, interconnection and testing of such sensors are presented

Workshop on "Robotic assembly of 3D MEMS".

Proceedings of a workshop proposed in IEEE IROS'2007.The increase of MEMS' functionalities often requires the integration of various technologies used for mechanical, optical and electronic subsystems in order to achieve a unique system. These different technologies have usually process incompatibilities and the whole microsystem can not be obtained monolithically and then requires microassembly steps. Microassembly of MEMS based on micrometric components is one of the most promising approaches to achieve high-performance MEMS. Moreover, microassembly also permits to develop suitable MEMS packaging as well as 3D components although microfabrication technologies are usually able to create 2D and "2.5D" components. The study of microassembly methods is consequently a high stake for MEMS technologies growth. Two approaches are currently developped for microassembly: self-assembly and robotic microassembly. In the first one, the assembly is highly parallel but the efficiency and the flexibility still stay low. The robotic approach has the potential to reach precise and reliable assembly with high flexibility. The proposed workshop focuses on this second approach and will take a bearing of the corresponding microrobotic issues. Beyond the microfabrication technologies, performing MEMS microassembly requires, micromanipulation strategies, microworld dynamics and attachment technologies. The design and the fabrication of the microrobot end-effectors as well as the assembled micro-parts require the use of microfabrication technologies. Moreover new micromanipulation strategies are necessary to handle and position micro-parts with sufficiently high accuracy during assembly. The dynamic behaviour of micrometric objects has also to be studied and controlled. Finally, after positioning the micro-part, attachment technologies are necessary

Design, evaluation, and control of nexus: a multiscale additive manufacturing platform with integrated 3D printing and robotic assembly.

Additive manufacturing (AM) technology is an emerging approach to creating three-dimensional (3D) objects and has seen numerous applications in medical implants, transportation, aerospace, energy, consumer products, etc. Compared with manufacturing by forming and machining, additive manufacturing techniques provide more rapid, economical, efficient, reliable, and complex manufacturing processes. However, additive manufacturing also has limitations on print strength and dimensional tolerance, while traditional additive manufacturing hardware platforms for 3D printing have limited flexibility. In particular, part geometry and materials are limited to most 3D printing hardware. In addition, for multiscale and complex products, samples must be printed, fabricated, and transferred among different additive manufacturing platforms in different locations, which leads to high cost, long process time, and low yield of products. This thesis investigates methods to design, evaluate, and control the NeXus, which is a novel custom robotic platform for multiscale additive manufacturing with integrated 3D printing and robotic assembly. NeXus can be used to prototype miniature devices and systems, such as wearable MEMS sensor fabrics, microrobots for wafer-scale microfactories, tactile robot skins, next generation energy storage (solar cells), nanostructure plasmonic devices, and biosensors. The NeXus has the flexibility to fixture, position, transport, and assemble components across a wide spectrum of length scales (Macro-Meso-Micro-Nano, 1m to 100nm) and provides unparalleled additive process capabilities such as 3D printing through both aerosol jetting and ultrasonic bonding and forming, thin-film photonic sintering, fiber loom weaving, and in-situ Micro-Electro-Mechanical System (MEMS) packaging and interconnect formation. The NeXus system has a footprint of around 4m x 3.5m x 2.4m (X-Y-Z) and includes two industrial robotic arms, precision positioners, multiple manipulation tools, and additive manufacturing processes and packaging capabilities. The design of the NeXus platform adopted the Lean Robotic Micromanufacturing (LRM) design principles and simulation tools to mitigate development risks. The NeXus has more than 50 degrees of freedom (DOF) from different instruments, precise evaluation of the custom robots and positioners is indispensable before employing them in complex and multiscale applications. The integration and control of multi-functional instruments is also a challenge in the NeXus system due to different communication protocols and compatibility. Thus, the NeXus system is controlled by National Instruments (NI) LabVIEW real-time operating system (RTOS) with NI PXI controller and a LabVIEW State Machine User Interface (SMUI) and was programmed considering the synchronization of various instruments and sequencing of additive manufacturing processes for different tasks. The operation sequences of each robot along with relevant tools must be organized in safe mode to avoid crashes and damage to tools during robots’ motions. This thesis also describes two demonstrators that are realized by the NeXus system in detail: skin tactile sensor arrays and electronic textiles. The fabrication process of the skin tactile sensor uses the automated manufacturing line in the NeXus with pattern design, precise calibration, synchronization of an Aerosol Jet printer, and a custom positioner. The fabrication process for electronic textiles is a combination of MEMS fabrication techniques in the cleanroom and the collaboration of multiple NeXus robots including two industrial robotic arms and a custom high-precision positioner for the deterministic alignment process

Microrobots for wafer scale microfactory: design fabrication integration and control.

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling of large quantities of components, and the high cost associated to top-down manipulation with the required precision. However, the bottom-up manufacturing methods have certain limitations, such as components need to have pre-define shapes and surface coatings, and the number of assembly components is limited to very few. For example, in the case of self-assembly of nano-cubes with origami design, post-assembly manipulation of cubes in large quantities and cost-efficiency is still challenging. In this thesis, we envision a new paradigm for nano scale assembly, realized with the help of a wafer-scale microfactory containing large numbers of MEMS microrobots. These robots will work together to enhance the throughput of the factory, while their cost will be reduced when compared to conventional nano positioners. To fulfill the microfactory vision, numerous challenges related to design, power, control and nanoscale task completion by these microrobots must be overcome. In this work, we study three types of microrobots for the microfactory: a world’s first laser-driven micrometer-size locomotor called ChevBot，a stationary millimeter-size robotic arm, called Solid Articulated Four Axes Microrobot (sAFAM), and a light-powered centimeter-size crawler microrobot called SolarPede. The ChevBot can perform autonomous navigation and positioning on a dry surface with the guidance of a laser beam. The sAFAM has been designed to perform nano positioning in four degrees of freedom, and nanoscale tasks such as indentation, and manipulation. And the SolarPede serves as a mobile workspace or transporter in the microfactory environment

Microfabricated bistable module for digital microrobotics.

International audienceHigh precision microrobots are needed more and more to perform micro/nanomanipulation and microassembly tasks in various environments like microrobotic stations, electronic microscopes (SEM, TEM), etc. Current microrobots are based on the use of smart materials to perform proportional or incremental actuation. To avoid the main drawbacks of these microrobots (non linearities, integration of sensors, robust control, energy consumption, sensitivity to noise), we propose a new type of microrobots, called digital microrobots, based on microfabricated bistable modules. The study presented in this paper is dedicated to the microfabricated bistable modules, notably the structure and the actuators design and characterization. The results open a new paradigm in the field of microrobotics leading to open loop control and the design of various kinematics adapted to the microworld. Moreover, no external energy is required to maintain the microrobot in its position

Characterizations and Micro-assembly of Electrostatic Actuators for 3-DOF Micromanipulators in Laser Phonomicrosurgery.

International audienceThis paper presents a design of electrostatic actuators for 3-DOF micromanipulators in robot-assisted laser phonomicrosurgery. By integrating three sets of electrostatic actuators in a vertical configuration, scanning micro-mirror canbe used as a manipulator for laser source. Key enable technology for these miniaturized actuators is microfabrication processes for microelectromechanical systems (MEMS) because the processes can create submicron features with high precision, mass productive, and low cost. Based on precise micromachined electrostatic actuators, the platform is assembled using micro assembly approach. With sizes less than 5 mm x 5 mm x 5 mm, the proposed design has three degree-of-freedom: two rotational motions around the in-plane axis and one out-of-plane translational motion. Static and dynamic analysis of the device is simulated by Finite Element Analysis (FEA) and compared to theoretical calculations. This system preserves outstanding characteristics of electrostatic actuators for fast response and low power consumption. By micro-assembly of the scanning micromirror, the endoscopic systems can be created with a high range of motion and high scanning speed. The target applications of this system include laryngeal microsurgery, optical coherence tomography (OCT), and minimally invasive surgeries (MIS)

The Next-Generation Surgical Robots

The chronicle of surgical robots is short but remarkable. Within 20 years since the regulatory approval of the first surgical robot, more than 3,000 units were installed worldwide, and more than half a million robotic surgical procedures were carried out in the past year alone. The exceptionally high speeds of market penetration and expansion to new surgical areas had raised technical, clinical, and ethical concerns. However, from a technological perspective, surgical robots today are far from perfect, with a list of improvements expected for the next-generation systems. On the other hand, robotic technologies are flourishing at ever-faster paces. Without the inherent conservation and safety requirements in medicine, general robotic research could be substantially more agile and explorative. As a result, various technical innovations in robotics developed in recent years could potentially be grafted into surgical applications and ignite the next major advancement in robotic surgery. In this article, the current generation of surgical robots is reviewed from a technological point of view, including three of possibly the most debated technical topics in surgical robotics: vision, haptics, and accessibility. Further to that, several emerging robotic technologies are highlighted for their potential applications in next-generation robotic surgery

Integration of shape memory alloy for microactuation

Shape memory alloy (SMA) actuators in microelectromechanical system (MEMS) have a broad range of applications. The alloy material has unique properties underlying its high working density, simple structures, large displacement and excellent biocompatibility. These features have led to its commercialization in several applications such as micro-robotics and biomedical areas. However, full utilization of SMA is yet to be exploited as it faces various practical issues. In the area of microactuators in particular, fabricated devices suffer from low degrees of freedom (DoF), complex fabrication processes, larger sizes and limited displacement range. This thesis presents novel techniques of developing bulk-micromachined SMA microdevices by applying integration of multiple SMA microactuators, and monolithic methods using standard and unconventional MEMS fabrication processes. The thermomechanical behavior of the developed bimorph SMA microactuator is analyzed by studying the parameters such as thickness of SMA sheet, type and thickness of stress layer and the deposition temperature that affect the displacement. The microactuators are then integrated to form a novel SMA micromanipulator that consists of two links and a gripper at its end to provide three-DoF manipulation of small objects with overall actuation x- and y- axes displacement of 7.1 mm and 5.2 mm, respectively. To simplify the fabrication and improve the structure robustness, a monolithic approach was utilized in the development of a micro-positioning stage using bulk-micromachined SMA sheet that was fabricated in a single machining step. The design consisted of six spring actuators that provided large stage displacement range of 1.2 mm and 1.6 mm in x- and y-axes, respectively, and a rotation of 20° around the z-axis. To embed a self-sensing functionality in SMA microactuators, a novel wireless displacement sensing method based on integration of an SMA spiral-coil actuator in a resonant circuit is developed. These devices have the potential to promote the application of bulk-micromachined SMA actuator in MEMS area