Reducing Conducted Emissions at the Output of Full-Bridge DCDC Converters with High Voltage Steps

In this work, we analyze the impact of output filter design techniques aimed to reduce conducted emissions at the output of a DCDC power converter. A thorough analysis, based on high-frequency circuit models of the converter, is performed to assess expected improvements offered by different design strategies. This analysis is then confronted with measurements of conducted emissions at the output of a 300 W 48 V to 12 V Phase Shift Full Bridge (PSFB) prototype. Those experimental results demonstrate that a symmetric arrangement of the output LC filter and a direct bonding of the return output terminal of the converter to chassis are effective to reduce common mode conducted emissions at the output. Those results also demonstrate that the symmetry of the output LC filter can reduce conducted emissions in differential mode at high frequencies, where common mode to differential mode conversion is the predominant contribution to differential mode noise. However, direct bonding to chassis of the return output terminal may be ineffective at high frequencies due to the parasitic inductance associated with this connection. Main conclusions drawn for this analysis are applicable in general for isolated converters with a high voltage step between high and low voltage sides. Since the techniques of reduction of conducted emissions studied here do not increase the number of filter components, they are especially suitable for applications where high power density is an important requirement, e.g., aerospace or automotive applications.Ministerio de Economía y Competitividad de España TEC2014-54097-RUnión Europea H2020-EU.3.4.5.6

A Comprehensive Review on Planar Magnetics and the Structures to Reduce the Parasitic Elements and Improve Efficiency

Due to the need for highly efficient and compact power electronic converters to operate at higher frequencies, traditional wire-wound magnetics are not suitable. This paper provides a comprehensive review of planar magnetic technologies, discussing their advantages as well as associated disadvantages. An extensive review of the research literature is presented with the aim of suggesting models for planar magnetics. Several strategies are proposed to overcome the limitations of planar magnetics, including winding conduction loss, leakage inductance, and winding capacitance. The goal of this study is to provide engineers and researchers with a clear roadmap for designing planar magnetic devices

An EMI characterization and modeling study for consumer electronics and integrated circuits

“As internet-of-things (IoT) applications surge, wireless connectivity becomes an essential part of the network. Smart home, one of the most promising application scenarios of IoT, will improve our life quality enormously. However, electromagnetic interference (EMI) to the receiving antenna, either from another electronic product or from a module/an integrated circuit(IC) inside the same wireless device, will degrade the performance of wireless connectivity, thus influencing the user experience. Characterization and modeling of the EMI become increasingly important. In the first part, an improved method to extract equivalent dipoles from magnitude- only electromagnetic-field data based on the genetic algorithm and back-and-forth iteration algorithm is proposed. The method provides an automatic flow to extract the equivalent dipoles from electromagnetic-field data on arbitrarily shaped scanning surfaces and minimizes the number of extracted dipoles. In the second part, both the differential mode (DM) and common mode (CM) EMI below 1 MHz from the ac-dc power supply in a LED TV is analyzed and modeled. Through joint time-frequency analysis, the drain-to-source voltage of the power MOSFET in the power factor correction (PFC) converter is identified as the dominant noise source of both CM and DM EMI below 1 MHz from the power supply. The current paths of DM and CM EMI are explained and modeled by a linear equivalent circuit model. In the last part, the noise source and current path of the conducted CM EMI noise from a Qi-compliant wireless power transfer (WPT) system for mobile applications are analyzed. The analysis and modeling explain the mechanism of the CM EMI noise and provide guidelines to reduce the CM EMI noise”--Abstract, page iv

Modeling and analyzing parasitic parameters in high frequency converters

This research focuses on electromagnetic interference (EMI) / electromagnetic compatibility (EMC) design and analysis in power electronics systems. To limit the EMI under the standards, different methods and strategies are investigated. Parasitic parameters of high frequency (HF) transformer are analyzed using a novel analytical method, finite element method (FEM), and experimental measurements for different structures and windings arrangements. Also, the magnetic field, electric field, electric displacement, and electric potential distribution are simulated and analyzed. Moreover, a high voltage system is considered and analyzed to improve the EMC. The EMI propagation paths are analyzed. The EMI noise level of the system is obtained and compared to the IEC61800-3 standard. To improve the EMC, the parasitic parameters of the transformer, as the main path of EMI circulation, are analyzed and optimized to block the propagation. Furthermore, the geometry structure of the HF transformer is optimized to lower the parasitics in the system. Three pareto-optimal techniques are investigated for the optimization. The models and results are verified by 3D-FEM and experimental results for several given scenarios. Furthermore, the EMC modeling and conducted EMI analysis are developed for a system including an AC-DC-DC power supply (rectifier and dual active bridge (DAB) converter). Moreover, the common mode (CM) EMI noise propagation through the system is discussed and the noise sources and effect of components on the noise are analyzed. Additionally, the CM impedance of different parts of the system and the noise levels are discussed. Finally, EMI attenuation techniques were applied to the system --Abstract, page iv