An Ultra-Low-Power RFID/NFC Frontend IC Using 0.18 μm CMOS Technology for Passive Tag Applications

Battery-less passive sensor tags based on RFID or NFC technology have achieved much popularity in recent times. Passive tags are widely used for various applications like inventory control or in biotelemetry. In this paper, we present a new RFID/NFC frontend IC (integrated circuit) for 13.56 MHz passive tag applications. The design of the frontend IC is compatible with the standard ISO 15693/NFC 5. The paper discusses the analog design part in details with a brief overview of the digital interface and some of the critical measured parameters. A novel approach is adopted for the demodulator design, to demodulate the 10% ASK (amplitude shift keying) signal. The demodulator circuit consists of a comparator designed with a preset offset voltage. The comparator circuit design is discussed in detail. The power consumption of the bandgap reference circuit is used as the load for the envelope detection of the ASK modulated signal. The sub-threshold operation and low-supply-voltage are used extensively in the analog design—to keep the power consumption low. The IC was fabricated using 0.18 μ m CMOS technology in a die area of 1.5 mm × 1.5 mm and an effective area of 0.7 m m 2 . The minimum supply voltage desired is 1.2 V, for which the total power consumption is 107 μ W. The analog part of the design consumes only 36 μ W, which is low in comparison to other contemporary passive tags ICs. Eventually, a passive tag is developed using the frontend IC, a microcontroller, a temperature and a pressure sensor. A smart NFC device is used to readout the sensor data from the tag employing an Android-based application software. The measurement results demonstrate the full passive operational capability. The IC is suitable for low-power and low-cost industrial or biomedical battery-less sensor applications. A figure-of-merit (FOM) is proposed in this paper which is taken as a reference for comparison with other related state-of-the-art researches

Analog hardware security and hardware authentication

Hardware security and hardware authentication have become more and more important concerns in the manufacture of trusted integrated circuits. In this dissertation, a detailed study of hardware Trojans in analog circuits characterized by the presence of extra operating points or modes is presented. In a related study, a counterfeit countermeasure method based upon PUF authentication circuits is proposed for addressing the growing proliferation of counterfeit integrated circuits in the supply chain. Most concerns about hardware Trojans in semiconductor devices are based upon an implicit assumption that attackers will focus on embedding Trojans in digital hardware by making malicious modifications to the Boolean operation of a circuit. In stark contrast, hardware Trojans can be easily embedded in some of the most basic analog circuits. In this work, a particularly insidious class of analog hardware Trojans that require no architectural modifications, no area or power overhead, and prior to triggering, that leave no signatures in any power domains or delay paths is introduced. The Power/Architecture/Area/Signature Transparent (PAAST) characteristics help the Trojan “hide” and make them very difficult to detect with existing hardware Trojan detection methods. Cleverly hidden PAAST Trojans are nearly impossible to detect with the best simulation and verification tools, even if a full and accurate disclosure of the circuit schematic and layout is available. Aside from the work of the author of this dissertation and her classmates, the literature is void of discussions of PAAST analog hardware Trojans. In this work, examples of circuits showing the existence of PAAST analog hardware Trojans are given, the PAAST characteristics of these types of hardware Trojans are discussed, and heuristic detection methods that can help to detect these analog hardware Trojans are proposed. Another major and growing problem in the modern IC supply chain is the proliferation of counterfeit chips that are often characterized by different or inferior performance characteristics and reduced reliability when compared with authentic parts. A counterfeit countermeasure method is proposed that should lower the entry barrier for major suppliers of commercial off the shelf (COTS) parts to offer authenticated components to the military and other customers that have high component reliability requirements. The countermeasure is based upon a PUF authentication circuit that requires no area, pin, or power overhead, and causes no degradation of performance of existing and future COTS components

Modeling and Validation of 4H-SiC Low Voltage MOSFETs for Integrated Circuit Design

Silicon Carbide is a promising wide bandgap material and gradually becoming the first choice of semiconductor for high density and high efficiency power electronics in medium voltage range (500-1500V). SiC has also excellent thermal conductivity and the devices fabricated with the material can operate at high temperature (~ 400 ⁰C). Thus, a power electronic system built with SiC devices requires less cooling requirement and saves board space and cost. The high temperature applications of SiC material can also be extended to space exploration, oil and gas rigging, aerospace and geothermal energy systems for data acquisition, sensing and instrumentation and power conditioning and conversion. But the high temperature capability of SiC can only be utilized when the integrated circuits can be designed in SiC technology and high fidelity compact models of the semiconductor devices are a priori for reliable and high yielding integrated circuit design. The objective of this work is to develop industry standard compact models for SiC NMOS and PMOS devices. A widely used compact model used in silicon industry called BSIM3V3 is adopted as a foundation to build the model for SiC MOSFET. The models optimized with the built-in HSPICE BSIM3V3.3 were used for circuit design in one tape-out but BSIM3V3 was found to be inadequate to model all of the characteristics of SiC MOSFET due to the presence of interface trapped charge. In the second tape-out, the models for SiC NMOS and PMOS were optimized based on the built-in HSPICE BSIM4V6.5 and a number of functioning circuits which have been published in reputed journal and conference were designed based on the models. Although BSIM4 is an enhanced version of BSIM3V3, it also could not model a few deviant SiC MOSFET characteristics such as body effect, soft saturation etc. The new model developed for SiC NMOS and PMOS based on BSIM4V7.0 is called BSIM4SIC and can model the entire range of device characteristics of the devices. The BSIM4SIC models are validated with a wide range of measured data and verified using the models in the simulation of numerous circuits such as op-amp, comparator, linear regulator, reference and ADC/DAC

Design, Modeling and Analysis of Non-classical Field Effect Transistors

Transistor scaling following per Moore\u27s Law slows down its pace when entering into nanometer regime where short channel effects (SCEs), including threshold voltage fluctuation, increased leakage current and mobility degradation, become pronounced in the traditional planar silicon MOSFET. In addition, as the demand of diversified functionalities rises, conventional silicon technologies cannot satisfy all non-digital applications requirements because of restrictions that stem from the fundamental material properties. Therefore, novel device materials and structures are desirable to fuel further evolution of semiconductor technologies. In this dissertation, I have proposed innovative device structures and addressed design considerations of those non-classical field effect transistors for digital, analog/RF and power applications with projected benefits. Considering device process difficulties and the dramatic fabrication cost, application-oriented device design and optimization are performed through device physics analysis and TCAD modeling methodology to develop design guidelines utilizing transistor\u27s improved characteristics toward application-specific circuit performance enhancement. Results support proposed device design methodologies that will allow development of novel transistors capable of overcoming limitation of planar nanoscale MOSFETs. In this work, both silicon and III-V compound devices are designed, optimized and characterized for digital and non-digital applications through calibrated 2-D and 3-D TCAD simulation. For digital functionalities, silicon and InGaAs MOSFETs have been investigated. Optimized 3-D silicon-on-insulator (SOI) and body-on-insulator (BOI) FinFETs are simulated to demonstrate their impact on the performance of volatile memory SRAM module with consideration of self-heating effects. Comprehensive simulation results suggest that the current drivability degradation due to increased device temperature is modest for both devices and corresponding digital circuits. However, SOI FinFET is recommended for the design of low voltage operation digital modules because of its faster AC response and better SCEs management than the BOI structure. The FinFET concept is also applied to the non-volatile memory cell at 22 nm technology node for low voltage operation with suppressed SCEs. In addition to the silicon technology, our TCAD estimation based on upper projections show that the InGaAs FinFET, with superior mobility and improved interface conditions, achieve tremendous drive current boost and aggressively suppressed SCEs and thereby a strong contender for low-power high-performance applications over the silicon counterpart. For non-digital functionalities, multi-fin FETs and GaN HEMT have been studied. Mixed-mode simulations along with developed optimization guidelines establish the realistic application potential of underlap design of silicon multi-Fin FETs for analog/RF operation. The device with underlap design shows compromised current drivability but improve analog intrinsic gain and high frequency performance. To investigate the potential of the novel N-polar GaN material, for the first time, I have provided calibrated TCAD modeling of E-mode N-polar GaN single-channel HEMT. In this work, I have also proposed a novel E-mode dual-channel hybrid MIS-HEMT showing greatly enhanced current carrying capability. The impact of GaN layer scaling has been investigated through extensive TCAD simulations and demonstrated techniques for device optimization

Ultra-small low power temperature-to-digital converter and verification methods of analog circuit with Trojan states

Accurate, small and low-power CMOS temperature sensors designed for multi-position temperature monitoring of power management in multi-core processors are proposed. The temperature sensors utilize the temperature characteristics of the threshold voltage of a MOS transistors to sense temperature and are highly linear from 60°C to 90°C. This is the temperature range needed for the power management applications where temperature sensors are strategically placed at multiple locations in each core to protect the processor from temperature-induced reliability degradation. A temperature-to-digital converter (TDC) that does not require either a reference generator or an ADC is also introduced, and it exhibits low supply sensitivity, small die area, and low power consumption. Both analog threshold voltage based temperature sensor and a prototype TDC designed to support multi-position thermal-sensing for power management applications from 60°C to 90°C are implemented in an IBM 0.13μm CMOS process with a 1.2V power supply. A new verification approach with several variants for identifying the number of stable equilibrium points in supply-insensitive bias generators, references, and temperature sensors based upon self-stabilized feedback loops is introduced. This provides a simple and practical method for determining if these circuits require a “start-up” circuit and, if needed, for verifying that the startup circuit is effective at eliminating undesired stable equilibrium points in the presence of process and temperature variations. These undesired stable equilibrium points are often referred to as Trojan states. It will be shown that some widely used approaches for verification do not guarantee Trojan states have been removed. Some of the methods introduced appear to be more practical to work with than others. A group of benchmark circuit with Trojan states will be introduced and used to demonstrate the effectiveness of the new method

Integrated circuit & system design for concurrent amperometric and potentiometric wireless electrochemical sensing

Complementary Metal-Oxide-Semiconductor (CMOS) biosensor platforms have steadily grown in healthcare and commerial applications. This technology has shown potential in the field of commercial wearable technology, where CMOS sensors aid the development of miniaturised sensors for an improved cost of production and response time. The possibility of utilising wireless power and data transmission techniques for CMOS also allows for the monolithic integration of the communication, power and sensing onto a single chip, which greatly simplifies the post-processing and improves the efficiency of data collection. The ability to concurrently utilise potentiometry and amperometry as an electrochemical technique is explored in this thesis. Potentiometry and amperometry are two of the most common transduction mechanisms for electrochemistry, with their own advantages and disadvantages. Concurrently applying both techniques will allow for real-time calibration of background pH and for improved accuracy of readings. To date, developing circuits for concurrently sensing potentiometry and amperometry has not been explored in the literature. This thesis investigates the possibility of utilising CMOS sensors for wireless potentiometric and amperometric electrochemical sensing. To start with, a review of potentiometry and amperometry is evaluated to understand the key factors behind their operation. A new configuration is proposed whereby the reference electrode for both electrochemistry techniques are shared. This configuration is then compared to both the original configurations to determine any differences in the sensing accuracy through a novel experiment that utilises hydrogen peroxide as a measurement analyte. The feasibility of the configuration with the shared reference electrode is proven and utilised as the basis of the electrochemical configuration for the front end circuits. A unique front-end circuit named DAPPER is developed for the shared reference electrode topology. A review of existing architectures for potentiometry and amperometry is evaluated, with a specific focus on low power consumption for wireless applications. In addition, both the electrochemical sensing outputs are mixed into a single output data channel for use with a near-field communication (NFC). This mixing technique is also further analysed in this thesis to understand the errors arising due to various factors. The system is fabricated on TSMC 180nm technology and consumes 28µW. It measures a linear input current range from 250pA - 0.1µW, and an input voltage range of 0.4V - 1V. This circuit is tested and verified for both electrical and electrochemical tests to showcase its feasibility for concurrent measurements. This thesis then provides the integration of wireless blocks into the system for wireless powering and data transmission. This is done through the design of a circuit named SPACEMAN that consists of the concurrent sensing front-end, wireless power blocks, data transmission, as well as a state machine that allows for the circuit to switch between modes: potentiometry only, amperometry only, concurrent sensing and none. The states are switched through re-booting the circuit. The core size of the electronics is 0.41mm² without the coil. The circuit’s wireless powering and data transmission is tested and verified through the use of an external transmitter and a connected printed circuit board (PCB) coil. Finally, the future direction for ongoing work to proceed towards a fully monolithic electrochemical technique is discussed through the next development of a fully integrated coil-on-CMOS system, on-chip electrodes with the electroplating and microfludics, the development of an external transmitter for powering the device and a test platform. The contributions of this thesis aim to formulate a use for wireless electrochemical sensors capable of concurrent measurements for use in wearable devices.Open Acces

Built-in self test of RF subsystems

textWith the rapid development of wireless and wireline communications, a variety of new standards and applications are emerging in the marketplace. In order to achieve higher levels of integration, RF circuits are frequently embedded into System on Chip (SoC) or System in Package (SiP) products. These developments, however, lead to new challenges in manufacturing test time and cost. Use of traditional RF test techniques requires expensive high frequency test instruments and long test time, which makes test one of the bottlenecks for reducing IC costs. This research is in the area of built-in self test technique for RF subsystems. In the test approach followed in this research, on-chip detectors are used to calculate circuits specifications, and data converters are used to collect the data for analysis by an on-chip processor. A novel on-chip amplitude detector has been designed and optimized for RF circuit specification test. By using on-chip detectors, both the system performance and specifications of the individual components can be accurately measured. On-chip measurement results need to be collected by Analog to Digital Converters (ADCs). A novel time domain, low power ADC has been designed for this purpose. The ADC architecture is based on a linear voltage controlled delay line. Using this structure results in a linear transfer function for the input dependent delay. The time delay difference is then compared to a reference to generate a digital code. Two prototype test chips were fabricated in commercial CMOS processes. One is for the RF transceiver front end with on-chip detectors; the other is for the test ADC. The 940MHz RF transceiver front-end was implemented with on-chip detectors in a 0.18 [micrometer] CMOS technology. The chips were mounted onto RF Printed Circuit Boards (PCBs), with tunable power supply and biasing knobs. The detector was characterized with measurements which show that the detector keeps linear performance over a wide input amplitude range of 500mV. Preliminary simulation and measurements show accurate transceiver performance prediction under process variations. A 300MS/s 6 bit ADC was designed using the novel time domain architecture in a 0.13 [micrometer] standard digital CMOS process. The simulation results show 36.6dB Signal to Noise Ratio (SNR), 34.1dB Signal to Noise and Distortion Ratio (SNDR) for 99MHz input, Differential Non-Linearity (DNL)<0.2 Least Significant Bit (LSB), and Integral Non-Linearity (INL)<0.5LSB. Overall chip power is 2.7mW with a 1.2V power supply. The built-in detector RF test was extended to a full transceiver RF front end test with a loop-back setup, so that measurements can be made to verify the benefits of the technique. The application of the approach to testing gain, linearity and noise figure was investigated. New detector types are also evaluated. In addition, the low-power delay-line based ADC was characterized and improved to facilitate gathering of data from the detector. Several improved ADC structures at the system level are also analyzed. The built-in detector based RF test technique enables the cost-efficient test for SoCs.Electrical and Computer Engineerin