A 5-Gb/s 66 dB CMOS variable-gain amplifier with reconfigurable DC-offset cancellation for multi-standard applications

This paper proposes a variable gain amplifier (VGA) with reconfigurable DC-offset cancellation (DCOC) for multi-standard applications. In this design, a cell-based design method and some bandwidth extension technologies are adopted to achieve a high data rate and a wide gain control range simultaneously. In addition, the DCOC having a tunable lower-cutoff frequency can make an optimum compromise between BER and SNR according to the specified baseband standard. The measurements show that the VGA achieves a gain control range from −6 dB to 60 dB, a bandwidth beyond 3 GHz, and a tunable lower-cutoff frequency from 0 to 300 kHz. When entering a 2 23 −1 pseudo-random bit sequence signal at 5 Gb/s, the VGA consumes 17 mW from a 1.2-V supply and the output data peak-to-peak jitter is less than 40 ps. The VGA is fabricated in a 90-nm CMOS process with a chip size (including all pads) of 0.52×0.5 mm 2

Design, Fault Modeling and Testing Of a Fully Integrated Low Noise Amplifier (LNA) in 45 nm CMOS Technology for Inter and Intra-Chip Wireless Interconnects

Research in recent years has demonstrated that intra and inter-chip wireless interconnects are capable of establishing energy-efficient data communications within as well as between multiple chips. This thesis introduces a circuit level design of a source degenerated two stage common source low noise amplifier suitable for such wireless interconnects in 45-nm CMOS process. The design consists of a simple two-stage common source structure based Low Noise Amplifier (LNA) to boost the degraded received signal. Operating at 60GHz, the proposed low noise amplifier consumes only 4.88 mW active power from a 1V supply while providing 17.2 dB of maximum gain at 60 GHz operating frequency at very low noise figure of 2.8 dB, which translates to a figure of merit of 16.1 GHz and IIP3 as -14.38 dBm

A 60-GHz OOK receiver with an On-chip antenna in 90 nm CMOS

10.1109/JSSC.2010.2053095IEEE Journal of Solid-State Circuits4591720-1731IJSC

Multi-gigabit CMOS analog-to-digital converter and mixed-signal demodulator for low-power millimeter-wave communication systems

The objective of the research is to develop high-speed ADCs and mixed-signal demodulator for multi-gigabit communication systems using millimeter-wave frequency bands in standard CMOS technology. With rapid advancements in semiconductor technologies, mobile communication devices have become more versatile, portable, and inexpensive over the last few decades. However, plagued by the short lifetime of batteries, low power consumption has become an extremely important specification in developing mobile communication devices. The ever-expanding demand of consumers to access and share information ubiquitously at faster speeds requires higher throughputs, increased signal-processing functionalities at lower power and lower costs. In today’s technology, high-speed signal processing and data converters are incorporated in almost all modern multi-gigabit communication systems. They are key enabling technologies for scalable digital design and implementation of baseband signal processors. Ultimately, the merits of a high performance mixed-signal receiver, such as data rate, sensitivity, signal dynamic range, bit-error rate, and power consumption, are directly related to the quality of the embedded ADCs. Therefore, this dissertation focuses on the analysis and design of high-speed ADCs and a novel broadband mixed-signal demodulator with a fully-integrated DSP composed of low-cost CMOS circuitry. The proposed system features a novel dual-mode solution to demodulate multi-gigabit BPSK and ASK signals. This approach reduces the resolution requirement of high-speed ADCs, while dramatically reducing its power consumption for multi-gigabit wireless communication systems.PhDGee-Kung Chang - Committee Chair; Chang-Ho Lee - Committee Member; Geoffrey Ye Li - Committee Member; Paul A. Kohl - Committee Member; Shyh-Chiang Shen - Committee Membe

Evaluating Techniques for Wireless Interconnected 3D Processor Arrays

In this thesis the viability of a wireless interconnect network for a highly parallel computer is investigated. The main theme of this thesis is to project the performance of a wireless network used to connect the processors in a parallel machine of such design. This thesis is going to investigate new design opportunities a wireless interconnect network can offer for parallel computing. A simulation environment is designed and implemented to carry out the tests. The results have shown that if the available radio spectrum is shared effectively between building blocks of the parallel machine, there are substantial chances to achieve high processor utilisation. The results show that some factors play a major role in the performance of such a machine. The size of the machine, the size of the problem and the communication and computation capabilities of each element of the machine are among those factors. The results show these factors set a limit on the number of nodes engaged in some classes of tasks. They have shown promising potential for further expansion and evolution of our idea to new architectural opportunities, which is discussed by the end of this thesis. To build a real machine of this type the architects would need to solve a number of challenging problems including heat dissipation, delivering electric power and Chip/board design; however, these issues are not part of this thesis and will be tackled in future