8 research outputs found

    Crosstalk-induced jitter equalization

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    A novel jitter equalization circuit is presented that addresses crosstalk-induced jitter in high-speed communication links. A simplified model of electromagnetic coupling demonstrates the generation of crosstalk-induced jitter. This model suggests an equalizer that compensates for the data-induced electromagnetic coupling between adjacent links. Additionally, a data-dependent jitter equalizer that provides separate adjustments of rising and falling edge deviations is presented. The circuits are implemented using 130 nm MOSFETs and operate at 5-10Gb/s. The results demonstrate reduced deterministic jitter and lower bit-error rate. At 10Gb/s, the crosstalk-induced jitter equalizer opens the eye at BER of 10^(-12) from 17ps to 45ps

    Deterministic Jitter in Broadband Communication

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    The past decade has witnessed a drastic change in the design of high-speed serial links. While Silicon fabrication technology has produced smaller, faster transistors, transmission line interconnects between chips and through backplanes have not substantially improved and have a practical bandwidth of around 3GHz. As serial link speeds increase, new techniques must be introduced to overcome the bandwidth limitation and maintain digital signal integrity. This thesis studies timing issues pertaining to bandwidth-limited interconnects. Jitter is defined as the timing uncertainty at a threshold used to detect the digital signal. Reliable digital communication requires minimizing jitter. The analysis and modeling presented here focuses on two types of deterministic jitter. First, dispersion of the digital signal in a bandwidth-limited channel creates data-dependent jitter. Our analysis links data sequences to unique timing deviations through the channel response and is shown for general linear time-invariant systems. A Markov model is constructed to study the impact of jitter on the operation of the serial link and provide insight in circuit performance. Second, an analysis of bounded-uncorrected jitter resulting from crosstalk induced in parallel serial links is presented. Timing equalization is introduced to improve the signal integrity of high-speed links. The analysis of deterministic jitter leads to novel techniques for compensating the timing ambiguity in the received data. Data-dependent jitter equalization is discussed at both the receiver, where it complements the operation of clock and data recovery circuits, and as a phase pre-emphasis technique. Crosstalk-induced, bounded-uncorrected jitter can also be compensated. By detecting electromagnetic modes between neighboring serial links, a transmitter or receiver anticipates the timing deviation that has occurred along the transmission line. Finally, we discuss a new circuit technique for submillimeter integrated circuits. Demands of wireless communication and the high speed of Silicon Germanium transistors provide opportunities for unique radio architectures for submillimeter integrated circuits. Scalable, fully-integrated phased arrays control a radiated beam pattern electronically through tiling multiple chips. Coupled-oscillator arrays are used for the first time to subharmonically injection-lock across a chip or between multiple chips to provide phase coherence across an array.</p

    Hybrid NRZ/Multi-Tone Signaling for High-Speed Low-Power Wireline Transceivers

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    Over the past few decades, incessant growth of Internet networking traffic and High-Performance Computing (HPC) has led to a tremendous demand for data bandwidth. Digital communication technologies combined with advanced integrated circuit scaling trends have enabled the semiconductor and microelectronic industry to dramatically scale the bandwidth of high-loss interfaces such as Ethernet, backplane, and Digital Subscriber Line (DSL). The key to achieving higher bandwidth is to employ equalization technique to compensate the channel impairments such as Inter-Symbol Interference (ISI), crosstalk, and environmental noise. Therefore, todayâs advanced input/outputs (I/Os) has been equipped with sophisticated equalization techniques to push beyond the uncompensated bandwidth of the system. To this end, process scaling has continually increased the data processing capability and improved the I/O performance over the last 15 years. However, since the channel bandwidth has not scaled with the same pace, the required signal processing and equalization circuitry becomes more and more complicated. Thereby, the energy efficiency improvements are largely offset by the energy needed to compensate channel impairments. In this design paradigm, re-thinking about the design strategies in order to not only satisfy the bandwidth performance, but also to improve power-performance becomes an important necessity. It is well known in communication theory that coding and signaling schemes have the potential to provide superior performance over band-limited channels. However, the choice of the optimum data communication algorithm should be considered by accounting for the circuit level power-performance trade-offs. In this thesis we have investigated the application of new algorithm and signaling schemes in wireline communications, especially for communication between microprocessors, memories, and peripherals. A new hybrid NRZ/Multi-Tone (NRZ/MT) signaling method has been developed during the course of this research. The system-level and circuit-level analysis, design, and implementation of the proposed signaling method has been performed in the frame of this work, and the silicon measurement results have proved the efficiency and the robustness of the proposed signaling methodology for wireline interfaces. In the first part of this work, a 7.5 Gb/s hybrid NRZ/MT transceiver (TRX) for multi-drop bus (MDB) memory interfaces is designed and fabricated in 40 nm CMOS technology. Reducing the complexity of the equalization circuitry on the receiver (RX) side, the proposed architecture achieves 1 pJ/bit link efficiency for a MDB channel bearing 45 dB loss at 2.5 GHz. The measurement results of the first prototype confirm that NRZ/MT serial data TRX can offer an energy-efficient solution for MDB memory interfaces. Motivated by the satisfying results of the first prototype, in the second phase of this research we have exploited the properties of multi-tone signaling, especially orthogonality among different sub-bands, to reduce the effect of crosstalk in high-dense wireline interconnects. A four-channel transceiver has been implemented in a standard CMOS 40 nm technology in order to demonstrate the performance of NRZ/MT signaling in presence of high channel loss and strong crosstalk noise. The proposed system achieves 1 pJ/bit power efficiency, while communicating over a MDB memory channel at 36 Gb/s aggregate data rate

    Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

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    As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

    A 5Gb/s Single-Ended Parallel Receiver with Adaptive FEXT Cancellation

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    Analysis and Design of High Speed Serial Interfaces for Automotive Applications

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    The demand for an enriched end-user experience and increased performance in next generation electronic applications is never ending, and it is a common trend for a wide spectrum of applications owing to different markets, like computing, mobile communication and automotive. For this reason High Speed Serial Interface have become widespread components for nowadays electronics with a constant demand for power reduction and data rate increase. In the frame of gigabit serial systems, the work discussed in this thesis develops in two directions: on one hand, the aim is to support the continuous data rate increase with the development of novel link modeling approaches that will be employed for system level evaluation and as support in the design and characterization phases. On the other hand, the design considerations and challenges in the implementation of the transmitter, one of the most delicate blocks for the signal integrity performance of the link, are central. The first part of the activity regarding link performance predictions lead to the development of an enhanced statistical simulation approach, capable to account for the transmitter waveform shape in the ISI analysis, a characteristic that is missed by the available state-ofthe- art simulation approaches. The proposed approach has been extensively tested by comparison with traditional simulation approaches (Spice-like simulators) and validated against experimental characterization of a test system, with satisfactory results. The second part of the activity consists in the design of a high speed transmitter in a deeply scaled CMOS technology, spanning from the concept of the circuit, its implementation and characterization. Targets of the design are to achieve a data rate of 5 Gb/s with a minimum voltage swing of 800 mV, thus doubling the data rate of the current transmitter implementation, and reduce the power dissipation adopting a voltage mode architecture. The experimental characterization of the fabricated lot draws a twofold picture, with some of the performance figures showing a very good qualitative and quantitative agreement with pre-silicon simulations, and others revealing a poor performance level, especially for the eye diagram. Investigation of the root causes by the analysis of the physical silicon design, of the bonding scheme of the prototypes and of the pre-silicon simulations is reported. Guidelines for the redesign of the circuit are also given.Nel panorama delle applicazioni elettroniche il miglioramento delle performance di un prodotto da una generazione alla successiva ha lo scopo di offrire all\u2019utilizzatore finale nuove funzioni e migliorare quelle esistenti. Negli ultimi anni grazie al costante avanzamento della tecnologia integrata, si \ue8 assistito ad un enorme sviluppo della capacit\ue0 computazionale dei dispositivi in tutti i segmenti di mercato, quali ad esempio l\u2019information technology, la comunicazione mobile e l\u2019automotive. La conseguente necessit\ue0 di mettere in comunicazione dispostivi diversi all\u2019interno della stessa applicazione e di traferire grosse quantit\ue0 di dati ha provocato una capillare diffusione delle interfacce seriali ad alta velocit\ue0, o High Speed Serial Interfaces (HSSIs). La necessit\ue0 di ridurre il consumo di potenza e aumentare il bit rate per questo tipo di applicazioni \ue8 diventata dunque un ambito di ricerca di estremo interesse. Il lavoro discusso in questa tesi si colloca nell\u2019ambito della trasmissione di dati seriali a bit rate superiori ad 1Gb/s e si sviluppa in due direzioni: da un lato, a sostegno del continuo aumento del bit rate nelle nuove generazioni di interfacce, \ue8 stato affrontato lo sviluppo di nuovi approcci di modellazione del sistema, che possano essere impiegati nella valutazione delle prestazioni dell\u2019interfaccia e a supporto delle fasi di progettazione e di caratterizzazione. Dall\u2019altro lato, si \ue8 focalizzata l\u2019attenzione sulle sfide e sulle problematiche inerenti il progetto di uno dei blocchi pi\uf9 delicati per le prestazioni del sistema, il trasmettitore. La prima parte della tesi ha come oggetto lo sviluppo di un approccio di simulazione statistico innovativo, in grado di includere nell\u2019analisi degli effetti dell\u2019interferenza di intersimbolo anche la forma d\u2019onda prodotta all\u2019uscita del trasmettitore, una caratteristica che non \ue8 presente in altri approcci di simulazione proposti in letteratura. La tecnica proposta \ue8 ampiamente testata mediante il confronto con approcci di simulazione tradizionali (di tipo Spice) e mediante il confronto con la caratterizzazione sperimentale di un sistema di test, con risultati pienamente soddisfacenti. La seconda parte dell\u2019attivit\ue0 riguarda il progetto di un trasmettitore integrato high speed in tecnologia CMOS a 40nm e si estende dallo studio di fattibilit\ue0 del circuito fino alla sua realizzazione e caratterizzazione. Gli obiettivi riguardano il raggiungimento di un bit rate pari a 5 Gb/s, raddoppiando cos\uec il bit rate dell\u2019attuale implementazione, e di una tensione differenziale di uscita minima di 800mV (picco-picco) riducendo allo stesso tempo la potenza dissipata mediante l\u2019adozione di una architettura Voltage Mode. I risultati sperimentali ottenuti dal primo lotto fabbricato non delineano un quadro univoco: alcune performance mostrano un ottimo accordo qualitativo e quantitativo con le simulazioni pre-fabbricazione, mentre prestazioni non soddisfacenti sono state ottenute in particolare per il diagramma ad occhio. Grazie all\u2019analisi del layout del prototipo, del bonding tra silicio e package e delle simulazioni pre-fabbricazione \ue8 stato possibile risalire ai fattori responsabili del degrado delle prestazioni rispetto alla previsioni pre-fabbricazione, permettendo inoltre di delineare le linee guida da seguire nella futura progettazione di un nuovo prototipo
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