State of the art in chip-to-chip interconnects

This thesis presents a study of short-range links for chips mounted in the same package, on printed circuit boards or interposers. Implemented in CMOS technology between 7 and 250 nm, with links that operate at a data rate between 0,4 and 112 Gb/s/pin and with energy efficiencies from 0,3 to 67,7 pJ/bit. The links operate on channels with an attenuation lower than 50 dB. A comparison is made with graphical representations between the different articles that shows the correlation between the different essential metrics of chip-to-chip interconnects, as well as its evolution over the last 20 years.Esta tesis presenta un estudio de enlaces de corto alcance para chips montados en un mismo paquete, en placas de circuito impreso o intercaladores. Implementado en tecnología CMOS entre 7 y 250 nm, con enlaces que operan a una velocidad de datos entre 0,4 y 112 Gb/s/pin y con eficiencias energéticas de 0,3 a 67,7 pJ/bit. Los enlaces operan en canales con una atenuación inferior a 50 dB. Se realiza una comparación con representaciones gráficas entre los diferentes artículos que muestra la correlación entre las distintas métricas esenciales de las interconexiones chip a chip, así como su evolución en los últimos 20 años.Aquesta tesi presenta un estudi d'enllaços de curt abast per a xips muntats en el mateix paquet, en plaques de circuits impresos o interposers. Implementat en tecnologia CMOS entre 7 i 250 nm, amb enllaços que funcionen a una velocitat de dades entre 0,4 i 112 Gb/s/pin i amb eficiències energètiques de 0,3 a 67,7 pJ/bit. Els enllaços funcionen en canals amb una atenuació inferior a 50 dB. Es fa una comparació amb representacions gràfiques entre els diferents articles que mostra la correlació entre les diferents mètriques essencials d'interconnexions xip a xip, així com la seva evolució en els darrers 20 anys

Evaluating Techniques for Wireless Interconnected 3D Processor Arrays

In this thesis the viability of a wireless interconnect network for a highly parallel computer is investigated. The main theme of this thesis is to project the performance of a wireless network used to connect the processors in a parallel machine of such design. This thesis is going to investigate new design opportunities a wireless interconnect network can offer for parallel computing. A simulation environment is designed and implemented to carry out the tests. The results have shown that if the available radio spectrum is shared effectively between building blocks of the parallel machine, there are substantial chances to achieve high processor utilisation. The results show that some factors play a major role in the performance of such a machine. The size of the machine, the size of the problem and the communication and computation capabilities of each element of the machine are among those factors. The results show these factors set a limit on the number of nodes engaged in some classes of tasks. They have shown promising potential for further expansion and evolution of our idea to new architectural opportunities, which is discussed by the end of this thesis. To build a real machine of this type the architects would need to solve a number of challenging problems including heat dissipation, delivering electric power and Chip/board design; however, these issues are not part of this thesis and will be tackled in future