3 research outputs found

    Full Swing 20 GHz Frequency Divider with 1 V Supply Voltage in FD-SOI 28 nm Technology

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    In this paper we present the design of a pro- grammable frequency divider in 28 nm FD-SOI CMOS technology. It consists of the cascade of a divide-by-2 cell and divide- by-2/3 blocks. The final circuit is capable of dividing by even numbers between 128 and 254. The forward-body-bias property of the process and the differential-cascode voltage-switch-logic (DCVSL) family are used to achieve high operation speed. The proposed circuit achieves a maximum operating frequency of 20 GHz at 1 V supply voltage. And the area and the power consumption of the programmable divider are 1815 μm2 and 4.35 mW, respectively

    Power-efficient high-speed interface circuit techniques

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    Inter- and intra-chip connections have become the new challenge to enable the scaling of computing systems, ranging from mobile devices to high-end servers. Demand for aggregate I/O bandwidth has been driven by applications including high-speed ethernet, backplane micro-servers, memory, graphics, chip-to-chip and network onchip. I/O circuitry is becoming the major power consumer in SoC processors and memories as the increasing bandwidth demands larger per-pin data rate or larger I/O pin count per component. The aggregate I/O bandwidth has approximately doubled every three to four years across a diverse range of standards in different applications. However, in order to keep pace with these standards enabled in part by process-technology scaling, we will require more than just device scaling in the near future. New energy-efficient circuit techniques must be proposed to enable the next generations of handheld and high-performance computers, given the thermal and system-power limits they start facing. ^ In this work, we are proposing circuit architectures that improve energy efficiency without decreasing speed performance for the most power hungry circuits in high speed interfaces. By the introduction of a new kind of logic operators in CMOS, called implication operators, we implemented a new family of high-speed frequency dividers/prescalers with reduced footprint and power consumption. New techniques and circuits for clock distribution, for pre-emphasis and for driver at the transmitter side of the I/O circuitry have been proposed and implemented. At the receiver side, new DFE architecture and CDR have been proposed and have been proven experimentally

    A 1V 2mW 17GHz multi-modulus frequency divider based on TSPC logic using 65nm CMOS

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