메모리 인터페이스를 위한 멀티 레벨 단일 종단 송신기 설계

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·컴퓨터공학부, 2020. 8. 김수환.본 연구에서 메모리 인터페이스를 위한 멀티 레벨 송신기가 제시되었다. 프로세서와 메모리 간의 성능 차이가 매년 계속 증가함에 따라, 메모리는 전체 시스템의 병목점이 되고있다. 우리는 메모리 대역폭을 늘리기 위해 PAM-4 단일 종단 송신기를 제안하였고, 멀티 랭크 메모리를 위한 duobinary 단일 종단 송신기를 제안하였다. 제안된 PAM-4 송신기의 드라이버는 높은 선형성과 임피던스 정합을 동시에 만족한다. 또한 저항이나 인덕터를 사용하지 않아 작은 면적을 차지한다. 제안된 ZQ 캘리브레이션은 세개의 교정 점을 가지고 있어 송신기가 정확한 임피던스와 선형적인 출력을 갖게 한다. 프로토 타입은 65nm CMOS 공정으로 제작되었고 송신기는 0.0333mm2의 면적을 차지한다. 측정된 28Gb/s에서의 eye는 18.3ps의 길이와 42.4mV의 높이를 갖고, 에너지 효율은 0.64pJ/bit이다. ZQ 캘리브레이션과 함께 측정된 RLM은 0.993이다. 메모리의 용량을 늘리기 위해 하나의 패키지에 여러 개의 DRAM 다이를 수직으로 쌓는 패키징은 메모리의 중앙 패드 구조와 결합되어 짧은 반사를 야기하는 스텁을 만든다. 우리는 이 문제를 완화하기위해 반사 기반 duobinary 송신기를 제안했다. 이 송신기는 반사를 이용하여 duobinary signaling을 한다. 2탭 반대 강조 기술과 슬루 레이트 조절 기술이 신호 완결성을 높이기 위해 사용되었다. NRZ eye가 없는 10Gb/s에서 측정된 duobinary eye는 63.6ps 길이와 70.8mV의 높이를 갖는다. 측정된 에너지 효율은 1.38pJ/bit이다.Multi-level transmitters for memory interfaces have been presented. The performance gap between processor and memory has been increased by 50% every year, making memory to be a bottle neck of the overall system. To increase memory bandwidth, we have proposed a PAM-4 single-ended transmitter. To compensate for the side effect of the multi-rank memory, we have proposed a reflection-based duobinary transmitter. The proposed PAM-4 transmitter has the driver, which simultaneously satisfies impedance matching and high linearity. The driver occupies a small area due to a resistorless and inductorless structure. The proposed ZQ calibration for PAM-4 has three calibration points, which allow the transmitter to have accurate impedance and linear output. The ZQ calibration considers impedance variation of both the driver and the receiver. A prototype has been fabricated in 65nm CMOS process, and the transmitter occupies 0.0333mm2. The measured eye has a width of 18.3ps and a height of 42.4mV at 28Gb/s, and the measured energy efficiency is 0.64pJ/b. The measured RLM with the 3-point ZQ calibration is 0.993. To increase memory density, the stacked die packaging with multiple DRAM die stacked vertically in one package is widely used. However, combined with the center-pad structure, the structure creates stubs that cause short reflections. We have proposed the reflection-based duobinary transmitter to mitigate this problem. The proposed transmitter uses reflection for duobinary signaling. The 2-tap opposite FFE and the slew-rate control are used to increase signal integrity. The measured duobinary eye at 10Gb/s has a width of 63.6ps and a height of 70.8mV while there is no NRZ eye opening. The measured energy efficiency is 1.38pJ/bit.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 THESIS ORGANIZATION 8 CHAPTER 2 MUTI-LEVEL SIGNALING 9 2.1 PAM-4 SIGNALING 9 2.2 DESIGN CONSIDERATIONS FOR PAM-4 TRANSMITTER 16 2.2.1 LEVEL SEPARATION MISMATCH RATIO (RLM) 17 2.2.2 IMPEDANCE MATCHING 19 2.2.3 PRIOR ARTS 21 2.3 DUOBINARY SIGNALING 24 CHAPTER 3 HIGH-LINEARITY AND IMPEDANCE-MATCHED PAM-4 TRANSMITTER 30 3.1 OVERALL ARCHITECTURE 31 3.2 SINGLE-ENDED IMPEDANCE-MATCHED PAM-4 DRIVER 33 3.3 3-POINT ZQ CALIBRATION FOR PAM-4 47 CHAPTER 4 REFLECTION-BASED DUOBINARY TRANSMITTER 57 4.1 BIDIRECTIONAL DUAL-RANK MEMORY SYSTEM 58 4.2 CONCEPT OF REFLECTION-BASED DUOBINARY SIGNALING 66 4.3 REFLECTION-BASED DUOBINARY TRANSMITTER 70 4.3.1 OVERALL ARCHITECTURE 70 4.3.2 EQUALIZATION FOR REFLECTION-BASED DUOBINARY SIGNALING 72 4.3.3 2D BINARY-SEGMENTED DRIVER 75 CHAPTER 5 EXPERIMENTAL RESULTS 77 5.1 HIGH-LINEARITY AND IMPEDANCE-MATCHED PAM-4 TRANSMITTER 77 5.2 REFLECTION-BASED DUOBINARY TRANSMITTER 84 CHAPTER 6 92 CONCLUSION 92 BIBLIOGRAPHY 94Docto

Design of Energy-Efficient Equalization and Data Encoding/Decoding Techniques for Wireline Communication Systems

Ever increasing global internet data traffic has driven up the demand for cutting-edge high-speed wireline communication systems including SerDes PHY for various interfaces, interconnects, data centers servers and switches in optical systems. Operating wireline communications at higher data rates leads to signals suffering from greater channel loss and exponential increase in power consumption, mainly caused by a heavier amount of required equalization. In this dissertation, two distinct methodologies for designing SerDes transceivers are presented: 1) a pulse width modulated (PWM) time-domain feed forward equalizer (FFE) and linearity improvement technique for higher-order pulse amplitude modulation (PAM) including PAM-8, and 2) an inter-symbol interference (ISI)-resilient data encoding and decoding technique with Dicode encoding and error correction logic for low-bandwidth wireline channels, as an alternative strategy for communicating in an energy-efficient way on bandwidth-limited wireline channels without using conventional equalizers or filters. The first topic is a PAM-8 wireline transceiver with receiver-side pulse-width-modulated (PWM) or time-domain based feed forward equalization (FFE) technique. The receiver converts voltage-modulated signals or PAM signals to PWM signals and processes them using inverter based delay elements having rail to rail voltage swing. Time-to-voltage and voltage-to-time converters are designed to have non-linearity with opposite signs with the aim of achieving higher front-end linearity on the receiver. The proposed PAM-8 transceiver can operate from 12.0 Gb/s to 39.6 Gb/s and compensates 14 dB loss at 6.6 GHz with an efficiency of 8.66 pJ/bit in 65 nm CMOS. The second topic is an alternative strategy for communicating on bandwidth-limited wireline channels without using conventional equalizers or filters (FFE, DFE, and CTLE): Inter-symbol interference (ISI) resilient Dicode encoding and error correction for low-bandwidth wireline channels. The key observation is that Dicode-encoded data have no consecutive 1s or -1s. With this known information, the error correction logic at the receiver can correct multi-bit errors due to ISI. Implemented in 65 nm CMOS, the proposed digital encoding and decoding approach can achieve BER less than 10−12 while communicating on a channel with an insertion loss of 24.2 dB and 21.4 dB with 2.56 pJ/bit and 2.66 pJ/bit efficiency while operating at 13.6 Gb/s and 16 Gb/s, respectively

Design Challenges of Intra- and Inter- Chiplet Interconnection

In a chiplet-based many-core system, intra- and inter- chiplet interconnection is key to system performance and power consumption. There are a few challenges in intra- and inter- chiplet interconnection network: 1) Fast and accurate simulation is necessary to analyze the performance metrics. 2) Efficient network architecture for inter- and intra- chiplet is necessary, including topology, PHY design and deadlock free routing algorithms, etc. 3) Deep learning based AI systems are demanding more computation power, which calls for the need of efficient and low power chiplet-based systems. This paper proposes network designs to address these challenges and provides future research directions